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    Chip On Flex Market Size

    ID: MRFR/SEM/1483-CR
    100 Pages
    Ankit Gupta
    January 2017

    Chip on Flex Market Research Repor By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Industry Size, Share and Trends 2030

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    Chip On Flex Size

    Chip On Flex Market Growth Projections and Opportunities

    The Chip On Flex (COF) market is a dynamic sector influenced by various market factors that play a crucial role in shaping its growth and trajectory. One of the primary drivers of the COF market is the increasing demand for compact and lightweight electronic devices. As consumers continue to seek smaller and more portable gadgets, the need for flexible and space-saving solutions becomes paramount. COF technology, with its ability to integrate chips onto flexible substrates, addresses this demand effectively.

    Furthermore, the rapid advancements in semiconductor technology contribute significantly to the growth of the COF market. As chip manufacturers develop smaller and more powerful chips, the compatibility and efficiency of COF technology become increasingly appealing. This aligns with the ongoing trend of miniaturization in the electronics industry, where smaller and thinner devices are preferred. The adaptability of COF to accommodate these smaller and advanced chips positions it as a key player in the market.

    Globalization and the rise of emerging economies also play a pivotal role in the COF market dynamics. With the increasing penetration of smartphones, wearables, and other electronic devices in developing regions, the demand for COF solutions rises. Manufacturers are keen on adopting COF technology to produce cost-effective and innovative electronic components. This surge in demand from emerging markets contributes significantly to the overall expansion of the COF market.

    The automotive industry is another influential factor shaping the COF market. As automotive manufacturers incorporate more electronic components into vehicles, the need for flexible and reliable solutions like COF becomes evident. COF technology offers the flexibility and durability required for the challenging environments within automotive applications. The growing trend of electric vehicles and smart automotive systems further fuels the demand for COF in this sector.

    Moreover, the increasing focus on Internet of Things (IoT) devices contributes substantially to the growth of the COF market. The interconnectivity of devices in IoT applications demands flexible and space-efficient solutions, making COF an ideal choice. From smart home devices to industrial IoT applications, COF technology provides the necessary integration capabilities without compromising on performance.

    Supply chain dynamics also influence the COF market, particularly in terms of raw materials and manufacturing processes. The availability and cost of materials used in COF production, such as flexible substrates and conductive materials, impact the overall pricing and competitiveness of COF solutions in the market. Additionally, advancements in manufacturing techniques and processes contribute to improved efficiency and reduced production costs, further driving the market forward.

    The regulatory landscape and standards in the electronics industry also impact the COF market. Compliance with international standards and regulations is essential for manufacturers to ensure the reliability and safety of their COF products. Adherence to these standards not only enhances product quality but also instills confidence in consumers and industry partners.

    Market Summary

    As per Market Research Future Analysis, the Global Chip-on-Flex (COF) Market is a semiconductor assembly technology that directly mounts microchips on flexible circuits, enhancing design efficiency and product performance. The market is driven by the rising demand for compact and flexible electronics across various sectors, including displays, sensors, and biomedical implants. The market is projected to grow from approximately USD 1,437 Million in 2016 to USD 1,868.63 Million by 2030, with a CAGR of 3.7%. However, growth may be hindered by rising raw material costs and evolving consumer demands for more efficient electronics. The market is segmented by type, application, and verticals, with single-sided COF holding a significant market share of 94.43%.

    Key Market Trends & Highlights

    Key trends influencing the Chip-on-Flex market include technological advancements and regional growth dynamics.

    • Market Size in 2016: USD 1,437 Million; Expected Market Size by 2030: USD 1,868.63 Million.
    • Single-sided COF captures 94.43% of the market share.
    • Europe holds the largest market share, projected to grow significantly during the forecast period.
    • Asia Pacific is expected to record the highest growth rate due to numerous manufacturers in China.

    Market Size & Forecast

    2016 Market Size USD 1,437 Million
    2030 Market Size USD 1,868.63 Million
    CAGR 3.7%
    Largest Regional Market Europe.

    Major Players

    Key players in the Chip-on-Flex market include LGIT Corporation (U.S.), Stemko Group (Korea), Flexceed (Japan), Chipbond Technology Corporation (Taiwan), and Danbond Technology Co. Ltd. (China).

    Market Trends

    Chip On Flex Market Market Drivers

    Market Segment Insights

    Key Players and Market Share Insights

    The prominent players in the market of chip on flex (COF) market are – LGIT corporation (U.S.), Stemko group (Korea), Flexceed(Japan), Chipbond technology corporation(Taiwan), CWE(Taiwan),

    Danbond technology

    co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

    Market Segmentation:

    The Global chip on flex Market has been segmented on the basis of types, applications and verticals. 

    The types of chip on flex are one sided chip on flex and others. 

    The COF applications comprises of static and dynamic flexing. 

    The various verticals of chip on flex market are military, medical, aerospace, electronics and others.

    Market Regional Analysis

    The regional analysis of chip on flex market is being studied for areas such as Asia pacific, North America, Europe and rest of the world.

    Asia pacific is expected to record highest growth rate owing to existence of large number of chip on flex manufacturers in china like Danbond Technology, AKM Industrial, Compass Technology Company and others.  Asia pacific will be followed by North America owing to increased adoption of new technologies especially in automobile sector.  American depository of shares is also helping in mergers of various organizations to enhance the production capabilities in chip on flex market.  Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market.

