Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Research Report – Forecast to 2027

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Research Report & by memory type ( HMC, HBM), by product ( CPU, FPGA, GPU, ASIC), by application areas (HPC, networking and telecommunication, consumer electronics) region - Forecast till 2027

ID: MRFR/SEM/4487-HCR | October 2022 | Region: Global | 100 Pages         

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market

hybrid memory cube and high bandwidth memory market value is USD 1.23 billion and is estimated to grow the highest CAGR of 31.70% during the forecast period 2020-2026

Segmentation

By Product Cpu Fpga Gpu Asic
By Application Areas Hpc Networking And Telecommunication Consumer Electronics

Key Players

  • Micron Technology Inc. (U.S)
  • SK Hynix Inc. (South Korea)
  • Intel Corporation (U.S)
  • Fujitsu Ltd (Japan)
  • Open-Silicon (U.S)
  • IBM Corporation (U.S)
  • Samsung Group (South Korea)
  • Advanced Micro Devices Inc. (U.S)
  • Xilinx Inc. (U.S)
  • Nvidia Corporation (U.S)
  • Arira (U.S)
  • Cray Inc. (U.S)
  • Arm Holdings (U.K)
  • Cadence Design Systems Inc. (U.S)

Drivers

  • The application of these in data centers smartphones and high-end computation devices.
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Hybrid Memory Cube and High Bandwidth Memory Market Overview


In 2020, the global hybrid memory cube and high bandwidth memory market value is witnessed as USD 1.23 billion and is estimated to grow at the highest CAGR of 31.70% during the forecast period 2020-2026 along with the hybrid memory cube and high bandwidth memory market size of USD 11.12 billion by 2026.


The hybrid memory cube and high bandwidth memory, both are high-performance RAM interfaces that are designed using AMD & Hynix and Silicon-Vias. These two RAM interfaces are worked for stacked DRAM memory for their superior features like high bandwidth, small form factor, and low cost. Since this combination allows for simultaneous access to several memory blocks, both are set to revolutionize memory access speed and overall performance. High bandwidth memory is used in combination with network devices and high-performance graphic processing units.


For RAM work, both the interfaces work on similar lines. High bandwidth memory along with the graphical processing unit is included in the same package of the RAM. This makes HBM more advantageous compared to HMC for providing tightly-coupled high-processing units. To multiply the memory capacity of the device, HMC devices use a separate processor like a chain. As these two HMC and HBM can overcome bandwidth shortage which is responsible for the performance of GPUs and is predicted that these GPUs deliver excellent performance. Nearly 40% of the GPU’s performance is improved by these devices. These devices are used in network and communication technology applications.


COVID-19 Analysis:


The COVID-19 pandemic is drastically impacted almost all the businesses along with the global hybrid memory cube and high bandwidth memory market and causes huge revenue loss in various end-use industries related to HMC and HBM. To curb the spread of the virus, various governments imposed stringent regulations like lockdowns, traveling bans, public places closed, and manufacturing industries shut down. Due to these restrictions, there is a collective lag in approval regulatory timelines and issuance of spectrum & auctions in telecom which leads to the decline in the growth of the HMC and HBM market.


Moreover, globally various countries' governments postponed their expenditure plans due to limited or unavailability of network services. This affects the consumer's and business organizations' decisions. Later the lifting up of government restrictions, rapidly there is a growth in the HMC and HBM market, and revenues are also picked up gradually.


Market Dynamics:



  • Drivers:


The rising application of HMC and HBM in data centers, smartphones, and high-end computation devices is the major factor driving the hybrid memory cube and high bandwidth memory market growth. High-bandwidth, low power consuming, highly scalable memories, rising adoption of artificial intelligence, and increasing trend of miniaturization of electronic devices are the factors accelerating the growth of the market.



  • Restraint:


Thermal issues caused by the high level of integration and their impact on the overall module result in a major challenge to manufacturers and the highly-dense multi-level integration per unit footprint is a challenge for thermal management are the factors restraining the market growth.



  • Opportunities:


The introduction of expanded or improved network bandwidth in HMC and HBM has increased its usage in various industries like electronics, automotive, IT & telecom for the devices like laptops, smartphones, wearables, and others.



  • Challenges:


Even though, these devices gaining popularity, a few fabrications, and manufacturing challenges are associated which are limiting the growth of the market.


Study Objectives -



  • To offer information about the HMC and HBM market structure along with various forecast segments and sub-segments for the next 10 years.

  • To provide the factors that are impacting the growth of the hybrid memory cube and high bandwidth memory market value.

  • To examine the hybrid memory cube and high bandwidth memory market industry analysis based on factors-price analysis, supply chain analysis, etc.

  • To provide previous and forecast revenue segments and sub-segments of the HMC and HBM market revenue for the four main geographies.

  • To offer the country-level analysis of the present market size and future prospective.

  • To provide country-level analysis of the market industry growth by region, memory type, product type form, and application.

  • To track and analyze new product developments, mergers, strategic alliances, and global market research and developments.


Segment Overview:


The global hybrid memory cube and high bandwidth memory market analysis have been divided into segments based on memory type, product type, application, and region.



  • Based on Memory Type


By memory type, the global hybrid memory cube and high bandwidth memory market is bifurcated into hybrid memory cube (HMC) and high bandwidth memory (HBM).



  • Based on Product Type


The HMC and HBM by product types are classified into five types such as central processing unit (CPU), field-programmable gate array (FPGA), graphics processing unit (GPU), application-specific integrated circuit (ASIC), and accelerated processing unit.



