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The Market Dynamics of Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC) have witnessed significant evolution, driven by technological advancements and the ever-growing demand for compact and efficient electronic devices. PSiP refers to the integration of power supply components within a single package, streamlining the power delivery process. On the other hand, PwrSoC takes miniaturization a step further by integrating power supply functions directly onto the semiconductor chip. These two markets have gained prominence due to their ability to address the challenges of space constraints, energy efficiency, and overall system performance in diverse applications.
In recent years, the demand for smaller and more power-efficient electronic devices has surged, fueled by the proliferation of portable gadgets, wearable technology, and the Internet of Things (IoT). This has led to a paradigm shift in power supply architectures, with a growing emphasis on compactness and integration. PSiP and PwrSoC technologies have emerged as solutions to cater to these demands, offering advantages such as reduced footprint, improved thermal management, and enhanced overall system reliability.
One key driver influencing the market dynamics is the relentless pursuit of increased energy efficiency. As electronic devices become more ubiquitous, the need for energy-efficient power supply solutions becomes paramount. PSiP and PwrSoC technologies enable manufacturers to design power systems that minimize energy losses and optimize power delivery, contributing to the overall efficiency of electronic devices. This focus on energy efficiency aligns with global initiatives to reduce power consumption and environmental impact.
Moreover, the increasing complexity of electronic systems necessitates innovative approaches to power delivery. Traditional discrete power components are often bulky and prone to electromagnetic interference. PSiP and PwrSoC technologies address these challenges by offering a more integrated and compact solution. This integration not only simplifies the design process but also enhances the overall performance and reliability of the power supply, making these technologies attractive for a wide range of applications, from consumer electronics to industrial systems.
The automotive industry is another significant driver for the PSiP and PwrSoC markets. As electric vehicles (EVs) and autonomous driving technologies gain traction, there is a growing need for power supply solutions that are not only compact but also capable of handling the high power demands of electric propulsion systems. PSiP and PwrSoC technologies, with their inherent advantages in size and efficiency, play a crucial role in meeting these demands and contribute to the ongoing electrification of the automotive sector.
However, challenges such as thermal management, reliability, and standardization remain on the horizon for the PSiP and PwrSoC markets. Efficient heat dissipation becomes crucial as power densities increase in smaller form factors. Manufacturers need to address these challenges to ensure the widespread adoption of these technologies across different applications.
Power Supply in Package Chip Market Highlights:
Global Power Supply in Package and Power Supply on Chip Market Overview:
Power Supply in Package and Power Supply on Chip Market Size was valued at USD 1.6 Billion in 2022. The Power Supply in Package and Power Supply on Chip market industry is projected to grow from USD 1.7 Billion in 2023 to USD 2.5 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 5.00% during the forecast period (2023 - 2032). Growing automation system usage and booming communications industries, are the key market drivers enhancing the market growth.
Product: Secondary Research, Primary Research, MRFR Database and Analyst Review
Power Supply in Package and Power Supply on Chip Market Trends
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The growing adoption of automation systems the market growth
The growing deployment of automation systems is one of the main drivers of the power supply in package and power supply on chip sectors. A market trend that is now emerging is automation. Offices and residences are both embracing automation. This automated technology may reduce the requirement for human intervention. Every task is streamlined and made simpler. However, a lot of energy might be consumed by these automated devices. An effective voltage control system is needed in electronic automation systems. The rising demand for these automation technologies will be advantageous to the industry.
The market need for power supplies in packages and power supplies on chips is significantly increased by these factors. Another significant market driver is the expanding telecoms sector. The telecommunications industry makes use of high voltage machinery. Utilising power supplies in packages can boost productivity and cut costs. The establishment of new tele companies will spur growth. The rising popularity of energy-efficient appliances is a key additional factor. The energy-efficient components inside the box require a power supply. The electrical devices that incorporate chips can benefit from this power source. The PSIP offers many advantages across numerous industries. The rise of the power supply in packages and power supply on chips is spectacular as a result of these market dynamics.
