Wi-Fi Chipset Market Research Report - Global Forecast till 2027

Wi-Fi Chipset Market Research Report: By Type (Mobile Wi-Fi, Industrial Wi-Fi and others), Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator (SOI) and Sige), Die Size (28nm, 20nm, 14nm, 10nm and others), Application (Smartphone, Tablets PC and others) - Forecast till 2027

ID: MRFR/SEM/2017-CR | February 2020 | Region: Global | 182 pages

Market Summary


Global Wi-Fi Chipset Market is expected to register a 6.02% CAGR, registering substantial growth during the forecast period. The market was valued at USD 18,153.6 Million in 2018; it is expected to reach USD 27,183.7 Million by 2025. North America accounted for the largest market value of USD 6,833.8 Million in 2018; the market is expected to register a CAGR of 5.65% during the forecast period.


A wireless chipset is a hardware component or a system-on-chip (SoC) that allows a device to communicate with another wireless device. Hardware components such as external wireless local area network (WLAN) cards or WLAN adapters make extensive use of wireless (Wi-Fi) chipset. The Wi-Fi chipset is used in several applications such as smartphones, personal computers, and laptops. The Wi-Fi chipset is often available in three operating bands—single, dual, and tri bands. Developments in computer-aided systems, wearable technology, the Internet of Things (IoT), automation technologies are some of the major factors fueling the growth of the global Wi-Fi chipset market.


Global Wi-Fi Chipset Market, by Type (2018 Vs 2025)  Wi-Fi Chipset Market


Source: MRFR Analysis


Based on type, the market has been classified as mobile Wi-Fi, industrial Wi-Fi, and others. The mobile Wi-Fi segment accounted for the largest market share in 2018, with a market value of USD 10,331.8 million, and it is expected to register the highest CAGR during the forecast period. Mobile Wi-Fi is a pocket-sized wireless device that creates its own Wi-Fi hotspot whenever needed and connects multiple wireless gadgets to the Internet; it is also called Mi-Fi. There are two types of mobile Wi-Fi hotspots—the small ones can support a few hours of activity, while the larger and high-tech hotspots can be connected to a device for a whole day. Industrial Wi-Fi is a set of connected devices. These networks are set up for machines to communicate directly with each other through an access point.


Chipsets are designed to work with a specific family of microprocessors. These components control communications between the processor and an external device. In this rapidly progressing environment, the growing demand for high-power electronic products and increasing integration of Wi-Fi into homes and enterprises are contributing to the growth of the electronic industry resulting in a positive growth of the Wi-Fi chipset market. The study also indicates that the manufacturing and automotive industries would expect a substantial increase in Wi-Fi chipsets due to rising demand for miniaturization and automation. The recent news tells us that Qualcomm’s new 205 chipsets will bring Wi-Fi, Bluetooth 4.1, LTE to feature phones. Qualcomm has realized a potential that can be tapped in phones using power chipsets.


Regional Analysis


The Global Wi-Fi Chipset Market, by region, has been segmented into North America, Europe, Asia-Pacific, Middle East & Africa, and South America. North America region is expected to dominate the Wi-Fi chipset market during the forecast period due to an already established infrastructure and increasing ownership of Wi-Fi-enabled smartphones and tablets in this region.


Companies Covered


The Key Players of the Global Wi-Fi Chipset Market are Qualcomm Technologies Inc. (US), Mediatek Inc. (Taiwan), Intel Corporation (US), STMicroelectronics NV (Switzerland), Cypress Semiconductor Corporation (US), Taiwan Semiconductor Manufacturing Co Ltd (Taiwan), Global Foundries (US), Broadcom Inc (US), Marvell Technology Group Ltd (Bermuda), On Semiconductor (Quantenna Communications Inc) (US), Peraso Technologies, Inc. (Canada), Texas Instruments Inc. (US), Samsung Electronics Co Ltd. (South Korea) and United Microelectronics Corporation (Taian).


Key Developments 



  • In August 2019, Qualcomm Technologies Inc. launched Qualcomm Networking Pro Series and Qualcomm FastConnect 6800 Subsystem. These series are based on new chip architecture and help in the adoption of WiFi 6.



  • In July 2019, MediaTek Inc. launched two new gaming-grade system-on-chip, Helio G90, and G90T. These chips can detect the degrading quality of Wi-Fi and automatically switch to an LTE connection.



  • In December 2018, Intel Corporation launched a B365 chipset made using the 22 nm fabrication process. It supports hardware RAID for PCIe and SATA storage devices.



  • In July 2018, In contract with Pioneer Corporation, a leading provider of digital products, Cypress Semiconductor Corporation provided Wi-Fi and Bluetooth Combo Solution for in-vehicle infotainment systems. The AVH-W8400NEX receiver of Pioneer used the CYW89359 combo solution provided by Cypres.


Segmentation



  • By Type: Mobile Wi-Fi, Industrial Wi-Fi, and Others



  • By Fabrication Technology: FinFET, Fdsoi Cmos, Silicon on Insulator (SOI) and Sige



  • By Die Size: 28nm, 20nm, 14nm, 10nm, and Others



  • By Application: Smartphone, Tablets, PC, and Others



  • By Region: North America, Asia-Pacific, Europe, Middle East & Africa, and South America


Key questions addressed by the report



  • What was the historic market size (2018)?

  • Which segmentation (Component / Solution/ Industry) is driving the market?

  • What will be the growth rate by 2025?

  • Who are the key players in this market?

  • What are the strategies adopted by key players?



Report Scope:
Report Attribute/Metric Details
  Market Size   USD 27,183.7 Million
  CAGR   6.02%
  Base Year   2019
  Forecast Period   2020-2027
  Historical Data   2018
  Forecast Units   Value (USD Million)
  Report Coverage   Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
  Segments Covered   Type, Fabrication Technology, Die Size, Application
  Geographies Covered   North America, Europe, Asia-Pacific, and Rest of the World (RoW)
  Key Vendors   Qualcomm Technologies Inc. (US), Mediatek Inc. (Taiwan), Intel Corporation (US), STMicroelectronics NV (Switzerland), Cypress Semiconductor Corporation (US), Taiwan Semiconductor Manufacturing Co Ltd (Taiwan), Global Foundries (US), Broadcom Inc (US), Marvell Technology Group Ltd (Bermuda), On Semiconductor (Quantenna Communications Inc) (US), Peraso Technologies, Inc. (Canada), Texas Instruments Inc. (US), Samsung Electronics Co Ltd. (South Korea) and United Microelectronics Corporation (Taian)
  Key Market Opportunities   Use of Wi-Fi Technology in indoor and outdoor location systems.
  Key Market Drivers

  • Developments in computer-aided systems.
  • Developments in computer-aided systems, wearable technology, the Internet of Things (IoT), automation technologies


  • Frequently Asked Questions (FAQ) :


    The Wi-Fi chipset market recorded a valuation of USD 6,833.8 Million in 2018.

    The global Wi-Fi Chipset Market regionally segments into North America, Europe, Asia-Pacific, Middle East & Africa, and South America.

    North America region is ready to lead the Wi-Fi chipset market during the assessment period.

    The factors are automation technologies, wearable technology, the Internet of Things (IoT), and developments in computer-aided systems. These are fueling the growth of the global Wi-Fi chipset market.

    6.02% CAGR has been recorded for the growth of Wi-Fi Chipset in the assessment period.