Semiconductor Bonding Market Research Report: Information Based on Process Type (Die-To-Die Bonding, Die-To-Wafer Bonding, and Wafer-To-Wafer Bonding), Based on Technology [Die Bonding (Epoxy Die Bonding, Eutectic Die Bonding, Flip-chip Attachment, and Hybrid Bonding), Wafer Bonding (Direct Wafer Bonding, Anodic Wafer Bonding, TCB Wafer Bonding, and Hybrid Bonding)], Based on Type (Die Bonder, Wafer Bonder, and Flip-chip Bonder), Based on Application (RF Devices, Mems And Sensors, CMOS Image Sensors, LED, and 3D NAND), and Region (North...

Semiconductor Bonding Market Overview:

The global semiconductor bonding market size was valued at USD ~ 865.7 million in 2020 and is expected to register a CAGR of ~3.11% from 2021 to 2027

Market Snapshot:

Semiconductors, such as Silicon (Si), are atoms linked together in a regular, periodic pattern to produce an arrangement in which each atom is surrounded by eight electrons. A covalent connection exists between the electrons that surround each atom in a semiconductor. A covalent bond is formed when two atoms share a pair of electrons. Each atom creates four covalent connections with the four atoms around it. As a result, eight electrons are shared between each atom and its four neighboring atoms. Semiconductor bonding is used to construct composite 3D structures, cavities, and closed fluid channels that are mechanically robust and capable of providing strong electrical contact. It is critical to bind two or more micro-components firmly.

The market is expected to witness significant growth due to the growing demand for miniature electronic components, increasing adoption of stacked die technology in IoT devices, and rising demand for electric and hybrid vehicles. The high cost of ownership hampered the market growth. However, increasing demand for 3D semiconductor assembly and packaging and the growing adoption of IoT and AI in the automotive sector create an opportunity for semiconductor bonding vendors.

Impact of COVID- 19 on market:

The semiconductor sector focuses on safeguarding the health and safety of its employees, helping to battle the virus. Semiconductors are at the core of many innovative technologies being utilized to combat the global health problem. During the COVID-19 epidemic, production facilities in the semiconductors sector were suspended owing to lockdown measures, a shortage of worker availability, and a disruption in the supply chain, affecting demand for semiconductor bonding equipment. With the emergence of COVID-19, the number of healthcare facilities has expanded to cope with the increasing number of patients around the world. This has raised the demand for energy-efficient LED lighting solutions in healthcare institutions, which will drive for the market of semiconductor bonding equipment. LED lighting is extensively utilized in commercial and industrial areas because it has several benefits such as energy efficiency, decreased heat emission, cost-effectiveness, and millisecond switching capabilities. The use of thin wafers in LED devices has several advantages, including low power consumption.

Global Semiconductor Bonding Market, 2018–2027 (USD Million)

Source: MRFR Analysis

• Drivers
  
  
  
  • Increasing adoption of stacked die technology in IoT devices
  
  
  
  

The stacked die is a newer technology gaining acceptance in a range of electronics applications. In stacking die, one bare chip is placed on top of another, or a spacer is used instead of a bare chip, and then another chip is placed on top of those, and a third one, and so on. Sets of many rows of wire bonding loops are arranged, each going to a different die or spacer. This kind of circuitry arrangement is used to save costly PCB space. The majority of silicon die is packaged in a wide range of containers. The package protects the die and wire bonding while also providing an interface to broader PCB designs. Much of the field of the Internet of Things (IoT) necessitates features that approach the stacked die technique. The stacking die reduces the overall size of the final design. One of the primary reasons for the extensive use of stacked die approach is handheld electronic gadgets. Hence, the increasing adoption of stacked die technology in IoT devices is attributed to the increasing demand for semiconductor bonding solutions.

• Restraints
  
  
  
  • High cost of ownership
  
  
  
  

The high cost and difficulty of designing semiconductors chips at the most advanced nodes are prompting many chipmakers to start splitting that chip down into several sections, not all of which require leading-edge nodes. When a complicated system is integrated monolithically on a single piece of silicon, the end output is a compromise between the thermal budget restrictions of the a component of a device. Semiconductor bonding equipment is sophisticated machinery that requires a high input power to execute die-attach operations. The power required by this equipment ranges from hundreds to thousands of watts. The manufacturing cost of semiconductor bonding equipment is likewise relatively high due to sophisticated and costly components. Assembling many large and tiny elements, including the screen, bonding hand, vacuum, sensors, and heat source, is very expensive. As a result, the overall manufacturing and ownership costs of die bonder equipment for semiconductor bonding are relatively high. Furthermore, the high price of semiconductor wafers raises the operational cost of semiconductor bonding, stifling industry development.

