High Density Interconnect PCB Market Research Report – Global Forecast till 2027

High Density Interconnect PCB Market Research Report, By Number of Number of High-Density Interconnection Layer (1, 2 or more, all), Industry Vertical (consumer electronics, military and defense, telecom and IT, automotive) — Global Forecast till 2027

ID: MRFR/SEM/5821-HCR | February 2021 | Region: Global | 100 pages

Please note that the assessment period of report has been updated from 2018-2023 to 2020-2027. Cordially fill Sample form for updated data.

Market Synopsis


Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market is expected to grow from USD 8,683.9 million in 2018 to USD 15,600.6 million by 2023, at a CAGR of 12.4% during the forecast period, 2018–2013.


HDI PCB have a higher circuitry density than a traditional PCB, which means it allows designers to place more components on an HDI PCB. Shorter distance between the electronic components and smaller size of the components help in reduced signal loss and crossing delays, resulting into faster transmission of signals from one part to another.


The increasing need for smaller, energy-efficient, and high-performance PCBs acts as the major driving factor for the growth of HDI PCB market globally. This has helped the overall electronics industry to produce smarter, lighter, faster, and smaller products. For instance, in the last two decades, the cellular mobile phone market has experienced tremendous innovation, from simple monochromic display and basic voice call capability to feature rich computing device with high-resolution touch screen, camera, fast internet connectivity, GPS, music player, and many more.  Similarly, heavy desktop computers during 1990s are now advanced to faster and smaller laptops with the help of HDI PCBs. Despite major developments, the high cost associated with manufacturing and lack of expertise in manufacturing are hampering the market growth.


Although, HDI PCB are used in multiple industries but some of its prominent industry verticals include consumer electronics, telecom and IT, manufacturing, automotive, and medical devices. The consumer electronics industry vertical is the largest contributor in the HDI PCB Market due to the wide adoption of HDI PCBs in the computing and smartphone market segments whereas automotive market segment is expected to grow with the highest CAGR during the forecast period due to increasing digitalization of cars and its advancement towards autonomous and connected cars.


Global HDI PCB Market


Source: MRFR Analysis


Segmentation.


The global HDI PCB Market is segmented into number of high-density interconnection layer, industry vertical, and regions/country.


By number of high density interconnection layer, the market is segmented into 1, 2, and all.


By industry vertical, the market is segmented into consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and others.


By region, the market is segmented into North America, Europe, Asia-Pacific, and rest of the world.


Regional Analysis


The global market for HDI PCB is estimated to grow at a significant rate during the forecast period from 2018 to 2023. The geographical analysis of global HDI PCB Market is studied for North America, Europe, Asia-Pacific, and rest of the world.


North America is expected to dominate the HDI PCB market during the forecast period. North America region is considered as most advanced region in terms of development and adoption of innovative technologies in the field of semiconductors. The region has a huge potential for revenue generation in the HDI PCB market, particularly from automotive and consumer electronics industry verticals. US is expected to be the dominating country in the HDI PCB market in North America region during the forecast period.


Asia-Pacific is expected to grow at the fastest rate during the forecast period. Availability of low cost technologies and presence of many electronic devices manufacturing firms in the region are some of the driving factors for the HDI PCB market in the region. China, Japan, and India have been the leading countries in the Asia-Pacific region in terms of market share and this trend is expected to continue in the upcoming years.


Competitive Analysis


The HDI PCB market offers tremendous new opportunity as well as intense competiton. The nature of the electronics industry creates a competitive landscape that is continuously evolving, emerging, and expanding. To meet the dynamic requirements of the customers, the major vendors are majorly focusing on new product development through increased investments in research & development (R&D) activities or through acqusitions. According to the latest trends in the HDI PCB market, more number of acquisitions are expected in the market


Key players


The prominent players in HDI PCB Market are Epec, LLC (US), TTM Technologies (US), PCBCART (China), Millennium Circuits Limited (US), RAYMING (China), Mistral Solutions Pvt. Ltd. (India), SIERRA CIRCUITS, INC. (US), Advanced Circuits (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), FINELINE Ltd. (Israel), and Austria Technologie & Systemtechnik Aktiengesellschaft (Austria).


Intended Audience



  • HDI PCB manufacturers

  • Electronic product manufacturers

  • Resellers and Distributors

  • Standard Making Bodies and Associations

  • Automotive and Manufacturing Industries

  • Custom electronic product developers



Frequently Asked Questions (FAQ) :


SIERRA CIRCUITS, INC. (US), Mistral Solutions Pvt. Ltd. (India), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), Advanced Circuits (US), FINELINE Ltd. (Israel), and Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) are a few of the candidates in the market.

