High Density Interconnect PCB Market Size was valued at USD 5,105. Million in 2022. The High-Density Interconnect PCB market industry is projected to grow from USD 5,197.2 Million in 2023 to USD 21,823.6 Million by 2032, exhibiting a compound annual growth rate (CAGR) of 17.3% during the forecast period (2023 - 2032). HDI is an abbreviation for High Density Interconnector, which is a circuit board with a relatively high line distribution density that employs micro-blind and buried hole technology. It is crucial in enhancing electrical performance and lowering the weight and size of equipment. HDI PCB designs push the boundaries of technology, and key market companies are at the forefront of innovation, meeting the most stringent specifications. The demand for HDI PCB manufacturing has been expanding due to technological breakthroughs and the numerous advantages HDI PCBs provide for high-tech applications. Fitting more technology into less space with fewer layers limits many PCB producers who lack specialised equipment and the ability for advanced features, finer lines, and tighter tolerances. HDI printed circuit board designs make use of sophisticated features such as microvias, blind vias, via-in-pad, stacked and staggered vias to maximise board area while enhancing performance and usefulness.
FIGURE 1: HIGH DENSITY INTERCONNECT PCB MARKET SIZE (USD MILLION) 2018-2032
Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review
COVID-19 has impacted various industries across the globe resulting in travel bans, worldwide lockdowns, and the disruption in the supply chain of various businesses. The semiconductor industry has also been deeply affected by the unprecedented event and witnessed a sharp decline in revenues due to the uncertain positioning of technological devices. Despite the growing uncertainties, semiconductors manufacturers, especially chipmakers, are trying to continue their operations and working on their long-term strategies. Many semiconductor manufacturers are also collaborating with their partners and specific markets with consistent business stability. For instance, while focusing on the health and safety of their employees, semiconductor manufacturers are making efforts in constant research, designs, and manufacturing processes. The urgency for continuing operations has occurred within the semiconductor industry for their end users, including medical and healthcare technologies, such as artificial intelligence (AI), Industry 4.0, and 5G, working to combat the COVID-19 pandemic.
Many PCB manufacturers have been serving clients during the COVID-19 crisis to meet their imminent requirements. The leading PCB manufacturers in the US have been meeting the requirements of their clients across medical and other essential services industries as usual. The company has been operating all the while following OSHA and FDA guidelines with the prescribed work strength. However, that doesn’t mean any compromise on quality or changed deadlines. However, following the pandemic, experts believe that the demand for High Density Interconnect (HDI) PCBs has risen considerably in the healthcare industry. Their applications are extensive in medical devices such as CT scans, defibrillators, MRIs, ultrasonic equipment, medical imaging systems, electrical muscle stimulation equipment, and more.
It is becoming more common to use IoT devices in manufacturing, warehousing, and other industrial settings as industrial automation become more and more sophisticated. HDI technology is used in many of these advanced pieces of equipment. Businesses today use electronic tools to keep track of inventory and monitor equipment performance. Machines are increasingly equipped with smart sensors that collect usage data and communicate with other smart devices, as well as relay information to management and help optimize operations. Like almost everything else, cars are becoming more connected and computerized. The majority of modern cars have around 50 microprocessors, which control the engine, diagnose problems, provide safety features, and do other tasks. There are many advanced features that rely on HDI PCBs, including onboard WiFi and GPS, rearview cameras, and backup sensors. As automotive technology continues to advance, HDI tech will likely play an increasingly important role. In addition to medical devices, HDI PCBs are prominently used in equipment for monitoring, imaging, surgical procedures, laboratory analysis, etc. The use of high-density technology could improve the accuracy and cost-effectiveness of monitoring and medical testing.
5G technology is constantly evolving with new features being added daily. It is therefore important for PCB manufacturers to understand both the raw material requirements and the equipment upgrade requirements. Investing in the R&D of PCB assembly processes to meet 5G requirements can also prove to be a tremendous growth opportunity. Due to its innovative features and robust performance, the 5G network is quickly gaining traction in the consumer sector. With the growing demand for powerful and flexible 5G devices, the PCB industry will expand. PCB assembly providers must, however, support 5G technology by offering tools and processes that are capable of evolving rapidly. In addition to meeting consumer demand and achieving better profits, production facilities that have the tools and processes in place to adapt to technology — instead of lagging behind it — will continue to grow as trends change and coverage expands.
Moreover, PCB boards are used in four areas of communication network construction: wireless networks, transmission networks, data communications, and fixed-line broadband. During the early stages of 5G construction, PCBs were in high demand for wireless networks and transmission networks, especially for backplanes, high-frequency PCB boards, and high-speed multilayer PCBs. A growing number of 5G high-bandwidth business applications, including mobile high-definition video, car networking, and AR / VR, will have a significant impact on the data processing and exchange capability of data centers in the middle and late stages of 5G construction. Within five years, it is expected that domestic data centers will upgrade from 10G to 100G and 400G ultra-large data centers. It will be a time of rapid growth for multilayer electronic circuit boards in the data communications industry.
By Interconnection Layers, the High Density Interconnect (HDI) PCB market has been categorized as 1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, and All Layers HDI. During the projected period, the demand for All Layers HDI segment is expected to grow rapidly.
FIGURE 2: HIGH DENSITY INTERCONNECT PCB MARKET SIZE (USD MN) BY INTERCONNECTION LAYER 2022 VS 2032
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
Based on Application, the High Density Interconnect (HDI) PCB market has been segmented into Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, and Others. During the projected period, the automotive segment is expected to rise rapidly.
