Wi-Fi Chipset Market Research Report - Global Forecast till 2027

Wi-Fi Chipset Market Research Report: By Type (Mobile Wi-Fi, Industrial Wi-Fi and others), Fabrication Technology (FinFET, FDSOI CMOS, Silicon On Insulator (SOI) and Sige), Die Size (28nm, 20nm, 14nm, 10nm and others), Application (Smartphone, Tablets PC and others) - Forecast till 2027

ID: MRFR/SEM/2017-CR | February 2020 | Region: Global | 182 Pages         

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Wi-Fi Chipset Market

Wi-Fi Chipset Market is predicted to touch USD 27,183.7 Million by 2025, at a 6.02% CAGR forecast Till 2027

Segmentation
By Type Wi-Fi Industrial Wi-Fi
By Fabrication Technology FinFET Fdsoi Cmos Silicon on Insulator (SOI) Sige
By Die Size 28nm 20nm 14nm 10nm
By Application Smartphone Tablets PC
Key Players
Companies Profiled   Qualcomm Technologies Inc. (US)    Mediatek Inc. (Taiwan)    Intel Corporation (US)    STMicroelectronics NV (Switzerland)    Cypress Semiconductor Corporation (US)    Taiwan Semiconductor Manufacturing Co Ltd (Taiwan)    Global Foundries (US)    Broadcom Inc (US)    Marvell Technology Group Ltd (Bermuda)    On Semiconductor (Quantenna Communications Inc) (US)    Peraso Technologies Inc. (Canada)    Texas Instruments Inc. (US)    Samsung Electronics Co Ltd. (South Korea)    United Microelectronics Corporation (Taian)
Drivers
Market Driving Forces   Developments in computer-aided systems   Developments in computer-aided systems    wearable technology    the Internet of Things (IoT)    automation technologies
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Wi-Fi Chipset Market Size and Report Overview


Globally, the size of the Wi-Fi Chipset Market is set to grow at a CAGR of 6.02%from a value of USD 18,153.6 Million in 2018 to hit USD 27,183.7 Million by 2027 driven by the developments in computer-aided systems, wearable technology, Internet of Things (IoT) and automation technologies. North America represented the biggest market worth USD 6,833.8 Million in 2018; the market is supposed to enroll a CAGR of 5.65% during the figure time frame.


A remote chipset is an equipment part or a framework on-chip (SoC) that permits a gadget to speak with another remote gadget. Equipment parts, for example, Wireless LAN (WLAN) cards or WLAN connectors utilize remote (Wi-Fi) chipsets.


The Wi-Fi chipset is utilized in a few applications, for example, cell phones, PCs, and workstations. The Wi-Fi chipset is in many cases accessible in three working groups — single, double, and tri groups. Advancements in PC-helped frameworks, wearable innovation, the Internet of Things (IoT), and computerization innovations are a portion of the central point filling the development of the worldwide Wi-Fi chipset industry.


Wi-Fi Chipset Market Segmentation Analysis


Based on type, the Wi-Fi Chipset Market has been classified as mobile Wi-Fi, industrial Wi-Fi, and others. The mobile Wi-Fi segment accounted for the largest market share in 2018, with a Wi-Fi Chipset industry value of USD 10,331.8 million, and it is expected to register the highest CAGR during the forecast period. Mobile Wi-Fi is a pocket-sized wireless device that creates its own Wi-Fi hotspot whenever needed and connects multiple wireless gadgets to the Internet; it is also called Mi-Fi. There are two types of mobile Wi-Fi hotspots—the small ones can support a few hours of activity, while the larger and high-tech hotspots can be connected to a device for a whole day. Industrial Wi-Fi is a set of connected devices. These networks are set up for machines to communicate directly with each other through an access point.


Chipsets are designed to work with a specific family of microprocessors. These components control communications between the processor and an external device. In this rapidly progressing environment, the growing demand for high-power electronic products and increasing integration of Wi-Fi into homes and enterprises are contributing to the growth of the electronic industry resulting in a positive growth of the Wi-Fi chipset market. The study also indicates that the manufacturing and automotive industries would expect a substantial increase in Wi-Fi chipsets due to rising demand for miniaturization and automation. The recent news tells us that Qualcomm’s new 205 chipsets will bring Wi-Fi, Bluetooth 4.1, and LTE to feature phones. Qualcomm has realized a potential that can be tapped into phones using power chipsets.


Wi-Fi Chipset Market Regional Insights


The Global Wi-Fi Chipset Market, by region, the Wi-Fi Chipset industry has been segmented into North America, Europe, Asia-Pacific, Middle East & Africa, and South America. North America region is expected to dominate the Wi-Fi chipset market during the forecast period due to an already established infrastructure and increasing ownership of Wi-Fi-enabled smartphones and tablets in this region.