A CAGR of 12.4 % is predicted to stimulate the market in the coming period.

The North American region is surging due to the implementation of advanced technologies in the field of semiconductors.

The segments in the market are industry vertical, high-density interconnection layer, and regions.

The demand for energy-efficient, smaller, and high-performance PCBs is the significant driving factor for market growth.

Table of Contents

1 Executive Summary

2 Market Introduction

2.1 Definition

2.2 Scope of the Study

2.3 List of Assumptions

2.4 Market Structure

3 Market Insights

4 Research Methodology

4.1 Research Process

4.2 Primary Research

4.3 Secondary Research

4.4 Market Size Estimation

4.5 Forecast Model

5 Market Outlook

5.1 Introduction

5.2 Market Dynamics

5.2.1 Drivers

5.2.2 Restraints

5.2.3 Opportunities

5.2.4 Challenges

5.3 Value Chain Analysis

5.4 Porter’s Five Forces Model

5.4.1 Threat of New Entrants

5.4.2 Bargaining Power of Suppliers

5.4.3 Bargaining Power of Buyers

5.4.4 Threat of Substitutes

5.4.5 Intensity of Rivalry


6 Global High-Density Interconnect PCB Market, By Number of High Density Interconnection Layer

6.1 Overview

6.2 1

6.2.1 Market Estimates & Forecast, 2020-2027

6.2.2 Market Estimates &Forecast, By Region/Country, 2020-2027

6.3 2 or more

6.3.1 Market Estimates & Forecast, 2020-2027

6.3.2 Market Estimates &Forecast, By Region/Country, 2020-2027

6.4 All

6.4.1 Market Estimates & Forecast, 2020-2027

6.4.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7 Global High-Density Interconnect PCB Market, By Industry Vertical

7.1 Overview

7.2 Consumer Electronics

7.2.1 Market Estimates & Forecast, 2020-2027

7.2.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7.3 Military and Defense

7.3.1 Market Estimates & Forecast, 2020-2027

7.3.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7.4 Telecom and IT

7.4.1 Market Estimates & Forecast, 2020-2027

7.4.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7.5 Automotive

7.5.1 Market Estimates & Forecast, 2020-2027

7.5.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7.6 Manufacturing

7.7.1 Market Estimates & Forecast, 2020-2027

7.7.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7.7 Medical Devices

7.7.1 Market Estimates & Forecast, 2020-2027

7.7.2 Market Estimates &Forecast, By Region/Country, 2020-2027

7.8 Others

7.8.1 Market Estimates & Forecast, 2020-2027

7.8.2 Market Estimates &Forecast, By Region/Country, 2020-2027

8 High-Density Interconnect PCB Market, By Region

8.1 Overview

8.2 North America

8.2.1 Market Estimates & Forecast, By Country, 2020-2027

8.2.2 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.2.3 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.2.4 U.S.

8.2.4.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.2.4.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.2.5 Canada

8.2.5.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.2.5.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.2.6 Mexico

8.2.6.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.2.6.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.3 Europe

8.3.1 Market Estimates & Forecast, By Country, 2020-2027

8.3.2 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.3.3 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.3.4 Germany

8.3.4.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.3.4.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.3.5 UK

8.3.5.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.3.5.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.3.6 France

8.3.6.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.3.6.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.3.7 Rest of Europe

8.3.7.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.3.7.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.4 Asia Pacific

8.4.1 Market Estimates & Forecast, By Country, 2020-2027

8.4.2 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.4.3 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.4.4 China

8.4.4.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.4.4.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.4.5 Japan

8.4.5.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.4.5.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.4.6 India

8.4.6.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.4.6.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.4.7 Rest of Asia Pacific

8.4.7.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.4.7.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.5 Rest of the World

8.5.1 Market Estimates & Forecast, By Country, 2020-2027

8.5.2 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.5.3 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.5.4 Middle East and Africa

8.5.4.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.5.4.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