Semiconductor enterprises have been addressing power supply miniaturisation more and more in recent years thanks to their ability to generate cutting-edge processing and functional product formats like power supply-in-package (PSiP) and power supply-on-chip (PwrSoC).- Become more integrated. This rise in the number of functionally integrated hardware products marks a turning point for the power supply industry, which is moving sharply away from traditional power supply manufacturing (with a focus on the assembly of power supply modules or bricks from discrete components) and towards a growing emphasis on power supply products delivered directly from the semiconductor and microelectronics industries.- Look for new gear and software. This trend will be made possible by improvements in semiconductor, magnetic, capacitor, and packaging materials and technologies, which will lead to products that function at several MHz frequencies.
The rising use of data centres will present opportunities for market expansion. A vast number of data centres are anticipated in the upcoming years. Data centres will be used for a variety of purposes in the upcoming years. These centres have a big demand for organising and keeping data. The increased utilisation of power supply in data centres will present significant opportunities.
Data centres are becoming more crucial for managing information. Better data use will be required more and more in the coming years. A reliable power source is made feasible via the PSIP. The rising demand in developing nations is another factor contributing to growth. The energy requirements of developing nations are significant. We urgently require better and more effective energy sources. Furthermore, there has been a considerable investment in this region. These factors have caused the chip and package power supply sectors to grow at a faster rate. Thus, driving the Power Supply in Package and Power Supply on Chip market revenue.
Power Supply in Package and Power Supply on Chip Market Segment Insights:
Power Supply in Package and Power Supply on Chip Product Insights
The Power Supply in Package and Power Supply on Chip Market segmentation, based on product, includes PSIP and PwrSoc. PSIP segment accounted for the largest revenue share in 2022. This may be connected to the increase in packaged power supply requirements.
Power Supply in Package and Power Supply on Chip Application Insights
The Power Supply in Package and Power Supply on Chip Market segmentation, based on application, includes medical devices, automotive, consumer electronics, military and defense, and telecom and IT. Automotive segment dominated the Power Supply in Package and Power Supply on Chip Market in 2022. This is a result of rising PSIP and PwrSoc demand in the automotive industry.
Figure 1: Power Supply in Package and Power Supply on Chip Market, by Application, 2022 & 2032 (USD Billion)
Product: Secondary Research, Primary Research, MRFR Database and Analyst Review
Power Supply in Package and Power Supply on Chip Regional Insights
By region, the study provides the market insights into North America, Europe, Asia-Pacific and Rest of the World. The North America Power Supply in Package and Power Supply on Chip Market dominated this market in 2022 (45.80%). PSIP has a great deal of potential in this area. In this industry, there are also less cost barriers. The market for consumer electronics will be very large. Further, the U.S. Power Supply in Package and Power Supply on Chip market held the largest market share, and the Canada Power Supply in Package and Power Supply on Chip market was the fastest growing market in the North America region.
Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.
Figure 2: Power Supply in Package and Power Supply on Chip Market SHARE BY REGION 2022 (USD Billion)
Product: Secondary Research, Primary Research, MRFR Database and Analyst Review
Europe Power Supply in Package and Power Supply on Chip market accounted for the healthy market share in 2022. In the UK and Germany, PSIP will be utilised more frequently during the projection period. Further, the German Power Supply in Package and Power Supply on Chip market held the largest market share, and the U.K Power Supply in Package and Power Supply on Chip market was the fastest growing market in the European region.
The Asia Pacific Power Supply in Package and Power Supply on Chip market is expected to register significant growth from 2023 to 2032. The manufacturing and medical device industries will have a particularly strong demand for this product. Additionally, countries like China, Japan, and India will diversify their product lines. Moreover, China’s Power Supply in Package and Power Supply on Chip market held the largest market share, and the Indian Power Supply in Package and Power Supply on Chip market was the fastest growing market in the Asia-Pacific region.
