ID: MRFR/SEM/3938-HCR | February 2023 | Region: Global | 100 Pages
Flip Chip Technology Market is expected to reach approximately USD 41.24 Billion by 2030 growing at a 6.23% CAGR over the forecast period 2022-2030
$41.24 Billion
6.23%
North America
2022-2030
Report Attribute/Metric | Details |
---|---|
Market Size | USD 41.24 Billion |
CAGR | 6.23% (2022-2030) |
Base Year | 2021 |
Forecast Period | 2022-2030 |
Historical Data | 2020 |
Forecast Units | Value (USD Billion) |
Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, and Trends |
Segments Covered | Wafer bumping process, Packaging Technology, Type, Application |
Geographies Covered | North America, Europe, Asia-Pacific, and Rest of the World (RoW) |
Key Vendors | Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) |
Key Market Opportunities | The major manufacturing hubs and are likely to provide abundant opportunities for the growth of the flip chip technologies. |
Key Market Drivers | Developments in electronic packaging and increase in the reliability of circuits are driving the flip chip technology market growth. |
The flip-chip technology market is predicted to grow at a 6.23% CAGR between 2022-2030.
Notable players profiled in the flip chip technology market include Texas Instruments, STMicroelectronics, Powertech Technology, STATS ChipPAC, Amkor Technology, ASE, Inc., UMC, Global Foundries, Intel Corporation, and Samsung Group.
Developments in electronic packaging and increase in the reliability of circuits are driving the flip chip technology market growth.
High cost may limit the flip chip technology market growth.
The Asia Pacific region will lead the flip-chip technology market.