Flip Chip Technology Market Report- Forecast till 2027

Flip Chip Technology Market research report: by wafer bumping process (CU pillar, lead-free), packaging technology (2D, 2.5D, 3D), packaging type (FC BGA, FC PGA, FC LGA), product, application (consumer electronics, automotive) – Forecast till 2027

ID: MRFR/SEM/3938-HCR | February 2021 | Region: Global | 100 pages         

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Flip Chip Technology Market Overview:

A flip-chip is a category of the semiconductor device that has been created for incorporating the solder bumps that are over various connection pads of the MEMS (Micro-Electromechanical System) or IC. This particular methodology creates a very reliable and thorough connection between the board and the component. During the development of packaging of any electronics, the major goal is to decrease the expenses, uplift the density of the packaging, and undergoing the improvement of its performance by improving or maintaining the loyalty of various circuits. 

The Flip Chip Assembly Market is based on the concept that the flip-chip procedure where any semiconductor chip get assembled by keeping the face downwards onto the circuit board – is appropriate for numerous size considerations due to no further requirement of an additional area for making contact on the sides of that particular component. Moreover, the performance level in the high-frequency applications is unique concerning other interconnection procedures due to the minimized length of the connection path. 

Therefore, flip-chip bumping is a crucial step in the procedure. This bump offers the required electric connection between the substrate and the die offers thermal conduction via two different materials, and functions as a spacer for preventing the electrical shots, and also offers mechanical aid. The Flip Chip Assembly Market is assumed to expand at a Compound Annual Growth Rate or CAGR of 8.29% during the course of the assessment period. 

COVID-19 Analysis:

At the end of 2020, the COVID virus started getting spread worldwide, and a great number of people got infected with this disease. Hence, various major countries across the globe have implemented work stoppage orders and food prohibitions. Except for the life support products and medical supplies industries, a great majority of industries have been hugely affected and that includes Copper Pillar Flip Chip Market as well. There was a massive change in price, gross profit, shipment, revenue, business distribution, interview record, etc. 

The regional development scenario of the Copper Pillar Flip Chip Market was also affected that includes the Copper Pillar Flip Chip Market volume, Flip Chip Technology Market Size, value, and as well as flip Chip Technology Industry price data. Along with that, there were negative impacts on the Flip Chip Technology Industry segment, its various types, and channels. 

Market Dynamics:

  • Drivers:

The main driving factors of the Flip Chip Assembly Market are the maintenance of the high density of the packaging, developments in the packaging of various electronics such as improvement of their performances, and uplifting the reliability of a particular service. Another reason behind the growth of the Global Flip Chip Technology Market is that this particular technology can be applied to the baseband, memory devices, application processor, PMIC, etc. Also, for mobile communication, the development of the Global Flip Chip Technology Market is driven by package miniaturization trends and device performance, specifically for the so-called application processor or CPU that powers the media tablets and smartphones.

  • Opportunities:

The massively rising trend of real-world gaming is expected to facilitate the development of the Flip Chip Technology Industry across the world as these flip chips are usually integrated into various processors that are used in graphic cards of computers, laptops, and gaming consoles. Also, according to each Flip Chip Technology Market Expert, various prominent manufacturers are spending a significant amount of the intensive R & D for the huge Flip Chip Technology Market Demand. 

Moreover, according to the Flip Chip Technology Market Expert, the flip chips offer the users a proper real-life experience during their gaming sessions since they can change the visuals depending on the phone’s motion. Therefore, according to the Flip Chip Technology Market Expert, an increase in the Flip Chip Technology Market Demand would boost the expansion of the market and the increase of Flip Chip Technology Market Share during the forecast period. 

Moreover, another reason behind the massive Flip Chip Technology Market Demand is because this technology can offer data transmission across various devices on a much higher frequency level. As the connections are made via the bumps present in the flip chips that diminish the length and thus offer enhanced electrical efficiency and promote greater Flip Chip Technology Market Share. Also, the increasing demand for high-frequency microwave, ultrasonic frequency operations, and high-speed portable devices had contributed towards the uplifted Flip Chip Technology Market Share. 

  • Restraints:

The high expenses associated with the implementation of the Global Flip Chip Technology Market are impeding the expansion of the market. 

Market Segmentation:

The Flip Chip Process Market can be segmented based on the packaging technology, product, and wafer bumping procedure, packaging type, intended audience, region, and application. 

