ID: MRFR/SEM/0692-CR | February 2020 | Region: Global | 100 pages
As per the latest study conducted by Market Research Future (MRFR), the flexible printed circuit board market is likely to surpass a valuation of USD 27,900 Mn with CAGR Of 12.6% by the year 2023. The printed circuit board is extremely efficient and has interconnectivity solutions that are adapted to be used for a wide range of electronic devices with modernized printed circuit board design. These circuit boards are made up of conductive material which is designed on a flexible substrate and is used to avoid the complex structuring of wiring and other connectivities. Printed circuit boards act as an efficient interconnectivity option between electric devices like capacitors, resistors, and integrated circuits. From FBCB market you will mark the demand and growth in the field of aerospace and engineering.
COVID 19 ANALYSIS
VALUE CHAIN ANALYSIS
By the supply chain, from the printed circuit board manufacturers through the intermediaries better understanding of manufacturing and production process was understood better. The supply chain determines the importance of various stakeholders who contribute a major role in elaborating the growth of the market. The supply chain also helps in analyzing the influence of various suppliers and buyers on the FPCB market.
FPCB market sheds light on the regions of North America, Germany, France, United Kingdom, Russia, and China. The Asia Pacific region shows steady growth from 2019. People in this area are adopting the latest technology and using their investment in designing flexible printed circuit boards. China, India, and Japan are some of the countries where the rise in demand for printed circuit boards is high. The growth also took place in the region of the Middle East, Europe, Africa, Europe, and some other geographical regions.
The key players have adopted the partnership and have started merging with other players to expand their customer base and increase their flexible printed circuit board market share. It provides comprehensive competitive analysis and company profiles of major market players like Nippon Mektron ltd, Interflex Co Ltd, Sumitomo Electric Industries Ltd, Career technology, Fujikura Ltd, Nitto Denko Corporation, Career technology, Multi-Fineline Electronix, ICHIA Technologies Inc, Flexium Interconnect Inc., Zhen Ding technology holding ltd, are operating in the printed circuit board(PCB) market. The report gives a good analysis of the FCBs market and evaluates the investment pockets. It gives good analysis about the market trends and gives good future estimations which gives good determinations about the market potential and which helps in gaining profit. A company dealing with electrical solutions has worked for years for discovering such components which will help in developing rigid-flex in the cognitive systems. This helps in detecting the response of the human brain towards stimuli.
The report provides an in-depth analysis of the market overview of the flexible printed circuit market board. It also gives information about the printed circuit board manufacturers and assists the market players to give high priority to the market segmentation which gives high returns during the upcoming years. It gives information about the printed circuit board manufacturers focusing on the manufacturing of innovative products. It provides detailed information about the drivers, restraints, challenges, and opportunities prevailing in the market. The report summarizes the market trends and the strategic plans put forward by various stakeholders.
|Market Size||USD 27,900 Million|
|Forecast Units||Value (USD Million)|
|Report Coverage||Revenue Forecast, Competitive Landscape, Growth Factors, and Trends|
|Segments Covered||Type, Application Area|
|Geographies Covered||North America, Europe, Asia-Pacific, and Rest of the World (RoW)|
|Key Vendors||Nitto Denko Corporation, Zhen Ding Tech, bhflex Co. Ltd., Interflex Co. Ltd., Career Technologies, MFS Technology, Flexible Circuit, Daeduck GDS Co. Ltd., Sumitomo Electric Industries Ltd. and Fujikura Ltd|
|Key Market Opportunities||Integration of flexible-circuit laminates and thermal performance in electronic devices.|
|Key Market Drivers||
Frequently Asked Questions (FAQ) :
It is projected that the Global Flexible Printed Circuit Board Market will exhibit a strong CAGR of 12.6% from 2018 to 2023. The report covers some of the most important elements of the market. Market dynamics such as growth opportunities, trends and challenges are thoroughly discussed in the report.
Flexible Printed Circuit Board Market Size to Expand at a Notable CAGR Of 12.6% During 2018 - 2023. Global Flexible Printed Circuit Board Market is likely to surpass a valuation of USD 27,900 Mn by the year 2023.