  • Based on Application


The hybrid memory cube and high bandwidth memory by applications are categorized into various types like networking and telecommunication, data centers, consumer electronics, high-performance computing (HPC), and many others.



  • Based on Region


Region-wise, the global hybrid memory cube, and high bandwidth memory market is divided into four main geographies such as Asia-Pacific, North America, Europe, and the Rest of the World. Among them, North America is accounting for the largest market share for the presence of the high number of data centers and their application.


Regional Analysis 


Geographically, the hybrid memory cube (HMC) and high bandwidth memory (HBM) market based on regions are analyzed into four major regions like Europe, North America, Asia-Pacific, and the Rest of the World. Out of these regions, North America is dominating the highest hybrid memory cube and high bandwidth memory market share due to the presence of a high number of data centers and their application. Strong demand for high-performance computing and the significant role of hybrid memory cube is boosting the market growth in this region. Apart, the faster adoption of newer technologies in various applications due to the presence of the higher concentration of data centers is propelling the growth of the market in the North American region.


Moreover, the United States is the major contributor to the market growth in the North American region due to the presence of a large concentration of companies and vendors dealing in hybrid memory cubes and high bandwidth memory. Several start-ups are entering the market is also fueling the market growth. Europe is also predicted to hold a significant rate after the mid of forecast period due to advancements in autonomous vehicles, the hybrid memory cube, and high bandwidth memory. Furthermore, during the forecast period, Asia-Pacific is also projected to grow at a significant rate. 


Competitive Landscape


The prominent key players in the hybrid memory cube and high bandwidth memory market outlook are the following:



  • Micron Technology, Inc. (U.S)

  • SK Hynix Inc. (South Korea)

  • Intel Corporation (U.S)

  • Fujitsu Ltd (Japan)

  • Open-Silicon (U.S)

  • IBM Corporation (U.S)

  • Samsung Group (South Korea)

  • Advanced Micro Devices, Inc. (U.S)

  • Xilinx, Inc. (U.S)

  • Nvidia Corporation (U.S)

  • Arira (U.S)

  • Cray Inc. (U.S)

  • Arm Holdings (U.K)

  • Cadence Design Systems, Inc. (U.S)

  • Marvell Technology Group, Ltd (U.S)

  • Rambus Inc. (U.S)

  • Taiwan Semiconductor Manufacturing Company, Ltd (Taiwan)


Recent Developments


On May 10, 2021, one of the top leading player Samsung Electronics started its foundry division in shooting high-performance computing (HPC) with 2.5D high-bandwidth memory (HBM). An advanced package technology I-Cube named I-Cube4and a 2.5D interposer package that contains 4 HBM modules tied directly to a logic die. This advanced innovation Samsung’s new four HBM + Logic I-Cube4 technology enables HPC which is having very few drawbacks compared to traditionally packaged ICs.


Hybrid Memory Cube and High Bandwidth Memory Market Report Overview:


This global hybrid memory cube and high bandwidth memory market research includes the Market Overview, COVID-19 analysis, Market Dynamics, Study Objectives, Segment Overview, Regional Analysis, Competitive Landscape, Recent developments, Segmentation Table, and FAQs. The market scenario includes the hybrid memory cube and high bandwidth memory market drivers, restraints, challenges, and opportunities. The hybrid memory cube and high bandwidth memory market forecast segments into four forms as memory type, product type, application, and region.


Segmentation Table


The hybrid memory cube and high bandwidth memory market trends have been segmented into four forms globally based on the memory type, product type, application, and region.


By Memory Type


Hybrid memory cube (HMC) and high bandwidth memory (HBM) are two memory types of the market.


By Product Type


The central processing unit (CPU), field-programmable gate array (FPGA), graphics processing unit (GPU), application-specific integrated circuit (ASIC), and accelerated processing unit are five types of product types.


By Application


High-performance computing (HPC), networking and telecommunication, consumer electronics, data centers, and many others are various applications.


By Region


Asia-Pacific, Europe, North America, and the rest of the world are the four main geographies included in the global market of the hybrid memory cube and high bandwidth memory.



Report Scope:

Report Attribute/Metric Details
  Market Size   USD 3,842.50 Billion (2019-2026)
  CAGR   25% (2019-2026)
  Base Year   2019
  Forecast Period   2020-2027
  Historical Data   2018
  Forecast Units   Value (USD Billion)
  Report Coverage   Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
  Segments Covered   Memory type, Product, Application areas, Region
  Geographies Covered   North America, Europe, Asia-Pacific, and Rest of the World (RoW)
  Key Vendors   IBM Corporation (U.S.), Micron Technology, Inc.(U.S.), Samsung Group (South Korea), SK Hynix Inc. (South Korea), Advanced Micro Devices, Inc. (U.S.), Intel Corporation (U.S.), Xilinx, Inc.(US.), Fujitsu Ltd.(Japan), Nvidia Corporation (U.S.), Open-Silicon (U.S.)
  Key Market Opportunities   New product launches and R&D Amongst major key Players
  Key Market Drivers   The application of these in data centers, smartphones, and high-end computation devices.


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Frequently Asked Questions (FAQ) :

25% CAGR along with the market size of USD 3,842.50 million during 2021-2028.

Arira (U.S), Cray Inc. (U.S), Arm Holdings (U.K), Taiwan Semiconductor Manufacturing Company, Ltd (Taiwan), Cadence Design Systems, Inc. (U.S), Marvell Technology Group, Ltd (U.S), and Rambus Inc. (U.S).

The central processing unit (CPU), field-programmable gate array (FPGA), graphics processing unit (GPU), application-specific integrated circuit (ASIC), and accelerated processing unit are five types of product types.