By Packaging Technology:

Based on the Flip Chip Technology Market Analysis the packaging technologies can be segmented into: 

  • 3D packaging technology 

  • 2.5D packaging technology 

  • 2D packaging technology 

By Product:

Depending on Flip Chip Technology Market Facts the products can be classified into: 

  • CMOS image sensor 

  • RF 

  • Mixed-signal 

  • SOC

  • LED

  • CPU 

  • Analog

  • Power IC 

  • Others

By Water Bumping Procedure:

Based on the Flip Chip Technology Market Analysis the water bumping procedures can be segmented into: 

  • Lead-free

  • Gold stud platter solder

  • Copper pillar Tin-lead eutectic solder 

By Packaging Type:

Based on the Flip Chip Technology Market Analysis the packaging types can be segmented into: 

  • Flip Chip Pin Grid Array or FC PGA 

  • Flip Chip Quad Flat No-Lead or FC QFN

  • Flip Chip-Chip-Scale Package pr FC CSP 

  • Flip Chip Ball Grid Array or FC BGA 

  • Flip Chip Land Grid Array or FC LGA 

  • Flip Chip System-In-Package or FC SIP

By Intended Audience:

Depending on Flip Chip Technology Market Facts the intended audience can be classified into: 

  • Manufacturing equipment supplier

  • System integrator

  • Foundry players

  • Research organizations

  • Wafer manufacturers

  • Chip manufacturers

  • Device manufacturers

  • Retailers and distributors

  • Raw material suppliers

By Region:

Based on Flip Chip Technology Market Statistics, the regions of this market can be classified into: 

  • Asia Pacific 

  • North America

  • Europe

  • Rest of the world

By Application:

Depending on Flip Chip Technology Market Facts the applications can be classified into: 

  • Automotive

  • Industrial

  • Military

  • Consumer electronics 

  • Telecommunications 

  • Medical devices

  • Aerospace

  • Others

Regional Analysis:

Based on the Flip Chip Technology Market Statistics, the Asia Pacific region is expected to dominate the worldwide Flip Chip on Board Market during the course of the assessment period. Various countries such as India and China are the key manufacturing hubs and are most likely to offer abundant scopes for the massive growth of the Flip Chip on Board Market. Therefore, the presence of various major companies in this particular region is driving the growth of the Flip Chip on Board Market. Also, North America holds the second-highest Flip Chip Technology Market share of the worldwide market. Because of the high amount of investments and presence of the major players in the development and research activities, there’s a massive growth of the Flip Chip Technology Market in the North American region. 

Report Overview:

The report covers the key driving factors, trends, and competitive landscape of the Flip Chip Technology Market. The report also covers the Flip Chip Technology Market Forecast and different segments like packaging type and packaging technology. The geographical area covered under the Flip Chip Technology Market Forecast is Europe, Asia Pacific, North America, and the rest of the world. The Flip Chip Technology Market Forecast also assumes that the key manufacturing hubs would offer abundant scopes for the Flip Chip Technology Market Growth. Also, the Flip Chip Technology Market Report implies that the rise in the reliability of various circuits and the developments in electronic packaging are the key drivers behind the Flip Chip Technology Market Growth.

Scope of Report and Segmentation Table:

  • Base year – 2017

  • Forecast period – 2017-2023

  • Historical data – 2017 

Report Scope:
Report Attribute/Metric Details
  Market Size   2027: Significant Value
  CAGR   8.29% (2017-2023)
  Base Year   2019
  Forecast Period   2020-2027
  Historical Data   2018
  Forecast Units   Value (USD Million)
  Report Coverage   Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
  Segments Covered   packaging technology, packaging type
  Geographies Covered   North America, Europe, Asia-Pacific, and Rest of the World (RoW)
  Key Vendors   Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.)
  Key Market Opportunities   The major manufacturing hubs and are likely to provide abundant opportunities for the growth of the flip chip technologies.
  Key Market Drivers   Developments in electronic packaging and increase in the reliability of circuits are driving the flip chip technology market growth.

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Frequently Asked Questions (FAQ) :

The flip chip technology market is predicted to grow at an 8.29% CAGR between 2017- 2023.

The Asia Pacific region will lead the flip chip technology market.

Developments in electronic packaging and increase in the reliability of circuits are driving the flip chip technology market growth.

High cost may limit the flip chip technology market growth.

Notable players profiled in the flip chip technology market include Texas Instruments (U.S.), STMicroelectronics (Switzerland), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), Amkor Technology (U.S.), ASE, Inc. (Taiwan), UMC (Taiwan), Global Foundries (U.S.), Intel Corporation (U.S.), and Samsung Group (South Korea).