Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC) Market: By Product (PSiP and PwrSoC), Application Area (Telecom and IT, Automotive, Consumer Electronics, Medical Devices and Military & Defense) - Forecast till 2027

Power Supply in Package & Power Supply on Chip Market Analysis

Power Supply in Package & Power Supply on Chip Market is predicted to touch USD 2,300 Million between 2017- 2023, reveals the latest Market Research Future’s (MRFR) power supply in package and power supply on chip market forecast report. The strong growth of the market can be accredited to the rising penetration of consumer electrics.

COVID-19 Analysis 

COVID-19 has turned the globe on its head. This had a noteworthy impact on just everyone and everything, and the power supply in package and power supply on chip market, on the whole, is no exception. This market is impacted by the pandemic due to the majority of OEMs experiencing a fall in demand for end-products. Implementation of varied regulations by the government of different countries to handle the outbreak like fall in demand for end-products, limited manpower, limited production, and shutdown of manufacturing facilities completely are likely to impact the market growth. Thanks to big disruptions to supply chains, this market is suffering like never before. It has not been helped following the uncertainty which exists due to the dynamic scope of COVID-19 coupled with the companies and government's unpredictable reactions, most of which have halted operations on a temporary basis. On the other hand, electronic manufacturers are anticipating shipment delays with delays of shipping from China as well as other countries where this deadly virus is creating maximum havoc, thus having a huge negative impact on manufacturers. 

Market Dynamics

• Drivers

Simple Manufacturing Process to Bolster Market Growth 

The simple manufacturing process of PSiP and PwrSoC over conventional DC to DC converters ICs is predicted to bolster market growth in the forecast period.

Additional factors adding to the power supply in package and power supply on chip market size include increasing outlays in research and development pipelines, technological advancements in packaging technology, rising focus on applications including higher input voltage range, increasing use in communications infrastructure, elimination of the need for external components and availability of shorter design process version, incorporation of mixed-signal technology with PSiC and PwrSoC IC, and development of gallium nitride (GaN) and silicon-carbide (SiC) creating new application opportunities for PSiP and PwrSoC ICs. Besides, innovations in silicon-based technology, and the growing use of wide-bandgap materials such as SiC and GaN electrical modules are also adding to the power supply in package and power supply on chip market growth. 

• Opportunities

Affordable Manufacturing Cost and Low Power Consumption to Offer Robust Opportunities 

Lower power consumption coupled with affordable manufacturing costs along with greater fault management and functionality for various applications makes them a highly sought-after IC solution that is likely to offer robust opportunities to key players in the upcoming years.

• Restraints

Design Complexities to Act as Market Restraint 

Complexity in designing is likely to have a negative impact on the power supply in package and power supply on chip market demand over the forecast period.

• Challenges

High Cost to Act as a Market Challenge 

The high cost of these components may act as a market challenge over the forecast period. 

Market Segmentation

The Power Supply in Package & Power Supply on Chip Market has been segmented based on Application & Product.

PSiP Segment to Lead Power Supply in Package and Power Supply on Chip Market 

By product, the power supply in package and power supply on chip industry is segmented into PwrSoC and PSiP. Of these, the PSiP segment will lead the market over the forecast period. It is likely to touch USD 2,000 million at a healthy CAGR by 2023. This component has wide applications in medical devices, desktop systems, laptops, set-top boxes, routers, servers, telecom devices, portable devices, and automotive systems that are adding to the growth of the segment.

Consumer Electronics to Dominate Power Supply in Package and Power Supply on Chip Market

By application, the power supply in package and power supply on chip market is segmented into military and defense, medical devices, consumer electronics, automotive, and telecom and IT. Of these, the consumer electronics segment will dominate the market over the forecast period. It is predicted to touch USD 1,354.4 million by 2023.

Regional Analysis

APAC to Have Lions Share in Power Supply in Package and Power Supply on Chip Market

By region, the global power supply in package and power supply on chip market covers the recent trends and opportunities across Europe, North America, the Asia Pacific (APAC), South America, & the Middle East and Africa (MEA). Among these, the APAC region is predicted to have the lions share in the forecast period. The region is predicted to develop at a healthy 26.9% CAGR over the forecast period. Massive transformation in the manufacturing sector is adding to the global power supply in package and power supply on chip market share in the region. China holds the utmost share in the market for its rise as a global manufacturing hub that has drawn noteworthy investment in the countries. Besides, the presence of large end use manufacturing industries, growing IT industry, increasing internet penetration, rapid economic growth, and increasing use of digital devices are also adding market growth. 

North America to Hold Second-Largest Share in Power Supply in Package and Power Supply on Chip Market

In North America, the global power supply in package and power supply on chip market is predicted to grasp the second-largest share in the forecast period. The presence of a strong consumer electronics market coupled with the presence of key power modules OEMs (original equipment manufacturers) is adding to the global power supply in package and power supply on chip market growth in the region.

Competitive Landscape

The power supply in package & power supply on chip market is highly competitive for the presence of third-party vendors, manufacturers, and suppliers in higher concentration. The key players are incorporating several strategies such as mergers and acquisitions, strategic alliances, and collaborations to stay at the forefront and also widen their strength in the market. They are highly focusing on increasing product portfolio as well as product innovation.

Key Players

• Bel Fuse Inc.


• Texas Instruments Incorporated


• ON Semiconductor


• Panasonic Corporation


• Vicor Corporation


• Jiangsu Changjiang Electronics Technology Co. Ltd.


• Amkor Technology


• TDK Corporation


• Intel Corporation


• ASE Group

Recent Developments

• January 2021- Dana Inc. has built electrification vertical for commercial vehicles. The company integrates motors, software, controls, inverters, along with thermal management for batteries & power electronics.

Report Scope 

The power supply in package & power supply on chip market offers valuable information related to the market growth, market dynamics, market share assessment, profit margin, and market estimations for the years 2017- 2023. The report also sheds light on the key market factors that can have a positive impact on the market growth along with the hurdles and challenges which key players may face for a comprehensive understanding of the readers.

By Product

• PwrSoC


• PSiP

By Application

• Military and Defense 


• Medical Devices 


• Consumer Electronics 


• Automotive 


• Telecom and IT

By Region

• North America


• Europe


• Asia Pacific (APAC)


• South America 


• The Middle East and Africa (MEA)

Frequently Asked Questions (FAQ) :

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