8.5.5 Latin America

8.5.5.1 Market Estimates & Forecast, By Number of High-Density Interconnection Layer, 2020-2027

8.5.5.2 Market Estimates & Forecast, By Industry Vertical, 2020-2027

9 Competitive Landscape

9.1 Competitive Scenario

9.1.1 Competitive Benchmarking of the High-Density Interconnect PCB Market

10 Company Profiles

10.1 Epec, LLC

10.1.1 Company Overview

10.1.2 Financial Overview

10.1.3 Product Offerings

10.1.4 Key Developments

10.1.5 SWOT Analysis

10.1.6 Key Strategy

10.2 TTM Technologies

10.2.1 Company Overview

10.2.2 Financial Overview

10.2.3 Product Offerings

10.2.4 Key Developments

10.2.5 SWOT Analysis

10.2.6 Key Strategy

10.3 PCBCART

10.3.1 Company Overview

10.3.2 Financial Overview

10.3.3 Product Offerings

10.3.4 Key Developments

10.3.5 SWOT Analysis

10.3.6 Key Strategy

10.4 Millennium Circuits Limited

10.4.1 Company Overview

10.4.2 Financial Overview

10.4.3 Product Offerings

10.4.4 Key Developments

10.4.5 SWOT Analysis

10.4.6 Key Strategy

10.5 RAYMING

10.5.1 Company Overview

10.5.2 Financial Overview

10.5.3 Product Offerings

10.5.4 Key Developments

10.5.5 SWOT Analysis

10.5.6 Key Strategy

10.6 Mistral Solutions Pvt. Ltd.

10.6.1 Company Overview

10.6.2 Financial Overview

10.6.3 Product Offerings

10.6.4 Key Developments

10.6.5 SWOT Analysis

10.6.6 Key Strategy

10.7 SIERRA CIRCUITS, INC.

10.7.1 Company Overview

10.7.2 Financial Overview

10.7.3 Product Offerings

10.7.4 Key Developments

10.7.5 SWOT Analysis

10.7.6 Key Strategy

10.8 Advanced Circuits

10.8.1 Company Overview

10.8.2 Financial Overview

10.8.3 Product Offerings

10.8.4 Key Developments

10.8.5 SWOT Analysis

10.8.6 Key Strategy

10.9 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

10.9.1 Company Overview

10.9.2 Financial Overview

10.9.3 Product Offerings

10.9.4 Key Developments

10.9.5 SWOT Analysis

10.9.6 Key Strategy

10.10 FINELINE Ltd.

10.10.1 Company Overview

10.10.2 Financial Overview

10.10.3 Product Offerings

10.10.4 Key Developments

10.10.5 SWOT Analysis

10.10.6 Key Strategy

10.11 Austria Technologie & Systemtechnik Aktiengesellschaft

10.11.1 Company Overview

10.11.2 Financial Overview

10.11.3 Product Offerings

10.11.4 Key Developments

10.11.5 SWOT Analysis

10.11.6 Key Strategy


LIST OF TABLES

Table1 Global High-Density Interconnect PCB Market, By Region, 2020-2027

Table2 North America High-Density Interconnect PCB Market, By Country, 2020-2027

Table3 Europe High-Density Interconnect PCB Market, By Country, 2020-2027

Table4 Asia-Pacific High-Density Interconnect PCB Market, By Country, 2020-2027

Table5 Rest of the World High-Density Interconnect PCB Market, By Country, 2020-2027

Table6 North America High-Density Interconnect PCB Market, By Industry Vertical, By Country, 2020-2027

Table7 Europe High-Density Interconnect PCB Market, By Industry Vertical, By Country, 2020-2027

Table8 Asia-Pacific High-Density Interconnect PCB Market, By Industry Vertical, By Country, 2020-2027

Table9 Rest of the World High-Density Interconnect PCB Market, By Industry Vertical, By Country, 2020-2027


LIST OF FIGURES

FIGURE 1 Global High-Density Interconnect PCB Market: Segmentation

FIGURE 2 Forecast Methodology

FIGURE 3 Porter’s Five Forces Analysis of Global High-Density Interconnect PCB Market

FIGURE 4 Value Chain of Global High-Density Interconnect PCB Market

FIGURE 5 Share of Global High-Density Interconnect PCB Market by Country, 2020

FIGURE 6 Global High-Density Interconnect PCB Market, 2020-2027

FIGURE 7 Global High-Density Interconnect PCB Market Size, By Industry Vertical, 2020 TO 2027

FIGURE 8 Share of Global High-Density Interconnect PCB Market, By Industry Vertical, 2020

FIGURE 9 North America High-Density Interconnect PCB Market Size, By Industry Vertical, 2020 TO 2027

FIGURE 10 Share of North America High-Density Interconnect PCB Market, By Industry Vertical, 2020

FIGURE 11 Europe High-Density Interconnect PCB Market Size, By Industry Vertical, 2020 TO 2027

FIGURE 12 Share of Europe High-Density Interconnect PCB Market, By Industry Vertical, 2020

FIGURE 13 Asia-Pacific High-Density Interconnect PCB Market Size, By Industry Vertical, 2020 TO 2027

FIGURE 14 Share of Asia-Pacific High-Density Interconnect PCB Market, By Industry Vertical, 2020

FIGURE 15 Rest of the World High-Density Interconnect PCB Market Size, By Industry Vertical, 2020 TO 2027

FIGURE 16 Share of Rest of the World High-Density Interconnect PCB Market, By Industry Vertical, 2020