Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Research Report – Forecast to 2027

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Research Report & by memory type ( HMC, HBM), by product ( CPU, FPGA, GPU, ASIC), by application areas (HPC, networking and telecommunication, consumer electronics) region - Forecast till 2027

ID: MRFR/SEM/4487-HCR | February 2021 | Region: Global | 100 pages

Market Synopsis


The hybrid memory cube and high-bandwidth memory market is expected to reach USD 3,842.50 Million by 2026 at CAGR 25% through the forecast period.
Hybrid memory cube (HMC) and high bandwidth memory (HBM) are both RAM interfaces designed and architecture by AMD and Hynix, and Silicon Vias. Both the RAM interfaces work for stacked DRAM memory. High bandwidth memory is used in combination with a graphics processing unit.


Both the interface for RAM work on similar lines, however, high bandwidth memory has a slightly different architecture as compared to HMC. HBM uses a graphical processing unit included in the same package as that of the RAM, which makes HBM more advantageous over HMC to provide a tightly-coupled high-speed processing unit. Hybrid memory cube devices tend to use a separate processor like a chain, to multiply the memory capacity of the device.


One of the major factors that contribute towards the growth of hybrid memory cube and high bandwidth memory devices is the application of these in data centers, smartphones, and high-end computation devices. The architectural design of both the devices is similar in addition to the graphical processing unit in HBM.


Segmentation


The global hybrid memory cube and high-bandwidth memory market are segmented into memory type, product type, application, and region. On the basis of memory type, the segment is further classified into hybrid memory cube (HMC) and high-bandwidth memory (HBM). On the basis of product type the segment is further classified into central processing unit (CPU), field programmable gate array (FPGA), graphics processing unit (GPU), application-specific integrated circuit and accelerated processing unit. The hybrid memory cube and high-bandwidth memory devices are applied in many areas like high-performance computing (HPC), networking and telecommunication, consumer electronics, data centers and many others.


Regional Analysis


The global hybrid memory cube and high-bandwidth memory market are studied for North America, Europe, Asia Pacific and rest of the world. Among the regions, the market of hybrid memory cube and high bandwidth memory is dominated by North America. The major factor contributing towards the growth of the market in North America is the high number of data centers and their application. There is also a strong demand for high-performance computing; wherein, the hybrid memory cube is expected to play a significant role. In addition to the higher concentration of data centers in North America region, faster adoption of newer technology in various applications is also fuelling the market. The United States is the major contributor to the growth of the market. The U.S. holds a large concentration of companies and vendors dealing in hybrid memory cube and high bandwidth memory. There are also many other start-ups which are entering the market.


On the other hand, the market in Europe is also expected to boom after the mid of forecast period. Due to advancement in autonomous vehicles, the hybrid memory cube and high bandwidth memory are expected to contribute a significant amount to its development. However, Asia Pacific is expected to show highest growth rate during the forecast period.


Some of the key players in the global hybrid memory cube and high-bandwidth memory market are IBM Corporation (U.S.), Micron Technology, Inc.(U.S.), Samsung Group (South Korea), SK Hynix Inc. (South Korea), Advanced Micro Devices, Inc. (U.S.), Intel Corporation (U.S.), Xilinx, Inc.(US.), Fujitsu Ltd.(Japan), Nvidia Corporation (U.S.), Open-Silicon (U.S.) and many others.


Some of the key innovators in the area of hybrid memory cube and high-bandwidth memory market are Cadence Design Systems, Inc. (U.S.), Arira (U.S.), Marvell Technology Group, Ltd. (U.S.), Cray Inc.(U.S.), Rambus Inc. (U.S.), Arm Holdings (U.K), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan) and many others.


Intended Audience



  • 3D interconnect vendors

  • System integrators

  • Government institutions

  • Technology investors

  • Research firms

  • Memory Providers

  • Key players in HBM market



Report Scope:
Report Attribute/Metric Details
  Market Size   USD 3,842.50 Billion (2019-2026)
  CAGR   25% (2019-2026)
  Base Year   2019
  Forecast Period   2020-2027
  Historical Data   2018
  Forecast Units   Value (USD Billion)
  Report Coverage   Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
  Segments Covered   Memory type, Product, Application areas, Region
  Geographies Covered   North America, Europe, Asia-Pacific, and Rest of the World (RoW)
  Key Vendors   IBM Corporation (U.S.), Micron Technology, Inc.(U.S.), Samsung Group (South Korea), SK Hynix Inc. (South Korea), Advanced Micro Devices, Inc. (U.S.), Intel Corporation (U.S.), Xilinx, Inc.(US.), Fujitsu Ltd.(Japan), Nvidia Corporation (U.S.), Open-Silicon (U.S.)
  Key Market Opportunities   New product launches and R&D Amongst major key Players
  Key Market Drivers   The application of these in data centers, smartphones, and high-end computation devices.


Frequently Asked Questions (FAQ) :


The worldwide market of hybrid memory cube and high-bandwidth memory at 35% CAGR can value at USD 3.78 Bn by 2023.

Design Systems, Inc. (U.S.), Cray Inc.(U.S.), Arira (U.S.), and Marvell Technology Group, Ltd. (U.S.) are some reputed players of the hybrid memory cube and high-bandwidth memory market.

field programmable gate array (FPGA), central processing unit (CPU), application-specific integrated circuit, graphics processing unit (GPU), and accelerated processing unit are hybrid memory cube and high-bandwidth memory products.

The growing number of data centers can prompt the growth of the hybrid memory cube and high-bandwidth memory market.

North America houses a high concentration of data centers. This can bolster the North America hybrid memory cube and high-bandwidth memory market expansion.