Flexible electronics are increasingly being used in industrial applications such as glucose meter testing in the healthcare sector and navigation and cameras in the automotive industry.
The segmental analysis of the global flexible printed circuit board market is conducted on the basis of type, application area, and region.
Growing trend of miniaturization in electronic components is driving the adoption of flexible printed circuit boards. The global flexible printed circuit board market is expected to exhibit a CAGR of 12.6% during the forecast period (2018-2023). Flexible printed circuit board is an innovative electrical technology, witnessing a fast adoption in electronics application across healthcare, automotive, and fitness.
Flexible printed circuit board is also referred to flex circuit, flexible PCBs and flexible circuits. They are a systematic arrangement used for rigid printed components and circuitry which operate with or without a flexible cover and base material. The board is assembled and fabricated with components which allows a certain degree of flexibility. Such boards facilitate a connectivity and mechanical support to modern electrical components, pads, track among others.
Increased demand for white goods worldwide is having a positive impact on the global flexible printed circuit board market. Flexible displays are next-generation electronic displays, fabricated on a thin flexible circuit board or substrate. Flexible electronics are increasingly being used in industrial applications such as glucose meter testing in the healthcare sector and navigation and cameras in the automotive industry. The growing need for thermal performance, flexible-circuit laminates, and surface-mounted electronic components in consumer electronics opening new growth avenues for the market.
The segmental analysis of the global flexible printed circuit board market is conducted on the basis of type, application area, and region.
Based on type, the market has been segmented into multilayer flex, rigid flex, double-sided flex, and single-sided flex. The multilayer flex segment currently accounts for more than 37% share of the market. In 2017, the segment was valued at over USD 5,233.87 Mn and is expected to surpass a valuation of USD 10,000 Mn by 2023, reflecting an impressive growth rate. Multi-layer flex circuits offer great circuit density owing to their complex design. A multilayer flex circuit comprises bonded conductive layers that are interconnected through plated holes. Multi-layer flex circuits are widely used in aerospace & defense applications.
On the basis of application area, the market has been segmented into consumer electronics, manufacturing, aerospace & defense, medical devices, automotive, wearables, and others. The consumer electronics segment is expected to remain highly profitable throughout the assessment period. In 2017, the segmented was valued at USD 5,345.03 Mn. Smartphones, laptops, tablets, television sets, and printers have flexible printed circuit boards as a major component. Introduction of flexible displays in modern electronic devices is creating lucrative opportunities for flexible printed circuit board. The manufacturing segment accounts for the second-largest market share and likely to exhibit a CAGR of 11.7% during the assessment period.
The regions included in the study are North America, Europe, Asia-Pacific, and the rest of the world. Asia-Pacific leads the global flexible printed circuit board market. In 2017, Asia-Pacific accounted for 52.7% market share. The market in the region is currently valued at more than USD 7,400 Mn and is expected to surge at a CAGR of 12.2% during the assessment period. Presence of leading material substrate manufacturing companies in China, Japan, and Taiwan gives an edge to the APAC flexible printed circuit board market. Moreover, cost benefits along with the rapid growth of the consumer electronics manufacturing industry is having a positive impact on the market in APAC. North America accounts for the second largest share of the market in terms of value. In 2017, the North America flexible printed circuit board market stood at a valuation of USD 3,316.51 Mn and is projected to witness a CAGR of 14.0% between 2018 and 2023.
Some of the prominent companies operating in the global flexible printed circuit board market include bhflex Co. Ltd., Career Technologies, Flexible Circuit, Sumitomo Electric Industries Ltd., Fujikura Ltd., Daeduck GDS Co. Ltd., MFS Technology., Interflex Co. Ltd., Zhen Ding Tech and Nitto Denko Corporation.
The global flexible printed circuit board (FPCB) market is highly competitive with presence of several vendors offering comprehensive FPCB products, such as single side FPCB, double side FPCB, multi-layer FPCB, build-up FPCB, and others. The increasing demand for consumer electronics as well as miniaturization of electronic components, and growing adoption of flexible display technology are some of the factors expected to boost the growth of the global flexible printed circuit board market. Moreover, widening application scope of IoT is likely to impact the global flexible printed circuit board market. However, high manufacturing cost of flexible printed circuit boards is expected to hinder the growth of the global market during the forecast period.
