TAMAÑO del mercado de sistemas en módulos (USD MILLONES) (2018-2032)
Fuente: Investigación secundaria, investigación primaria, base de datos MRFR y revisión de analistas
Por ejemplo, en diciembre de 2022, Kopin Corporation, desarrollador y proveedor de micropantallas y óptica sofisticada para auriculares portátiles, desarrolló una solución tecnológica colaborativa junto con OPTAC-X, empresa de telesalud, y RealWear, auriculares portátiles manos libres y resistentes. OPTAC-X ofrece telesalud diseñada para que los equipos de primera respuesta y el personal médico puedan salvar vidas en combate y otras situaciones peligrosas con la ayuda de tecnologías ópticas y dispositivos portátiles de realidad asistida.
Mercado de sistemas en módulos TAMAÑO (USD MILLONES) TIPO 2022 VS 2032
Fuente: Investigación secundaria, investigación primaria, base de datos MRFR y revisión de analistas
En cuanto a aspectos como la disponibilidad a largo plazo, el funcionamiento a temperaturas prolongadas, la resistencia mecánica, el hardware y el firmware que se pueden adaptar a la aplicación, y la asistencia del proveedor de módulos para los desarrolladores de productos, el mercado integrado difiere del mercado comercial.
TAMAÑO DEL MERCADO DE SISTEMAS EN MÓDULOS (USD MILLONES) estándar 2022 VS 2032
Fuente: Investigación secundaria, investigación primaria, base de datos MRFR y revisión de analistas
El aumento de la robótica industrial en el sector manufacturero está contribuyendo a la adopción del SoM en la automatización industrial. Corea del Sur tiene la mayor densidad de robots, con más de 600 robots por cada 10 000 robots en el sector industrial.
TAMAÑO DEL MERCADO de sistemas en módulos (USD MILLONES) aplicación 2022 VS 2032
Fuente: Investigación secundaria, investigación primaria, base de datos MRFR y revisión de analistas
En 2022, SiFive anunció su alianza con BrainChip, fabricante de procesadores de IA. El lema de la alianza es ofrecer chips de diseño optimizados con inteligencia artificial y aprendizaje automático para la computación de borde.
Deutsche Beteiligungsgesellschaft adquirió Cognate AG en agosto de 2022 por aproximadamente 136 millones de dólares. Deutsche Beteiligungsgesellschaft realizó esta adquisición para fortalecer su posición en el mercado.
La colaboración entre Covade y SoMLabs en 2020 tiene como objetivo proporcionar servicios de ingeniería para proyectos en toda Europa. Covade cuenta con una amplia experiencia y conocimientos en el diseño de sistemas electrónicos integrados.
La colaboración entre Covade y SoMLabs en 2020 tiene como objetivo proporcionar servicios de ingeniería para proyectos en toda Europa. Covade cuenta con una amplia experiencia y conocimientos en el desarrollo de diseños de sistemas electrónicos embebidos. Olimex, especialista búlgaro en hardware abierto, presentó un nuevo sistema en módulo (SOM) y una placa base de evaluación para aplicaciones industriales, utilizando el sistema en chip iMX 8M Plus de NXP con su coprocesador neuronal TOPS 2.3 para cargas de trabajo de aprendizaje automático e inteligencia artificial en el dispositivo, lanzado en junio de 2024. Telit Cinterion, proveedor de soluciones para IoT, anunció el lanzamiento del SE868K5-RTK, un módulo receptor del Sistema Global de Navegación por Satélite (GNSS) con una precisión de posicionamiento de hasta centímetros. El primer módulo GNSS del portafolio de Telit Cinterion, que permite obtener datos de ubicación de alta precisión, es posible gracias a la avanzada tecnología de Cinemática en Tiempo Real (RTK). El módulo utiliza señales de doble frecuencia, así como soporte para múltiples constelaciones de satélites, superando así la interferencia por trayectos múltiples e identificando ubicaciones con una precisión inigualable.Público objetivo
Norte América
Europa
Asia-Pacífico
Oriente Medio y África
América del Sur y Central
What is the projected market valuation for the System on Module Market in 2035?
The projected market valuation for the System on Module Market in 2035 is approximately 7.787 USD Million.
What was the overall market valuation for the System on Module Market in 2024?
The overall market valuation for the System on Module Market in 2024 was 3.2 USD Million.
What is the expected CAGR for the System on Module Market from 2025 to 2035?
The expected CAGR for the System on Module Market during the forecast period 2025 - 2035 is 8.42%.
Which companies are considered key players in the System on Module Market?
Key players in the System on Module Market include Toradex, Congatec, Advantech, Aaeon, Digi International, NXP Semiconductors, Raspberry Pi Foundation, Siemens, and Texas Instruments.
What are the main application segments for the System on Module Market?
