Hybrid Memory Cube High-Bandwidth Memory Market Share

Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Overview:

The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market size was valued at USD 1.23 billion in 2022. The hybrid memory cube (HMC) and high-bandwidth memory (HBM) industry is projected to grow from USD 165.2 billion in 2023 to USD 11.9 billion by 2032, exhibiting a compound annual growth rate (CAGR) of 31.70% during the forecast period (2023 - 2032). The growing rate of organizational data, surging demand for high-bandwidth, low power consuming, and highly scalable memories, and increasing penetration of miniaturized electronic devices are the key market drivers enhancing the market growth.

Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Trends

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  The growing need for high-bandwidth, low-power consuming, and highly scalable memories is driving the market growth

  
  

Market CAGR for hybrid memory cube (HMC) and high-bandwidth memory (HBM) is driven by the growing expenditure for research and development proficiencies. The rising need for high bandwidth, low power consumption, and high scalability mainly drives the development of various 3D-stacked memories. With the emergence of Big Data, the Internet of Things (IoT), and other data-intensive applications, there is a rising demand for technologies that can efficiently process and store more information. Also, there is a strong requirement for memories with high efficiency and performance in the network system for data packet buffering, data packet processing, and storage applications beyond 100 Gbps. Hybrid memory cube (HMC) and high-bandwidth memory (HBM), which provide a bandwidth of more than 100 Gbps, can replace DRAM as they achieve competitive speeds with much lower power consumption. Also, the market for hybrid memory cube (HMC) and high-bandwidth memory (HBM) is witnessing continuous advancements in these technologies.

With the rapid increase in IoT devices, chip requirement for building IoT devices is also anticipated to increase during the forecast period. Decreasing energy consumption, combined with the miniaturization of chips, will be prioritized by manufacturers. IoT pledges to be a significant driving force that would create significant innovation, facilitate new business models, and improve society in numerous ways. Market vendors focus on developing hybrid memory cube (HMC) and high-bandwidth memory (HBM) to integrate them into IoT devices and solutions drives the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market revenue.

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Segment Insights:

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Memory Type Insights

The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market segmentation, based on memory type, includes hybrid memory cube (HMC) and high-bandwidth memory (HBM). The hybrid memory cube (HMC) segment dominated the market. The Hybrid Memory Cube (HMC) is the high-performance RAM interface through-silicon via (TSV) technology that connects the multiple memory arrays to top of one another factor driving the market for hybrid memory cube (HMC) and high-bandwidth memory (HBM).

Figure 1: Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market, by Memory Type, 2022 & 2032 (USD billion)

Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Application Insights

The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market segmentation, based on application, includes high-performance computing (HPC), networking & telecommunication, consumer electronics, data centers, and others. The high-performance computing (HPC) category generated the most income over the forecast period owing to the rising demand for high-performance computing systems in various end-use industries drives the market.

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Product Insights

The hybrid memory cube (HMC) and high-bandwidth memory (HBM) market segmentation, based on product, includes a central processing unit (CPU), field programmable gate array (FPGA), graphics processing unit (GPU), Application-specific integrated circuit and accelerated processing unit. The field programmable gate array (FPGA) category generated the most income over the forecast period owing to the rapid increase in IoT devices and chip requirements for building IoT devices.

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Regional Insights

By Region, the study provides market insights into North America, Europe, Asia-Pacific, and the Rest of the World. The North American hybrid memory cube (HMC) and high-bandwidth memory (HBM) market area will dominate this market, owing to the shifting focus of businesses towards digitalization for realigning business processes, growing demand for machine learning, and cloud computing and rising growth in high-performance computing (HPC) applications which require high-bandwidth memory solutions for fast data processing drive the market for hybrid memory cube (HMC) and high-bandwidth memory (HBM) in the region. Moreover, US hybrid memory cube (HMC) and high-bandwidth memory (HBM) market held the largest market share, and the Canada hybrid memory cube (HMC) and high-bandwidth memory (HBM) market was the fastest-growing market in the Asia-Pacific region.

Further, the major countries studied in the market report are The U.S., Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.

Figure 2: HYBRID MEMORY CUBE (HMC) AND HIGH-BANDWIDTH MEMORY (HBM) MARKET SHARE BY REGION 2022 (%)

Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review

Europe's hybrid memory cube (HMC) and high-bandwidth memory (HBM) market accounts for the second-largest market share due to the rising adoption of artificial intelligence (AI), broadly directed to the intelligence exhibited by machines contrary to the natural intelligence exhibited by humans, across various facets of technology applications is creating momentum form high-tech memory devices. Further, the German hybrid memory cube (HMC) and high-bandwidth memory (HBM) market held the largest market share, and the UK hybrid memory cube (HMC) and high-bandwidth memory (HBM) market was the fastest-growing market in the European region.