Value Chain Analysis

The global semiconductor bonding market has witnessed significant growth in the past decade due to technological changes and is expected to grow at a steady rate in the upcoming years. The value chain analysis of the semiconductor bonding market comprises four major levels: hardware/software providers, cloud vendors/service providers, system integrators, and end users.

Market Segmentation

The global semiconductor bonding market has been segmented based on process type, technology, type, application, and region.

Based on the process type, the market has been segmented into Die-To-Die Bonding, Die-To Wafer Bonding, and Wafer-To-Wafer Bonding.

Based on technology, the market has been segmented into die bonding and wafer bonding. The die bonding segment is further divided into epoxy die bonding, eutectic die bonding, flip-chip attachment, and hybrid bonding. The wafer bonding segment is further divided into direct wafer bonding, anodic wafer bonding, TCB wafer bonding, and hybrid bonding.

Based on type, the market has been segmented into die bonder, wafer bonder, and flip-chip bonder.

Based on application, the market has been segmented into RF Devices, MEMS and Sensors, CMOS Image Sensors, LED, and 3D NAND.

The regions included in the study are North America, Europe, the Asia-Pacific, the Middle East & Africa, and South America.

Regional Analysis

In terms of region, the global semiconductor bonding market has been categorized as North America, Europe, Asia-Pacific, the Middle East & Africa, and South America. Asia-Pacific is likely to be the dominant regional market due to the faster adoption of advanced technologies in developing countries in the region—China, Japan, and India. As technical awareness in the Asia-Pacific is broadening, the market for consumer electronics increasing. As a result, the semiconductor bonding market is growing. The continued innovation, primarily in the IT, telecom, and automotive industries, has been driving the growth of the electronic manufacturing and design services market in North America. Strategic collaborations aimed at inculcating sophisticated technologies and advancing the existing technologies are also expected to drive the growth of the semiconductor bonding market in North America during the forecast period. The growth of the semiconductor bonding market in Europe is expected to be influenced by the increasing adoption of modern technologies, as well as the expanding number of small and medium enterprises (SMEs). The rising technological adoption, focus on innovations obtained from R&D and technology, more IT organizations, and ongoing projects will boost the market in the European region.

Competitive Landscape

The global market for semiconductor bonding has witnessed significant growth over the forecast period due to the growing number of semiconductor bonding manufacturers. Several domestic, regional, and global players operating in the semiconductor bonding market continuously strive to gain a significant share of the overall market. The key market participants are investing in R&D activities to drive organic growth and increase their market shares. In addition, these players are engaging in new touchpoint type development to expand and strengthen their existing touchpoint type portfolios and acquire new consumers.

Key Players

• BE Semiconductor Industries N.V.


• ASM Pacific Technology Ltd


• Kulicke & Soffa


• Panasonic

The global semiconductor bonding market is characterized by the presence of several regional and local providers. Some of the key players in the market are BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd (Singapore), Kulicke & Soffa (Singapore), Panasonic (Japan), Fuji Corporation (Japan), Yamaha Motor Robotics Corporation Co. (Japan), SUSS MicroTech SE (Germany), and Shiaura Mechatronics (Japan).

Recent Developments

• In October 2020, BE Semiconductor Industries N.V. (Besi) collaborated with Applied Materials, Inc. to develop the industry's first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI, and 5G.


• In January 2021, ASM PACIFIC TECHNOLOGY (ASMPT) and EV GROUP (EVG) collaborated to create die-to-wafer hybrid bonding solutions for 3D-IC and heterogeneous integration applications. Chiplet technology combines chips with different process nodes into advanced packaging systems that can power new applications such as 5G, high-performance computing (HPC), and artificial intelligence. Die-to-wafer hybrid bonding is a key process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology—combining chips with different process nodes into advanced packaging systems that can power new applications such as 5G, HPC, and artificial intelligence (AI).


