ID: MRFR/IA - E/6858-CR | August 2020 | Region: Global | 94 pages
Soldering Equipment Market is estimated to reach a value of USD 911.3 Million by 2025, registering a CAGR of 9.56% during the forecast period.
Global Soldering Equipment Market is segmented based on Type, Application and Region.
Based on Type, the global market has been segmented into reflow soldering, induction soldering, hot-bar reflow, laser soldering, and mechanical and aluminum soldering. Among these, the reflow soldering segment dominated the market with a value of USD 151.2 million in 2019, and the segment is expected to register the highest CAGR of 11.10% during the review period.
Based on application, the global soldering equipment market has been segmented into consumer electronics, networking & communication, automotive, aerospace & defense, and others. Among these applications, the consumer electronics segment is expected to register the highest CAGR of 11% during the forecast period.
During the study, MRFR has analyzed some of the major players in the global soldering equipment market who have contributed to market growth. These include Ersa GmbH, Pillarhouse International Ltd., RPS Automation LLC, FLASON ELECTRONIC CO. LIMITED, JBC S.L, SEHO Systems GmbH, ACE Production Technologies, Inc., Blundell Production Equipment Ltd, American Hakko Products, Inc., JUKI Automation, PACE Europe Ltd., The Harris Products Group, Inductelec Limited, JAPAN UNIX Co. Ltd, and RADYNE CORPORATION. The companies emphasize product innovation and development to cater to enterprises across every industry vertical.
Based on region, the Global Soldering Equipment Market has been segmented into North America, Europe, Asia-Pacific, and the rest of the world.
Global Soldering Equipment Market, By Region, 2018
Source: MRFR Analysis
Asia-Pacific is expected to hold the largest share in the soldering equipment market throughout the forecast period, owing to the increase in foreign investments in developing the electric vehicle (EV) charging infrastructure due to the significant population base and the growing economies of China, India, Japan, and Thailand. In the soldering equipment market in Asia-Pacific, China is expected to hold the largest share and is expected to expand rapidly over the review period due to the growing per capita disposable income and the growing automotive and consumer electronics sectors. Additionally, the increasing focus of the governments towards strengthening the manufacturing facilities in emerging countries such as India and China is fueling the dominance of the region in the soldering equipment market.
North America is the second-largest regional market for soldering equipment and is expected to witness significant growth as the demand for electronic equipment is high in the region. The US dominated the North America soldering equipment market as the country has a developed economy and growing industries such as consumer electronics and aerospace & defense.
Global Soldering Equipment Market is segmented based on Type, Application, and Region. The soldering equipment market is anticipated to grow significantly in the coming years owing to rapid industrialization and increased manufacturing of electronic products and printed circuit boards (PCBs). Rapid technological advancements have resulted in many industries adopting new technologies and electrification to enhance the overall performance of the industries in terms of production and energy efficiency. The rise in urbanization and increasing per capita disposable income among individuals are the primary factors boosting the demand for new and advanced electronic products.
Soldering equipment is used for joining two or more electronic parts together by melting solder around the gap. Solder is a molten mixture of lead, tin, silver, and brass. Soldering equipment is used across various end-use industries, including automotive, energy & power, aerospace & defense, communication, and electricals & electronics. Soldering equipment techniques are classified as infrared reflow, hot gas convection, or vapor phase reflow. For double-sided PCBs, the reflow soldering process is repeated either using glue or solder paste to hold the components in place. Heller Industries, Inc. has developed two SMT reflow soldering technology-based ovens— the Heller Mark 7 SMT Reflow and the Heller Mark 5 SMT Reflow—to meet the advanced application requirements of users.
Key Questions Addressed by the Report
|Market Size||2025: USD 911.3 Million|
|CAGR||9.56% CAGR (2020-2027)|
|Forecast Units||Value (USD Million)|
|Report Coverage||Revenue Forecast, Competitive Landscape, Growth Factors, and Trends|
|Segments Covered||Type, and Application|
|Geographies Covered||North America, Europe, Asia-Pacific, and Rest of the World (RoW)|
|Key Vendors||Ersa GmbH, Pillarhouse International Ltd., RPS Automation LLC, FLASON ELECTRONIC CO. LIMITED, JBC S.L, SEHO Systems GmbH, ACE Production Technologies, Inc., Blundell Production Equipment Ltd, American Hakko Products, Inc., JUKI Automation, PACE Europe Ltd., The Harris Products Group, Inductelec Limited, JAPAN UNIX Co. Ltd, and RADYNE CORPORATION|
|Key Market Opportunities||
|Key Market Drivers||
Frequently Asked Questions (FAQ) :
The key factors influencing the global soldering equipment market’s growth are termed to be swelling investment for an expansion of fabrication and manufacturing activities and new government initiatives for infrastructure development.
RPS Automation LLC, Ersa GmbH, SEHO Systems GmbH, The Harris Products Group are the top soldering equipment key players in the global market.
At 7% CAGR, the global soldering equipment market will grow in the future.
The global soldering equipment market will observe growth between 2020 and 2027.
The global soldering equipment market will be gaining valuation up to USD 3 Billion by 2025.