Key Players and Market Share Insights


The Key Players of the Global Wi-Fi Chipset industry are Qualcomm Technologies Inc. (US), Mediatek Inc. (Taiwan), Intel Corporation (US), STMicroelectronics NV (Switzerland), Cypress Semiconductor Corporation (US), Taiwan Semiconductor Manufacturing Co Ltd (Taiwan), Global Foundries (US), Broadcom Inc (US), Marvell Technology Group Ltd (Bermuda), On Semiconductor (Quantenna Communications Inc) (US), Peraso Technologies, Inc. (Canada), Texas Instruments Inc. (US), Samsung Electronics Co Ltd. (South Korea) and United Microelectronics Corporation (Taian).


Key Developments 


August 2019


In August 2019, Qualcomm Technologies Inc. sent off Qualcomm Networking Pro Series and Qualcomm Fast Connect 6800 Subsystem. These series depend on new chip designs and help in the reception of Wi-Fi 6.


July 2019


In July 2019, MediaTek Inc. sent off two new gaming-grade frameworks on-chip, Helio G90, and G90T. These chips can distinguish the corrupting nature of Wi-Fi and naturally change to an LTE association.


December 2018


In December 2018, Intel Corporation sent off a B365 chipset made utilizing the 22 nm creation process. It upholds equipment RAID for PCIe and SATA stockpiling gadgets.


July 2018


In July 2018, In agreement with Pioneer Corporation, the main supplier of computerized items, Cypress Semiconductor Corporation gave Wi-Fi and Bluetooth Combo Solution for in-vehicle infotainment frameworks. The AVH-W8400NEX beneficiary of Pioneer utilized the CYW89359 combo arrangement given by Cypress.


Market Segmentation Outlook


By Type Outlook (Revenue, USD Million, 2020-2027)



  • Mobile Wi-Fi

  • Industrial Wi-Fi

  • Others


By Fabrication Technology Outlook (Revenue, USD Million, 2020-2027)



  • FinFET

  • Fdsoi Cmos

  • Silicon on Insulator (SOI)

  • Sige


By Die Size Outlook (Revenue, USD Million, 2020-2027)



  • 28nm

  • 20nm

  • 14nm

  • 10nm

  • Others


By Application Outlook (Revenue, USD Million, 2020-2027)



  • Smartphones

  • Tablets

  • PC

  • Others


By Region Outlook (Revenue, USD Million, 2020-2027)



  • North America

  • Asia-Pacific

  • Europe

  • Middle East & Africa

  • South America


Key questions addressed by the report



  • What was the historic market size (2018)?

  • Which segmentation (Component / Solution/ Industry) is driving the wi-fi chipset market?

  • What will be the growth rate by 2027?

  • Who are the key players in the wi-fi chipset market?

  • What are the strategies adopted by key players?



Report Scope:

Report Attribute/Metric Details
  Market Size   USD 27,183.7 Million
  CAGR   6.02% (2020-20270
  Base Year   2019
  Forecast Period   2020-2027
  Historical Data   2018
  Forecast Units   Value (USD Million)
  Report Coverage   Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
  Segments Covered   Type, Fabrication Technology, Die Size, Application
  Geographies Covered   North America, Europe, Asia-Pacific, and Rest of the World (RoW)
  Key Vendors   Qualcomm Technologies Inc. (US), Mediatek Inc. (Taiwan), Intel Corporation (US), STMicroelectronics NV (Switzerland), Cypress Semiconductor Corporation (US), Taiwan Semiconductor Manufacturing Co Ltd (Taiwan), Global Foundries (US), Broadcom Inc (US), Marvell Technology Group Ltd (Bermuda), On Semiconductor (Quantenna Communications Inc) (US), Peraso Technologies, Inc. (Canada), Texas Instruments Inc. (US), Samsung Electronics Co Ltd. (South Korea) and United Microelectronics Corporation (Taian)
  Key Market Opportunities   Use of Wi-Fi Technology in indoor and outdoor location systems.
  Key Market Drivers

  • Developments in computer-aided systems.
  • Developments in computer-aided systems, wearable technology, the Internet of Things (IoT), automation technologies


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    Frequently Asked Questions (FAQ) :

    Wi-Fi Chipset Market is set to grow at a CAGR of 6.02%from a value of USD 18,153.6 Million in 2018 to hit USD 27,183.7 Million by 2027

    The Key Players of the Global Wi-Fi Chipset industry are Qualcomm Technologies Inc. (US), Mediatek Inc. (Taiwan), Cypress Semiconductor Corporation (US), Taiwan Semiconductor Manufacturing Co Ltd

    North America region is ready to lead the Wi-Fi chipset market during the assessment period.

    The factors are automation technologies, wearable technology, the Internet of Things (IoT), and developments in computer-aided systems. These are fueling the growth of the global Wi-Fi chipset market.

    The global Wi-Fi Chipset Market regionally segments into North America, Europe, Asia-Pacific, Middle East & Africa, and South America.