FinFET Technology Market Research Report: By Technology (3nm, 5nm, 7nm, 10nm, 14nm, 16nm, 20nm and 22nm), By Application (Central Processing Unit (CPU), System-on-Chip (SoC), Field-Programmable Gate Array (FPGA), Graphics Processing Unit (GPU) and Network Processor), By End User (Mobile, Cloud Server/High-End Networks, IoT/Consumer Electronics, Automotive and others) - Forecast till 2027

FinFET Technology Market Overview

According to the latest research report, Market Research Future (MRFR) predicts that the FinFET Technology Market size will reach USD 268.66 million by 2025, growing at a compound annual growth rate (CAGR) of 40.3 percent from 2019 to 2025, during the forecast period. Fiber-optic tri-gate transistors, often known as FinFets, are 3D tri-gate transistors that are built on semiconducting materials or SOI wafers. Because the gate is looped around the channels, effective control is given from all three sides of the channel, and the gadget power of the FinFet may be raised by expanding the width of the channel (see figure). FinFets exhibit lower sensitivity to dopant-induced fluctuations and are equipped with low channel doping, resulting in improved charge carrier mobility inside the channel and, consequently, excellent performance.

Wearable gadgets have aided the industry's development. One of the major reasons driving the FinFET Technology Market growth is the usage of IC chips for headsets with smart clothing. Wearable sensors with IC chips ransmit data such as pulse rate, length run, and cell phones through Bluetooth. South Korea has been a significant leader in the APAC consumer electronics industry. The increasing need for smart gadgets along with technological advancements has fueled market demand. To satisfy rising customer demand, several major market participants have been constantly investing in FinFet technology development. Such cases are anticipated to boost the country's FinFet technology sector. The business is also benefiting from the increasing demand for biological sensors inside the health industry for diabetics and cardiac patients, as well as integrated patient monitoring. The newest wearable sensors include IC chips with contemporary Finfet technology market growth.

This report contains all the information on the global FinFET Technology Market strengths. The report also contains the culmination of dynamics, segmentation, key players, regional analysis, and other important factors. And a detailed analysis of the global FinFET Technology Market analysis and forecast for 2025 is also included in the report.

Covid 19 Analysis

As the COVID-19 epidemic destroys our global economy, FinFET technology companies struggle to compete. While FinFET process technology companies try to reorganize and restructure, many activities are stopped. The continuing COVID-19 issue has hit several businesses, including the FinFet technology industry. This epidemic has caused temporary shutdowns and social isolation, causing economic slowdowns, supply and demand chain disruptions, and plant and industry closures. So, the FinFet technology market has grown.

Market Dynamic

• Drivers

In order for the FinFET Technology Market to continue to expand, a variety of variables must be considered. Many factors contribute to this, including the increasing demands chips, implementation of the new tech with portable tablets and technology, the expanding IC industry,  advantages of FinFet technology, a rise in device performance, the thriving electronics and cell phones market, higher performance with lower current leaking than high volume technology, and the increasing demand for miniaturized semiconductors. An additional element driving the market development is the improvement in ionic conductivity, which is being fueled by technical advancements.

• Opportunities

The increasing demand for biomedical sensors in the healthcare sector for diabetic and cardiac patients, as well as integrated monitoring patients in the medical sectors, are all creating opportunities for the expansion of FinFET Technology Market. Contemporary wearable sensors are equipped with integrated circuits (ICs), which are in turn familiar with the latest Finfet technology, thus propelling the market's expansion forward.

• Restraints

On the other hand, self-heating problems, as well as conceptual design complexity, may restrict the development of the worldwide FinFet technology market during the projected period.

• Challenges

The cheap cost of wafers and the low gate cost of FD-SOIs provide the most significant barrier to the widespread adoption of FinFET technology. When compared to bulk CMOS and FinFETs, the cost of processed wafers and gates in SOIs is less expensive. Other factors to take into account are the number of processes and mask stages, tool degradation, die shrink area, and variable yield. The low cost of FDSOI is one of the most significant problems facing the industry since there is little significant difference in the performance of these two methods; the former offers comparable or superior energy usage at a lower cost, while the latter does not.

Cumulative Growth Analysis

The consumer technology sector is seeing substantial expansion in the market as a result of the widespread use of Finfet technology in a variety of electronic products. Because of their desire to increase the efficiency and density of their integrated circuits, IC makers are using Finfet technology in large numbers nowadays. As part of the manufacturing of electronic devices for consumers, FinFets are used in a variety of electronic passive components, including diodes, integrated circuits, and other similar devices, to electrical parts such as transistors, field-effect transistors, and other similar devices, to provide a high level of functionality. Finfets have risen to prominence in recent years as a key technology for integration into integrated circuits. Each of these elements is contributing to the market's expansion.

