Chip On Flex Market Research Report - Global Forecast to 2027

Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Forecast 2027

ID: MRFR/SEM/1483-CR | January 2017 | Region: Global | 100 Pages         

Chip on Flex Market

The Global Chip on Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2022, at an estimated CAGR of 4.43%.

Segmentation

By Type Single Sided Chip On Flex Others
By Application Static Dynamic
By Verticals Military Medical Aerospace Electronics

Key Players

  • LGIT corporation (U.S.)
  • Stemko group(Korea)
  • Flexceed(Japan)
  • Chipbond technology corporation(Taiwan)
  • CWE(Taiwan)
  • Danbond technology co. ltd.(China)
  • AKM industrial company ltd.(China)
  • compass technology company limited(Hong Kong)
  • Compunetics(U.S.)
  • Stars microelectronics public company ltd (Thailand)

Drivers

  • Increasing need for small and flexible electronics in various applications
  • The rapid technological advancements which lead to accurate designs and automated production
Speak to Analyst Request a Free Sample

Market Synopsis of Global Chip on Flex Market:


Market Scenario:


Chip-on-Flex refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit which is a circuit built on a flexible substrate instead of the usual printed circuit board. The shorter interconnection paths on chip on flex simplifies the process of designing and manufacturing the product and improving its performance.  Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others. The major drivers for the growth of this market are increasing need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification among others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses. With the use of these flexible circuit board companies ensure the 100% efficiency in the products, due to which level of fault ratio is drastically reduced. Flex chips help in reducing the cost, improving operator ergonomics, amplified product quality and testing repeatability.


The Global Chip-on-Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2022, at an estimated CAGR of 4.43%. The growth of this market can be constrained by the increased cost of raw materials in related industries like the electronic industry along with the wide variety of technology used and the consumer needs changing to efficient, cheaper and powerful consumer electronics and mobile technologies.


Study Objectives of Global Chip on Flex (COF) Market:



  • To provide detailed analysis of the market structure along with forecast of the various segments and sub-segments of the global chip on flex market.

  • To provide insights about factors affecting the market growth.

  • To analyze the global chip on flex market based porter’s five force analysis etc.

  • To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW).

  • To provide country level analysis of the market with respect to the current market size and future prospective.

  • To provide country level analysis of the market for segment by types, applications and verticals.

  • To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market.

  • To track and analyze competitive developments such as joint ventures, strategic alliances, mergers and acquisitions, new product developments, and research and developments in the Global chip on flex Market.


Key Finding:



  • The Global Chip on Flex Market is expected to reach USD 1795 million by 2021.

  • Europe accounts for the largest market share and is growing with a market share of USD 494 million during forecast period.

  • China accounts highest production capacity in the year 2016

  • Global Chip on flex is segmented by type that includes single sided COF and Others. Out of which single sided COF captures 94.43% of market share.


Key Players 
The prominent players in the market of chip on flex (COF) market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.


Segments:


The Global chip on flex Market has been segmented on the basis of types, applications and verticals. The types of chip on flex are one sided chip on flex and others. The COF applications comprises of static and dynamic flexing. The various verticals of chip on flex market are military, medical, aerospace, electronics and others.


Regional Analysis


The regional analysis of chip on flex market is being studied for areas such as Asia pacific, North America, Europe and rest of the world. Asia pacific is expected to record highest growth rate owing to existence of large number of chip on flex manufacturers in china like Danbond Technology, AKM Industrial, Compass Technology Company and others.  Asia pacific will be followed by North America owing to increased adoption of new technologies especially in automobile sector.  American depository of shares is also helping in mergers of various organizations to enhance the production capabilities in chip on flex market.  Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market.


Intended Audience



  • COF manufactures

  • Industries such as aerospace, automotive, IT, industrial, and medical, among others

  • Government institutions

  • Research institutions

  • Adhesive manufacturers

  • Conductor and insulator manufacturers like silver, copper and others



Report Scope:
Report Attribute/Metric Details
  Market Size   USD 1795 Million
  CAGR   4.43%
  Base Year   2019
  Forecast Period   2020-2027
  Historical Data   2019
  Forecast Units   2018
  Report Coverage   Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
  Segments Covered   Type, Application, Verticals
  Geographies Covered   North America, Europe, Asia-Pacific, and Rest of the World (RoW)
  Key Vendors   LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand)
  Key Market Opportunities   The rapid adoption of modern technologies in automobile sector.
  Key Market Drivers

  • Increasing need for small and flexible electronics in various applications.
  • The rapid technological advancements which lead to accurate designs and automated production


  • Speak to Analyst Ask for Customization

    Frequently Asked Questions (FAQ) :

    A CAGR of 94.43% has been calculated for the Global Chip on flex’s growth in the future.

    Europe has been regarded as the most significant region for market share and is growing with a market share of USD 1795 million by 2022.

    The activities such as joint ventures, mergers and acquisitions, new product developments, and research and developments has helped global Chip on flex market maintained its growth graph.

    Stemko group(Korea), Flexceed(Japan), LGIT corporation (U.S.), Chipbond technology corporation(Taiwan), CWE(Taiwan) are the top names of key players.

    The segments such as types, applications and verticals are mentioned in the market study for Global Chip on flex.