As per MRFR Analysis, the global Soldering Equipment Market was valued at USD 562.7 Billion in 2023 and is projected to reach USD 1,294.5 Billion by 2032, growing at a CAGR of 9.7% from 2024 to 2032. Key drivers include the rising demand for smart electronics, advancements in energy-efficient devices, and automation in soldering processes. The market is significantly influenced by the expansion of the electronics refurbishment sector and the development of innovative soldering materials, such as low-lead and nanoparticle-based solders, which enhance reliability and reduce energy costs. The North America region dominated the market in 2022, accounting for 45.80% of the share, driven by a robust refurbishing sector and semiconductor manufacturing.
The Soldering Equipment Market is witnessing significant growth driven by technological advancements and increasing demand across various sectors.
Key players include Ersa GmbH, Pillarhouse International Ltd., RPS Automation Llc., Flacon Electronics Co. Ltd., JBC S.L, SEHO Systems GmbH, ACE Production Technologies Inc., and American Hakko Products, Inc.
Type: Secondary Research, Primary Research, MRFR Database and Analyst Review
The market is anticipated to be driven primarily by rising demand for smart electronics and the development of energy-efficient devices. Traditional micrometre soldering tools in the paste have a number of drawbacks, including high melting temperatures, which could cause unwelcome stress during the reflow operation, limited applications, and connection flaws. This prompted the development of several sub-microscopic and nanoparticle-based soldering tools. The expansion of the electronics refurbishment sector is anticipated to be the main driver of the soldering equipment market. The demand for these materials is also anticipated to increase over the projected period as a result of expanding electronic device production in the area and the existence of an important electronics aftermarket business. Significant research and development has gone into developing cutting-edge soldering tools, such Sn-Bi-Ag alloy, which has helped reduce thermal excursion during electronic assembly. In turn, this has made it unnecessary to employ the traditional wave soldering procedure, improving reliability and lowering energy costs. The replacement of lead solders has received significant attention from numerous governments throughout the world due to their harmful nature. However, a low lead-based solder is an environmentally friendly substitute that can be used up until the regulatory bodies enforce a complete prohibition. It is anticipated that increased adoption of these low-lead materials will support market expansion.
Over the course of the projected period, process automation advancements in soldering techniques are also anticipated to support market expansion. Automation has reduced the need for human involvement throughout the soldering process, increasing productivity. As a result, the market is anticipated to increase significantly in the years to come.
As new technologies are introduced, key players in the market for soldering stations and accessories are creating more sophisticated and high-quality products. Numerous new products were introduced to the market over the historical forecast period. These goods have distinct features and cutting-edge technology. One of the remarkable qualities of JBC stations is the ability to sleep and hibernate. This feature aids in bringing down the tool's tip temperature when it's not in use. A
s a result, you are permitted to use the tip up to five times more often than usual. The market for soldering equipment supports the growing demand for smaller devices as most electronics are predicted to become more compact. Despite being smaller than earlier generations, these devices contain a far higher component density and more connections per component. This means that while preserving the lowest form factor feasible, electronics can be more sophisticated and effective than ever before. Even more simplicity is provided by the fact that components can be positioned on either side of the circuit board. Less holes need to be drilled onto the boards, which leads to assembly processes that are quicker and more automated. All of this results in less time needed for production and setup, as well as lower costs. Thus, driving the Soldering Equipment market revenue.
The global Soldering Equipment market segmentation, based on Type, includes Reflow Soldering, Induction Soldering, Hot-bar Reflow, Laser Soldering, Mechanical Soldering, and Aluminum Soldering. Reflow soldering segment accounted for the largest revenue share in 2022. As it prevents damage from overheating, it is one of the methods for soldering that is most frequently employed in the electronics sector. The segment will develop because the process may also be applied to mass production.