According to MRFR analysis, the growth of the global flexible printed circuit board market is dependent on the market conditions and industrial developments. The key vendors in the global flexible printed circuit board market are bhflex Co. Ltd. (Vietnam), Career Technologies (Taiwan), Flexible Circuit (US), Sumitomo Electric Industries, Ltd. (Japan), Fujikura Ltd. (Japan), Daeduck GDS Co., Ltd., (South Korea), MFS Technology (China), Interflex co., ltd. (South Korea), Zhen Ding Tech (Taiwan), and NITTO DENKO CORPORATION (Japan).
These companies are focusing on enhancing the product portfolio with improved technologies to deliver advanced products to various industries. Moreover, these companies are the prominent providers of flexible printed circuit boards and are competing in the global market to provide high-quality flexible printed circuit boards to increase their geographic presence and enhance the customer and company engagement.
These companies follow organic as well as inorganic growth approach through product development, strategic partnerships, and collaborations to offer advanced flexible printed circuit boards. The competition in the global market is likely to intensify further due to growing new product launches, technological advancements, and mergers & acquisitions.
Sumitomo Electric Industries, Ltd offers electrical wires, communication wires, and cables. The company operates through the following business segments—automotive, infocommunications, electronics, industrial materials, environment and energy, and others. The company’s flexible printed circuits boards (FPCBs) comprise FPC for high-density component mounting, flip chip mounting FPC, thin and highly flexible, high-density multi-layer FPC, component-mounted FPC, FPC insulated with liquid polyimide, and non-halogen highly flexible PCBs. The company follows the organic growth strategy and believes in expanding its product portfolio according to the demand. It has strong presence in multiple markets, which gives competitive advantage to its peers. The company focuses on building strong corporate relationships by partnering with tech giants. Furthermore, with capability upscaling the company is expanding its footprint in the global market.
NITTO DENKO CORPORATION offers various products for industrial areas such as transportation, infrastructure, home appliances and electrical industries, electronic devices, packaging products, medical, and others. The company’s electronic device segment comprises flexible printed circuit boards. The flexible printed circuit boards consist of several products such as high-density and precision flexible printed circuit, environmental harmony type halogen-free FPC, ultra-thin double-sided FPC, and thin-film metal base board CISFLEX. The company follows an organic strategy as it believes in product innovation with research and development as a solution to improve the quality of its products to meet the customer requirements and strengthen its position in the global market.
Fujikura Ltd. is a manufacturer of electric cables and wires. The company operates through various business segments, namely energy business, automotive products, telecommunication business, electronic business, real estate business, and others. The company’s FPCs consist of four products—assembled FPC, multi-layer FPC, double-sided FPC, and single-sided FPC. The company follows both organic and inorganic growth strategies. By organic strategy, the company is working towards increasing its market presence. The company believes in continuous re-invention and transformation of the product by increasing investment in innovation, talent and international expansion rather than limiting the focus only on operational efficiency and short-term profitability.
Zhen Ding Tech is engaged in the manufacturing and processing of various printed circuit boards and offers it to industries such as automotive, medical, aerospace, military, consumer electronics, and others. The company offers various flexible printed circuit board (FPCB) products including high-density interconnection (HDI), flexible printed circuit, a rigid printed circuit board (R-PCB), and IC substrate (ICs). The company follows the organic strategy with an aim to expand its market base across the world with continuous product innovation. With high investment in research and development, the company is working to diversify its product portfolio in order to expand its presence and gain maximum share in the global market.
Career Technologies is in the provision of manufacturing, research and development, design, processing, and trading of flexible PCBs. The company delivers various products such as single-sided flex circuits, double-sided flex circuits, air gap structure, rigid-flex board, double access flex circuits, and multilayer flex circuits. The company aims to expand its product portfolio with respect to the market demand through strategic partnerships and collaborations.