Value Chain Analysis

According to the reports, the global FinFET technology market is divided into the technology, application, and end-user sectors. Technology has divided the worldwide market for FinFET technology into 3nm, 5nm, 7nm, 10nm, 14nm, 16nm, 20nm, and 22nm. The worldwide market in FinfeT technology is divided into the CPU, GPU, System-on-Chip (SoC), Field-Programmable Gate Array (FPGA), and Network Processing Unit by FinFET technology application. The worldwide FinFET technology market has been divided into Mobile, Cloud Server, High-End Networks, IoT/Consumer Electronics, Automotive, and other applications, on the basis of end-users.

Segmentation Overview

The FinFET Technology Market is segmented on the basis of technology, application, and end-user sectors. The global FinFET technology market trends are expected to witness decent growth during the forecast period.

By Application

Based on the application, the market is segmented into CPU, GPU, System-on-Chip (SoC), Field-Programmable Gate Array (FPGA), and Network Processing Unit.

By end-users

Based on the propulsion types, the market is segmented into Mobile, Cloud Server, High-End Networks, IoT/Consumer Electronics, Automotive, and others.

Regional Analysis

According to the reports, on the basis of region, the global finFET technology market is divided into North America, Europe, Asia Pacific, and the rest of the world. Over the projected period, North America will influence the market. Increasing mobile phone, new technologies like artificial intelligence (AI) and data science (ML), expanding FinFet technologies in slightly different industries, and FinFet's use in CPUs and smartphone memory space by key digital machines to support multiple mobile and 5G applications add to the growth of FinFET Technology Market. In addition, the evolving perception that new technologies are being used, increasing smartphone owners, and new technological advancement, including machine learning and artificial intelligence in various end-use applications, are also contributing to the growth of the market. FinFet Technology Market APAC to Have Healthy Growth.

The second biggest FinFet technology market share in Europe during the forecast year is projected to follow in the APAC area, which is expected to have healthy growth over the forecast period. The development of the worldwide technology market of FinFet in the APAC region has increased rapid urbanization and industrialization in Chinese, Japanese, and India, as well as the prolific deployment of sophisticated smartphones and car CPUs.

Competitive landscape

There are a huge number of big and medium companies that have a substantial portion of the worldwide FinFET technology company, which is a result of fragmentation in the industry. In addition to having significant manufacturing resources, the major companies in the sector are also involved in a variety of research and development initiatives.

Major Key Players

• Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan)


• Qualcomm Technologies Inc. (US)


• Intel Corporation (US)


• Samsung Electronics Corporation Ltd (South Korea)


• GLOBALFOUNDRIES (US)


• Xilinx Inc. (US)


• ARM Limited (UK)


• MediaTek


• Incorporated (Taiwan)


• Atomera Inc. (US)


• Semiconductor Manufacturing International Corp. (China)


• Huawei Technologies Co. Ltd (China)


• United Microelectronics Corporation (Taiwan)


• Apple Inc. (US)


• Broadcom Inc. (US)


• NVIDIA Corporation (US)


• Advanced Micro Devices (AMD) Inc. (US)

Report Overview

The following report comprises of –

• Market overview 


• Covid 19 Analysis


• Market Dynamic


• Drivers


• Opportunities


• Restraints 


• Challenges


• Cumulative Growth Analysis


• Value Chain Analysis


• Segmentation Overview 


• By Application 


• By End-Users


• Regional Analysis


• Competitive landscape

Recent Developments

• Taiwan Semiconductor Manufacturing Co. Ltd. said in April 2019 that it has created a 5-nanometer technology that was now available for design. This technology offers sophisticated logic to satisfy the ever-increasing need for processing power, which is being pushed by artificial intelligence and 5G.


• As of April 2019, Samsung Electronics Co Ltd has completed the development of an ultra-thin FinFET process technology based on advanced nodes for extreme ultraviolet (EUV) radiation. The effectiveness of this device is up to 25percent greater in the logical area, the power consumption is 20% lower, and the output is 10% higher when compared to other FinFET process technologies.


• In February 2019, Intel Corporation announced the introduction of integrated MRAM based on 22nm technology for Internet of Things devices. The MRAM device is ready for large-scale manufacturing and is anticipated to be very beneficial for Internet of Things (IoT) applications, according to the researchers.

Segmentation Table

By Technology

• 3nm


• 5nm


• 7nm


• 10nm


• 14nm


• 16nm


• 20nm


• 22nm

By Application

• Central Processing Unit (CPU)


• System-on-Chip (SoC)


• Field-Programmable Gate Array (FPGA)


• Graphics Processing Unit (GPU)


• Network Processor

By End-User

• Mobile


• Cloud Server/High-End Networks


• IoT/Consumer Electronics


• Automotive


• Others

By Region:

• North America


• Europe


• Asia-Pacific


• Rest of the World