The global Soldering Equipment market segmentation, based on Application, includes Consumer Electronics, Networking & Communication, Automotive, Aerospace & Defense, and Others. Consumer electronics segment dominated the global Soldering Equipment market in 2022. The expansion of this application area can be connected to the rising global demand for electronic gadgets. Additionally, the number of electronics manufacturing facilities has expanded in China, India, and South Korea due to increasing urbanisation, which is driving demand in the worldwide soldering equipment market. As a result of technical advancements and increasing product demand from several end-use industries worldwide, such as consumer goods and appliances, and telecommunications, the semiconductor business is also becoming more significant.
Figure 1: Global Soldering Equipment Market, by Application, 2022 & 2032 (USD Billion)
Type: Secondary Research, Primary Research, MRFR Database and Analyst Review
By region, the study provides the market insights into North America, Europe, Asia-Pacific and Rest of the World. The North America Soldering Equipment Market dominated this market in 2022 (45.80%). This was linked to the country's expanding refurbishing sector. The growth is anticipated to increase during the projection period due to increased manufacture of sophisticated semiconductor devices. Further, the U.S. Soldering Equipment market held the largest market share, and the Canada Soldering Equipment market was the fastest growing market in the North America region.
Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.
Figure 2: GLOBAL SOLDERING EQUIPMENT MARKET SHARE BY REGION 2022 (USD Billion)
Type: Secondary Research, Primary Research, MRFR Database and Analyst Review
Europe Soldering Equipment market accounted for the healthy market share in 2022. This is a result of the rise in demand for cutting-edge equipment from the electronics, automotive, and construction sectors. Further, the German Soldering Equipment market held the largest market share, and the U.K Soldering Equipment market was the fastest growing market in the European region.
The Asia Pacific Soldering Equipment market is expected to register significant growth from 2023 to 2032. It is predicted that the rise of the industry will be supported by the rising number of electronic device repair shops, which has led to a major growth of the electronics aftermarket in the region. Due to the shrinking size of devices, demand for these items in consumer electronics is predicted to increase, which is expected to fuel market expansion. Moreover, China’s Soldering Equipment market held the largest market share, and the Indian Soldering Equipment market was the fastest growing market in the Asia-Pacific region.
Leading market players are investing heavily in research and development in order to expand their product lines, which will help the Soldering Equipment market, grow even more. Market participants are also undertaking a variety of strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, Soldering Equipment industry must offer cost-effective items.
Manufacturing locally to minimize operational costs is one of the key business tactics used by manufacturers in the global Soldering Equipment industry to benefit clients and increase the market sector. In recent years, the Soldering Equipment industry has offered some of the most significant advantages to medicine. Major players in the Soldering Equipment market, including Ersa GmbH, Pillarhouse International Ltd., RPS Automation Llc., Flacon Electronics Co. Ltd., JBC S.L, SEHO Systems GmbH, ACE Production Technologies Inc., Blundell Production Equipment Ltd., American Hakko Products, Inc., JUKI Automation, PACE Europe Ltd., The Harris Products Group, Inductelec Ltd., JAPAN UNIX Co. Ltd., and Radyne Corporation, are attempting to increase market demand by investing in research and development operations.
The global electronics, semiconductor, thin-film, and thermal management markets are served by the Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier. Products include brazes, indium, gallium, germanium, and tin metals and inorganic compounds, indium, gallium, and fluxes, solders and fluxes, thermal interface materials, sputtering targets, and NanoFoil. The 1934-founded business includes offices and factories in China, Germany, India, Malaysia, Singapore, the United Kingdom, South Korea, and the United States. Two new AuSn pastes created for the higher processing temperatures and assembly needs required in high-power LED module array applications, such as those in the automotive, infrastructure, and horticulture, were added to Indium Corporation's range of tried-and-true pastes in June 2022.