Power Supply in Package and Power Supply on Chip Key Market Players & Competitive Insights
Leading market players are investing heavily in research and development in order to expand their product lines, which will help the Power Supply in Package and Power Supply on Chip market, grow even more. Market participants are also undertaking a variety of strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, Power Supply in Package and Power Supply on Chip industry must offer cost-effective items.
Manufacturing locally to minimize operational costs is one of the key business tactics used by manufacturers in the global Power Supply in Package and Power Supply on Chip industry to benefit clients and increase the market sector. In recent years, the Power Supply in Package and Power Supply on Chip industry has offered some of the most significant advantages to medicine. Major players in the Power Supply in Package and Power Supply on Chip market, including Bel Fuse Inc., Texas Instruments Incorporated, ON Semiconductor, Panasonic Corporation, Vicor Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology, TDK Corporation, Intel Corporation, and ASE Group, are attempting to increase market demand by investing in research and development operations.
Fuji Electric Co Ltd (Fuji Electric) manufactures electrical goods. Among its commercial operations are the production of thermal, geothermal, and hydraulic power as well as nuclear power-related equipment, solar power generation systems, energy management systems, watt-hour metres, and information systems. Additionally, the company offers factory energy management systems, industrial drive systems, heating and induction furnace equipment, transmission and distribution equipment, industrial power supply equipment, data centres, clean room facilities, plant control systems, measurement systems, and radiation monitoring systems. Additionally, Fuji Electric provides installation services for motors, inverter/servo systems, electric vehicle (EV) systems, transport systems, and uninterruptible power supply (UPS) systems, in addition to electrical and HVAC equipment. The company operates in North America, Europe, and Asia. Shinagawa-ku, Tokyo, Japan, is where Fuji Electric's corporate offices are situated. In August 2019, Fuji Electric Co., Ltd. expanded its X series of IGBT*1 modules, which are aimed at the market for large-scale wind power generation. The 1700V product has already begun shipping samples.
Panasonic Holdings Corp. (Panasonic), formerly known as Panasonic Corp., is a global manufacturer, retailer, and service provider of a wide range of electric and electronic products. Individual room air conditioners, TVs, landlines, digital cameras, home audio and video equipment, rice cookers, lamps, wiring devices, air conditioners, air purifiers, and bicycles are just a few of the things Panasonic offers. In addition, it sells PCs, tablets, batteries, electric motors, mounting machines, semiconductors, LCD panels, electronic materials, electronic components, and electronic materials. The company manages and operates facilities and R&D locations in Europe, Asia, the Americas, and Japan. Panasonic's corporate headquarters are in Kadoma-shi in the Japanese city of Osaka.
Key Companies in the Power Supply in Package and Power Supply on Chip market include
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Bel Fuse Inc.
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Texas Instruments Incorporated
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ON Semiconductor
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Panasonic Corporation
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Vicor Corporation
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Jiangsu Changjiang Electronics Technology Co. Ltd.
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Amkor Technology
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TDK Corporation
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Intel Corporation
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ASE Group
Power Supply in Package and Power Supply on Chip Industry Developments
January 2018: Mitsubishi Electric Corporation disclosed its research into 6.5kV full SiC power semiconductor modules. This power module offers the other power semiconductor modules' maximum power density.
Power Supply in Package and Power Supply on Chip Market Segmentation:
Power Supply in Package and Power Supply on Chip Product Outlook
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PSIP
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PwrSoc
Power Supply in Package and Power Supply on Chip Application Outlook
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Medical Devices
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Automotive
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Consumer Electronics
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Military and Defense
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Telecom and IT
Power Supply in Package and Power Supply on Chip Regional Outlook
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North America
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US
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Canada
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Europe
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Germany
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France
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UK
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Italy
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Spain
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Rest of Europe
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Asia-Pacific
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China
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Japan
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India
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Australia
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South Korea
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Australia
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Rest of Asia-Pacific
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Rest of the World
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Middle East
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Africa
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Latin America
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