Chip On Flex (COF) companies focus on the integration of semiconductor chips onto flexible printed circuit boards (FPCBs). COF technology is commonly used in display panels, sensors, and other applications where flexibility and miniaturization are essential.
*Disclaimer: List of key companies in no particular order
The Competitive Landscape of the Chip On Flex Market
The Chip-on-Flex (COF) market, is where silicon dances gracefully on flexible substrates, orchestrating a ballet of miniaturization and performance in modern electronics. Navigating this dynamic terrain requires a clear understanding of the strategies, factors, and players shaping the competitive landscape. Understanding the competitive landscape in this dynamic market requires a nuanced perspective on the strategies, factors, players, and trends that shape its growth trajectory.
Some of the Chip on Flex companies are listed below:
Strategies Adopted by Leaders
Factors for Market Share Analysis:
New and Emerging Companies:
Industry Developments:
On Dec.13, 2022- Videantis GmbH, a unified platform provider, announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. Videantis' unified platform is used for the combined processing of diverse algorithms, such as Artificial Intelligence (AI), multi-modal sensor data processing & fusion, or video coding on a single architecture.
On Sep.22, 2022- Qualcomm unveiled the Snapdragon Ride Flex SoC at Auto Investor Day. The Snapdragon Ride Flex System-on-Chip super-compute family is designed for carmakers looking to integrate sensing and other functions for digital cockpit, automated driving, autonomous driving, networking, and computer vision.
Qualcomm's Snapdragon Ride Flex SoC (System-on-Chip) will power digital cockpit features, like multiple integrated displays & voice technology, advanced driver assistance systems & autonomous driving. The production of Snapdragon Ride Flex SoC is set to start in 2024, and it is likely to arrive in vehicles in the following years.
On Oct. 26, 2022- Flex Logix Technologies announced that it is licensing its InferX machine learning and AI technology, running on its embedded FPGA blocks implemented in customer chips for the first time. Device manufacturers and systems companies who design chips can now license Flex Logix's InferX AI technology for AI inference. Available in early 2023, Flex Logix's InferX AI technology will provide broader access to the company's eFPGA and edge inference IP solutions.
On Mar. 22, 2021- Flex Logix Technologies, a startup designing reconfigurable AI accelerator chips, announced raising US$55 MN to design AI chips for edge enterprise applications. This funding round led by Mithril Capital Management will enable the company to build out its software, engineering, and customer support teams to accelerate the availability of its hardware and software solutions for edge enterprise applications.
Chip-on-Flex refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit which is a circuit built on a flexible substrate instead of the usual printed circuit board. The shorter interconnection paths on chip on flex simplifies the process of designing and manufacturing the product and improving its performance. Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others. The major drivers for the growth of this market are increasing need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification among others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses. With the use of these flexible circuit board companies ensure the 100% efficiency in the products, due to which level of fault ratio is drastically reduced. Flex chips help in reducing the cost, improving operator ergonomics, amplified product quality and testing repeatability.
The Global Chip-on-Flex Market Size is expected to grow from US ~$1437 Million in 2016 to USD 1,868.63 Million by 2030, at an estimated CAGR of 3.7% . The Chip on Flex market growth can be constrained by the increased cost of raw materials in related industries like the electronic industry along with the wide variety of technology used and the consumer needs changing to efficient, cheaper and powerful consumer electronics and mobile technologies.
The Global chip on flex Market has been segmented on the basis of types, applications and verticals.Â
The types of chip on flex are one sided chip on flex and others.Â
The COF applications comprises of static and dynamic flexing.Â
The various verticals of chip on flex market are military, medical, aerospace, electronics and others.
The regional analysis of chip on flex market is being studied for areas such as Asia pacific, North America, Europe and rest of the world. Asia pacific is expected to record highest growth rate owing to existence of large number of chip on flex manufacturers in china like Danbond Technology, AKM Industrial, Compass Technology Company and others. Â Asia pacific will be followed by North America owing to increased adoption of new technologies especially in automobile sector. Â American depository of shares is also helping in mergers of various organizations to enhance the production capabilities in chip on flex market. Â Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market.
Chip On Flex Market Highlights:
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