Kester is a producer and supplier of interconnecting materials, as well as a provider of related services, for the markets for micro- and electronic-component assembly. There are solder pastes, thermal interface materials, lead-free bar solder alloys, solid and fluxed cored wires, sticky soldering fluxes, ultra-spheres, and solder forms solutions available. Metal analysis is one of the services offered by the company. Other services include lead-free solutions like alloys, component finishes, board finishes, flux and solder paste considerations, recommendations, references, and a solder analysis calculator. Electronic components and lead clippings are another service offered by the company. OEMs and service providers for electronics manufacturing are its clients. ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications, was introduced by Kester in May 2022. The alloy is intended to perform better than current low temperature alloys on the market in terms of drop shock and thermal cycling.
Ersa GmbH
Pillarhouse International Ltd.
RPS Automation Llc.
Flacon Electronics Co. Ltd.
JBC S.L
SEHO Systems GmbH
ACE Production Technologies Inc.
American Hakko Products, Inc.
JUKI Automation
PACE Europe Ltd.
The Harris Products Group
Inductelec Ltd.
JAPAN UNIX Co. Ltd.
Radyne Corporation
July 2022: A subsidiary of OK International and Dover, Metcal, a pioneer in tabletop soldering for electronics and industrial manufacturing, today announced the availability of its new HCT-910 Hot Air Rework System digital handheld convection tool. This hot air system is accurate, high-performance machinery that may be used for a variety of board soldering and reworking tasks.
Reflow Soldering
Induction Soldering
Hot-bar Reflow
Laser Soldering
Mechanical Soldering
Aluminum Soldering
Consumer Electronics
Networking & Communication
Automotive
Aerospace & Defense
Others
North America
US
Canada
Europe
Asia-Pacific
China
Japan
India
Australia
South Korea
Australia
Rest of Asia-Pacific
Rest of the World
Middle East
Africa
Latin America
| Report Attribute/Metric | Details |
| Market Size 2023 | USD 562.7 Billion |
| Market Size 2024 | USD 615.6 Billion |
| Market Size 2032 | USD 1,294.5 Billion |
| Compound Annual Growth Rate (CAGR) | 9.7% (2024-2032) |
| Base Year | 2023 |
| Market Forecast Period | 2024-2032 |
| Historical Data | 2018- 2022 |
| Market Forecast Units | Value (USD Billion) |
| Report Coverage | Revenue Forecast, Market Competitive Landscape, Growth Factors, and Trends |
| Segments Covered | Type, Application, and Region |
| Geographies Covered | North America, Europe, Asia Pacific, and the Rest of the World |
| Countries Covered | The U.S., Canada, German, France, U.K, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil |
| Key Companies Profiled | Ersa GmbH, Pillarhouse International Ltd., RPS Automation Llc., Flacon Electronics Co. Ltd., JBC S.L, SEHO Systems GmbH, ACE Production Technologies Inc., Blundell Production Equipment Ltd., American Hakko Products, Inc., JUKI Automation, PACE Europe Ltd., The Harris Products Group, Inductelec Ltd., JAPAN UNIX Co. Ltd., and Radyne Corporation |
| Key Market Opportunities | Emergence of nano particle based solder materials |
| Key Market Dynamics | Rising demand for smart electronics and the advent of energy-efficient electronics and advancements in the soldering techniques through process automation |
Soldering Equipment Market Highlights:
Frequently Asked Questions (FAQ) :
The global Soldering Equipment market size was valued at USD 562.7 Billion in 2023.
The global market is projected to grow at a CAGR of 9.7% during the forecast period, 2024-2032.
North America had the largest share in the global market
The key players in the market are Ersa GmbH, Pillarhouse International Ltd., RPS Automation Llc., Flacon Electronics Co. Ltd., JBC S.L, SEHO Systems GmbH, ACE Production Technologies Inc., Blundell Production Equipment Ltd., American Hakko Products, Inc., JUKI Automation, PACE Europe Ltd., The Harris Products Group, Inductelec Ltd., JAPAN UNIX Co. Ltd., and Radyne Corporation
The Reflow Soldering Type dominated the market in 2022.
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