    Intended Audience

      • COF manufactures
      • Industries such as aerospace, automotive, IT, industrial, and medical, among others
      • Government institutions
      • Research institutions
      • Adhesive manufacturers
      • Conductor and insulator manufacturers like silver, copper and others

    Regional Insights

    Industry Developments

    Market Segmentation

    Market Segmentation:

    Intended Audience
    • COF manufactures
    • Industries such as aerospace, automotive, IT, industrial, and medical, among others
    • Government institutions
    • Research institutions
    • Adhesive manufacturers
    • Conductor and insulator manufacturers like silver, copper and others

    Report Scope

    Attribute/Metric Details
    Market Size in 2030 USD 1,868.63 Million
    Compound Annual Growth Rate (CAGR) 3.7% (2022-2030)
    Base Year 2021
    Forecast Period 2022-2030
    Historical Data 2020
    Forecast Units Value (USD Million)
    Report Coverage Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
    Segments Covered Type, Application, Verticals
    Geographies Covered North America, Europe, Asia-Pacific, and Rest of the World (RoW)
    Countries Covered The U.S, Canada, Mexico, Germany, France, UK, China, Japan, India, Australia, South Korea, UAE, and Brazil
    Key Companies Profiled LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand)
    Key Market Opportunities The rapid adoption of modern technologies in automobile sector.
    Key Market Dynamics Increasing need for small and flexible electronics in various applications.

    Market Highlights

    Author

    Ankit Gupta
    Senior Research Analyst

    She holds an experience of about 6+ years in market research and business consulting, working under the spectrum of information communication technology, telecommunications and semiconductor domains. aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.

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    FAQs

    At what CAGR the global market for Global Chip on flex is expected to rise in the future?

    A CAGR of 3.7% has been calculated for the Global Chip on flex’s growth in the future.

    Which region has been regarded as the most significant recording highest Global Chip on flex market share?

    Europe has been regarded as the most significant region for market share and is growing with a market share of USD 1,868.63 Million by 2030.

    How has the global Chip on flex market maintained its growth graph currently?

    The activities such as joint ventures, mergers and acquisitions, new product developments, and research and developments has helped global Chip on flex market maintained its growth graph.

    Which top names of key players have been included in the analysis of Global Chip on flex market?

    Stemko group(Korea), Flexceed(Japan), LGIT corporation (U.S.), Chipbond technology corporation(Taiwan), CWE(Taiwan) are the top names of key players.

    What are the segments mentioned in the market for Global Chip on flex market?

    The segments such as types, applications and verticals are mentioned in the market study for Global Chip on flex.

    1. MARKET INTRODUCTION
      1. INTRODUCTION
      2. SCOPE OF STUDY
        1. ASSUMPTIONS
        2. LIMITATIONS
      3. MARKET
    2. RESEARCH METHODOLOGY
      1. RESEARCH NETWORK SOLUTION
      2. PRIMARY RESEARCH
      3. SECONDARY RESEARCH
      4. FORECAST MODEL
        1. MARKET SIZE ESTIMATION
    3. MARKET DYNAMICS
      1. INTRODUCTION
      2. MARKET DRIVERS
      3. MARKET OPPORTUNITIES
      4. MARKET RESTRAINTS
    4. EXECUTIVE SUMMARY
    5. MARKET FACTOR ANALYSIS
      1. PORTER’S
      2. SUPPLY CHAIN ANALYSIS
    6. GLOBAL CHIP ON
      1. INTRODUCTION
      2. MARKET STATISTICS
        1. ONE SIDED CHIP ON FLEX
        2. BY APPLICATIONS
        3. BY VERTICALS
        4. BY GEOGRAPHY
    7. COMPETITIVE
      1. MARKET SHARE ANALYSIS
      2. COMPANY PROFILES
        1. LGIT
        2. STEMKO GROUP (KOREA)
        3. FLEXCEED (JAPAN)
        4. CHIPBOND TECHNOLOGY CORPORATION (TAIWAN)
        5. CWE (TAIWAN)
        6. AKM INDUSTRIAL COMPANY LTD. (CHINA)
        7. COMPASS TECHNOLOGY COMPANY LIMITED (HONG KONG)
        8. COMPUNETICS (U.S.)
        9. STARS MICROELECTRONICS PUBLIC COMPANY LTD (THAILAND)
    8. List of Tables
    9. CANADA CHIP ON FLEX MARKET, BY TYPE
    10. EUROPE CHIP ON FLEX MARKET, BY TYPE
    11. GERMANY CHIP ON FLEX MARKET, BY TYPE
    12. FRANCE CHIP ON FLEX MARKET, BY TYPE
    13. U.K. CHIP ON FLEX MARKET, BY TYPE
    14. List of Figures
    15. ROW CHIP ON FLEX MARKET, BY VERTICALS (%)

    Chip On Flex Market Segmentation

    Market Segmentation Overview

    • Detailed segmentation data will be available in the full report
    • Comprehensive analysis by multiple parameters
    • Regional and country-level breakdowns
    • Market size forecasts by segment
    Infographic

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