FIGURE 2: HIGH DENSITY INTERCONNECT PCB MARKET SIZE (USD MN) BY APPLICATION 2022 VS 2032
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
Geographically, the market is segmented into North America, Europe, Asia-Pacific, Middle East and Africa and South America region.
Asia Pacific  is expected to have a significant share of the High Density Interconnect PCB Market during the projected period.
The increasing use of printed circuit boards in the electronics, aerospace, IT & telecom, industrial, and automotive industries is driving market expansion in terms of value sales. Growing demand for technology, greater investment in R&D by enterprises in countries such as China and Japan, and government backing are some of the drivers driving market expansion. Continuous efforts in printed circuit board R&D to investigate prospective applications in different end use sectors are expected to drive market growth during the projected period. Growing demand for printed circuit boards as a result of increased use of sophisticated devices is expected to drive market expansion during the forecast period. China, for example, has a complicated industrial chain that includes copper foil, glass fibre, resin, copper-clad laminates, and PCBs as its final component. The market has expanded even more as Western countries' desire for Asian consumer electronics has soared. The increased usage of home appliances is also a consequence of the region's expanding disposable income in countries such as China, India, and other South-East Asian countries, which is expected to boost the local market throughout the projection period.
FIGURE 3: HIGH DENSITY INTERCONNECT PCB MARKET SIZE (USD MILLION) BY REGION 2022 VS 2032
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
The Global High Density Interconnect (HDI) PCB Market is witnessed significant growth over the forecast period due to increasing benefits of High density interconnect technology, and rising demand of HDI PCBs in Complex electronic devices. There are several domestic, regional, and global players operating in the High Density Interconnect (HDI) PCB market who continuously strive to gain a significant share of the overall market. During the study, MRFR has analyzed some of the major players in the global High Density Interconnect (HDI) PCB market who have contributed to the market growth. Among these, Compeq Manufacturing Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unimicron, Tripod Technology, and Zhen Ding Tech. Group Technology Holding Limited are among the top 5 players in the global High Density Interconnect (HDI) PCB market. These players focus on expanding and enhancing their product portfolio and services to remain competitive and increase their customer base. Additionally, these players are focusing on partnerships & collaborations to expand their business and customer base to enhance their market position.
June 2022: NCAB acquired 100 percent of the shares in Kestrel International Circuits Ltd from the Merlin PCB Group Ltd. Kestrel is known as a leading source for a wide range of high-quality PCBs and the very highest levels of service for its customers in the Aerospace, Automotive, Medical, Broadcasting, Telecommunications, Industrial and Commercial markets. Kestrel will be included in NCAB Group UK, a division of the NCAB Group's section Europe. Synergies are anticipated in logistics, suppliers, payment terms, and factory management.
July 2022:Â Meiko has acquired NEC Embedded Products, Ltd., Ltd. Meiko Electronics will purchase 403,800 equity shares of NEC Embedded Products, Ltd. as part of the deal. NEC Embedded Products, Ltd. reported sales of $14.03 billion, net assets of $3.61 billion, total assets of $9.98 billion, and an operating loss of 184 million for the year ended March 31, 2022.
September 2021: NCAB Group acquired RedBoard Circuits, LLC, in the USA. RedBoard Circuits will contribute to NCAB Group's objective to take on a leading position in the U.S PCB market.
December 2021: NCAB Group acquired 100 percent of the shares in META Leiterplatten GmbH & CO. KG based in Villingen-Schwenningen in southern Germany. The company provides customers with PCB solutions in the HMLV (High-Mix-Low-Volume) segment, mainly in the industrial, consumer, and medical sectors. Their suppliers are located in China and Taiwan. This enhances the customer base in China and Taiwan.
| Report Attribute/Metric | Details |
| Market Size 2022 | USD 5,105.1 Million |
| Market Size 2023 | USD 5,197.2 Million |
| Market Size 2032 | USD 21,823.6 Million |
| Compound Annual Growth Rate (CAGR) | 17.3% (2023-2032) |
| Base Year | 2022 |
| Forecast Period | 2023-2032 |
| Historical Data | 2018-2022 |
| Forecast Units | Value (USD Million) |
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, and Trends |
| Segments Covered | Interconnection Layers and Application |
| Geographies Covered | North America, Europe, Asia Pacific, Middle East & Africa, and South America |
| Countries Covered | The U.S, Canada, Mexico, Germany, France, UK, China, Japan, India, Australia, South Korea, UAE, and Brazil |
| Key Companies Profiled | Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, Zhen Ding Tech. Group Technology Holding Limited, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd, AT & S (Austria Technologie & Systemtechnik Aktiengesellschaft), Advanced Circuits, and DAP Coroporation. |
| Key Market Opportunities | Technological advancement in HDI PCB 5G technology as a growth opportunity for PCB designers Rising demand for consumer electronics |
| Key Market Dynamics | Increasing benefits of high density interconnect technology Rising demand of HDI PCBs in complex electronic devices Growing demand for circuit miniaturization |
High Density Interconnect PCB Market Highlights:
Frequently Asked Questions (FAQ) :
High Density Interconnect PCB Market is Projected to Reach USD 21,823.6 Million in 2032
The global market is projected to grow at a CAGR of 17.3% during the forecast period, 2023-2032.
From 2023 to 2032, Asia Pacific has the potential to achieve the top position in the global market.
Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, Zhen Ding Tech. Group Technology Holding Limited, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd, AT & S (Austria Technologie & Systemtechnik Aktiengesellschaft), Advanced Circuits, and DAP Coroporation.
Team Lead - Research she holds an experience of about 6+ years in market research and business consulting, working under the spectrum of information communication technology, telecommunications and semiconductor domains. aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.
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