The main application segments for the System on Module Market include Industrial Automation, Medical, Entertainment, Transportation, and Test and Measurement.
How did the ARM architecture perform in the System on Module Market in 2024?
What is the valuation trend for the COM Express standard in the System on Module Market?
What is the projected growth for the Transportation application segment in the System on Module Market?
How does the performance of the Power architecture compare to other architectures in the System on Module Market?
What are the future prospects for the SMARC standard in the System on Module Market?
The secondary research process involved comprehensive analysis of semiconductor industry databases, technical standards publications, peer-reviewed engineering journals, and authoritative electronics industry organizations. Key sources included:
Regulatory & Standards Bodies:
PCI-SIG (Peripheral Component Interconnect Special Interest Group) – COM Express and COM-HPC standard specifications
SGET (Standardization Group for Embedded Technologies) – SMARC and Qseven standard documentation
PICMG (PCI Industrial Computer Manufacturers Group) – Industrial computing standards and specifications
IEEE Standards Association – Embedded system architecture standards (IEEE 802.1, IEEE 11073 for medical devices)
Industry Associations & Research Organizations:
SIA (Semiconductor Industry Association) – Global semiconductor market data and forecasts
ESIA (Embedded Systems Industry Association) – Embedded computing market trends and statistics
SEMI (Semiconductor Equipment and Materials International) – Semiconductor manufacturing capacity and technology roadmaps
VDC Research – Embedded hardware and IoT device market intelligence
Gartner, Inc. – IT hardware and edge computing market analysis
Government & Trade Sources:
U.S. Bureau of Industry and Security (BIS) – Export control regulations affecting semiconductor trade
European Commission DG CONNECT – Digital transformation and industrial automation initiatives
NIST (National Institute of Standards and Technology) – Cybersecurity frameworks for IoT and embedded systems
China Ministry of Industry and Information Technology (MIIT) – Made in China 2025 semiconductor policies
Japan METI (Ministry of Economy, Trade and Industry) – IoT and manufacturing technology roadmaps
Taiwan National Development Council – Semiconductor industry development plans
Academic & Technical Databases:
IEEE Xplore Digital Library – Embedded systems, ARM/x86 architecture research
ACM Digital Library – Computer architecture and system design publications
ScienceDirect (Elsevier) – Industrial automation and IoT integration studies
SpringerLink – Edge computing and embedded AI research
Market Intelligence Platforms:
IPC (Association Connecting Electronics Industries) – Electronics manufacturing and supply chain data
IDC (International Data Corporation) – IoT and intelligent edge device forecasts
IHS Markit (S&P Global) – Industrial automation and semiconductor component tracking
These sources were used to collect shipment statistics, standard adoption timelines, architectural performance benchmarks, application penetration rates, and competitive landscape analysis for ARM-based, x86-based, Power Architecture, and RISC-V based SoM technologies across COM Express, SMARC, Qseven, ETX/XTX, and COM-HPC form factors.
To gather both qualitative and quantitative insights, supply-side and demand-side stakeholders were interviewed during the primary research phase. CEOs, VPs of engineering, product line managers, and strategic marketing directors from semiconductor vendors, embedded computer OEMs, and SoM manufacturers were examples of supply-side sources. System architects, hardware engineering managers, procurement leads from industrial automation OEMs, manufacturers of medical devices, transportation systems integrators, and suppliers of IoT solutions were examples of demand-side sources. Market segmentation was established, product roadmap deadlines were verified, and insights into supply chain dynamics, pricing tactics, and design win patterns were obtained through primary research.
Primary Respondent Breakdown:
By Designation: C-level Primaries (28%), Director Level (35%), Others (37%)
By Region: North America (32%), Europe (30%), Asia-Pacific (33%), Rest of World (5%)
Global market valuation was derived through revenue mapping and unit shipment analysis. The methodology included:
Identification of 40+ key manufacturers across North America, Europe, Asia-Pacific, and Latin America
Product mapping across ARM, x86, Power Architecture, and emerging RISC-V SoM categories by form factor (COM Express, SMARC, Qseven, ETX/XTX, COM-HPC)
Analysis of reported and modeled annual revenues specific to SoM and embedded computing portfolios
Coverage of manufacturers representing 75-80% of global market share in 2024
Extrapolation using bottom-up (unit shipment × ASP by architecture and application) and top-down (manufacturer revenue validation) approaches to derive segment-specific valuations by type (ARM, x86, Power), standard (COM Express, SMARC, Qseven, COM-HPC), and application (Industrial Automation, Medical, Entertainment, Transportation, Test & Measurement)
This methodology ensures robust triangulation of data points across the embedded computing ecosystem, covering both legacy form factors (ETX, Qseven) and emerging high-performance standards (COM-HPC) while capturing the architectural shift toward ARM dominance in IoT applications and sustained x86 presence in industrial automation.
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