• In April 2021, ASM PACIFIC TECHNOLOGY (ASMPT) introduced three new manufacturing systems that combine X-Celeprint's Micro-Transfer Printing (MTP) and ASM AMICRA's high precision die bonding technology to introduce the semiconductor industry's first complete system to enable high volume heterogeneous integration of ultra-thin dies onto up to 300mm base wafers.


• In October 2019, Panasonic Corporation teamed up with IBM Corporation to create and commercialise a new high-value-added solution that helps clients improve their overall equipment effectiveness (OEE) and achieve high-quality manufacturing.


• In September 2021, MicroTec SE partnered with SET Corporation to provide a fully automated, customizable, highest-yield equipment solution to customers. This solution will accelerate the industry's path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.

Report Overview

This study estimates revenue growth at global, regional, and country levels and offers an overview of the latest developments in each of the sub-sectors from 2018 to 2027. For this analysis, MRFR segmented the global semiconductor bonding market has been segmented based on process type, technology, type, application, and region

• Based on Process Type
  
  
  
  • Die-To-Die Bonding
  
  
  • Die-To-Wafer Bonding
  
  
  • Wafer-To-Wafer Bonding
  
  
  
  


• Based on Technology
  
  
  
  • Die Bonding
    
    
    
    • Epoxy Die Bonding
    
    
    • Eutectic Die Bonding
    
    
    • Flip-chip Attachment
    
    
    • Hybrid Bonding
    
    
    
    
  
  
  • Wafer Bonding
    
    
    
    • Direct Wafer Bonding
    
    
    • Anodic Wafer Bonding
    
    
    • TCB Wafer Bonding
    
    
    • Hybrid Bonding
    
    
    
    
  
  
  
  


• Based on Type
  
  
  
  • Die Bonder
  
  
  • Wafer Bonder
  
  
  • Flip-chip Bonder
  
  
  
  


• By Application
  
  
  
  • RF Devices
  
  
  • Mems And Sensors
  
  
  • Cmos Image Sensors
  
  
  • LED
  
  
  • 3D NAND
  
  
  
  


• Based on Region
  
  
  
  • North America
  
  
  • Europe
  
  
  • Asia-Pacific
  
  
  • Middle East & Africa
  
  
  • South America
  
  
  
  

Report Scope:

Report Attribute/Metric	Details
Market Size	2020 – USD: 865.7 Million
CAGR	3.11%
Base Year	2020
Forecast Period	2021–2027
Historical Data	2018-2019
Forecast Units
Report Coverage
Segments Covered	• By Process Type (Die-To-Die Bonding, Die-To-Wafer Bonding, Wafer-To-Wafer Bonding) • By Technology (Die Bonding (Epoxy Die Bonding, Eutectic Die Bonding, Flip-chip Attachment, Hybrid Bonding), Wafer Bonding (Direct Wafer Bonding, Anodic Wafer Bonding, TCB Wafer Bonding, Hybrid Bonding) • By Type (Die Bonder, Wafer Bonder, Flip-chip Bonder) • By Application (RF Devices, Mems and Sensors, Cmos Image Sensors, LED, 3D NAND)
Geographies Covered	• North America (US, Canada, and Mexico) • Europe (UK, Germany, France, and Rest of Europe) • Asia-Pacific (China, Japan, India, and Rest of Asia-Pacific) • Middle East & Africa • South America
Key Vendors	• BE Semiconductor Industries N.V. (Netherlands) • ASM Pacific Technology Ltd (Singapore) • Kulicke & Soffa (Singapore) • Panasonic (Japan) • Fuji Corporation (Japan) • Yamaha Motor Robotics Corporation Co. (Japan) • SUSS MicroTech SE (Germany) • Shiaura Mechatronics (Japan)
Key Market Opportunities
Key Market Drivers	• Drivers • Growing demand for miniature electronic components • Increasing adoption of stacked die technology in IoT devices • Rising demand for electric and hybrid vehicles • Restraint • High cost of ownership • Opportunity • Increasing demand for 3D semiconductor assembly and packaging • Growing adoption of IoT and AI in automotive sector • COVID-19 Impact Analysis • Impact on Semiconductor Manufacturers • Impact on Model Manufacturers • Impact on Device Manufacturers • COVID-19 Impact on Supply Chain Delays

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