The Asia-Pacific hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is expected to grow at the fastest CAGR from 2023 to 2032. This is due to the increasing consumer base and data traffic. Moreover, China hybrid memory cube (HMC) and high-bandwidth memory (HBM) market held the largest market share, and the Indian hybrid memory cube (HMC) and high-bandwidth memory (HBM) market was the fastest-growing market in the Asia-Pacific region.

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Key Market Players & Competitive Insights

Leading market players are investing heavily in research and development to expand their product lines, which will help the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market grow even more. Market participants are also undertaking various strategic activities to expand their footprint, with important market developments including new product launches, mergers and acquisitions, contractual agreements, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, the hybrid memory cube (HMC) and high-bandwidth memory (HBM) industry must offer cost-effective items.

Manufacturing locally to minimize operational costs is one of the key business tactics manufacturers use in the hybrid memory cube (HMC) and high-bandwidth memory (HBM) industry to benefit clients and increase the market sector. Major players in the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market, including Micron Technology, Inc., SAMSUNG, Microsoft, Cisco Systems, Inc., Oracle, SAP SE, Broadcom, SK HYNIX INC., and others, are attempting to increase market demand by investing in research and development operations.

QuickLogic Corp is the inventor and provider of customizable semiconductor solutions for mobile and portable electronics. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). In March 2022, QuickLogic Corporation, along with SkyWater Technology, made a "fast boot" rad-hard eFPGA IP available to utilizers of SkyWater's 90 nm rad-hard (RH90) process. This technology can be implanted as an IP core in ASIC and SoC widgets or executed as a custom rad-hard FPGA for mission-critical and ruggedized applications.

Samsung Electronics Co., Ltd. manufactures various consumer and industrial electronic equipment and products, such as semiconductors, personal computers, peripherals, monitors, televisions, home appliances, air conditioners, and microwave ovens. The firm also produces Internet access network systems and telecommunications equipment, such as mobile phones. In February 2021, Samsung Electronics developed the industry's first hybrid memory cube (HMC) and high-bandwidth memory (HBM) integrated with artificial intelligence (AI) processing power, the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory to accelerate large-scale processing in data centers, high-performance computing (HPC) systems, hybrid memory cube (HMC) and high-bandwidth memory (HBM) and AI-enabled mobile applications.

Key Companies in the Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market include

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  Advanced Micro Devices, Inc

  
  


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  FUJITSU

  
  


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  Intel Corporation

  
  


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  Micron

  
  


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  NVIDIA

  
  


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  Open-Silicon, Inc.

  
  


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  Rambus Incorporated

  
  


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  Samsung

  
  


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  SK HYNIX INC.

  
  


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  Xilinx

  
  

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Industry Developments

February 2022: AMD and Xilinx signed an agreement for AMD to acquire Xilinx in an all-stock transaction valued at USD 35 billion. This will assist in developing the breadth of AMD's product portfolio and customer set across diverse growth markets. Joining AMD will accelerate growth in Xilinx's data center business and enable it to pursue a broader customer base across more markets.

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Segmentation:

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Application Outlook

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  High-Performance Computing (HPC)

  
  


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  Networking & Telecommunication

  
  


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  Consumer Electronics

  
  


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  Data Centers

  
  


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  Others

  
  

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Memory Type Outlook

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  Hybrid Memory Cube (HMC)

  
  


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  High-Bandwidth Memory (HBM)

  
  

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Product Outlook

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  Central Processing Unit (CPU)

  
  


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  Field Programmable Gate Array (FPGA)

  
  


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  Graphics Processing Unit (GPU)

  
  


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  Application-Specific Integrated Circuit

  
  


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  Accelerated Processing Unit

  
  

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Regional Outlook

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  North America

  
  
  
  
  • US
  
  
  • Canada
  
  
  
  

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  Europe

  
  
  
  
  • Germany
  
  
  • France
  
  
  • UK
  
  
  • Italy
  
  
  • Spain
  
  
  • Rest of Europe
  
  
  
  

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  Asia-Pacific

  
  
  
  
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    China

    
    
  
  
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    Japan

    
    
  
  
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    India

    
    
  
  
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    Australia

    
    
  
  
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    South Korea

    
    
  
  
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    Australia

    
    
  
  
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    Rest of Asia-Pacific

    
    
  
  
  
  


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  Rest of the World

  
  
  
  
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    Middle East

    
    
  
  
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    Africa

    
    
  
  
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    Latin America