New Packages Materials Power Devices Companies
New Packages and Materials for Power Devices Companies focused on research and development of innovative packaging and materials for advanced power devices and electronics.
New Packages and Materials for Power Devices Companies focused on research and development of innovative packaging and materials for advanced power devices and electronics.
*Disclaimer: List of key companies in no particular order
Latest Company Updates:
November 2023- Dana Incorporated, on November 23rd, introduced the company's line of Brevini EvoMax™ helical and bevel helical gearboxes for industrial bulk management applications at the Vrac Tech Exhibition. Brevini EvoMax gearboxes are designed to optimize the performance of mining and bulk material handling equipment such as conveyors, stacker reclaimers, wagon tipplers, and ship loading and unloading equipment. The product range offers a high degree of modularity and flexibility, with torque ratings ranging from 8,000Nm to 310,000Nm. Located in Stand A8, Dana will also promote its full range of support for manufacturers and owners of bulk management equipment, including consulting services, systems design, engineering, procurement, installation, and service.
November 2023- Micross Components, a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to USD134.3 million, with USD45.6 million obligated at the time of the award. The award was made through the Department of Defense (DoD) to develop trusted, pure-play, and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions. This effort focuses on Back End Of Line (BEOL) processes for 300mm wafer diameter capabilities aimed at low volume, high mix, secure manufacturing capabilities that all Defense Industrial Base companies can design into their next-generation applications, ensuring access and availability to a U.S. microelectronics ecosystem that enables secure and comprehensive components and system integrations.
Top listed global companies in the industry are:
New Packages and Materials for Power Devices Market Size was valued at USD 2.3 bn in 2022. The New Packages and Materials for Power Devices Market industry is projected to grow from USD 2.5 bn in 2023 to USD USD 5.9 bn by 2032, exhibiting a compound annual growth rate (CAGR) of 15% during the forecast period (2023 - 2032).Â
Packages and materials for power semiconductors have progressed tremendously over the years. During the review period, the global novel packages and materials for power devices market is predicted to rise at a high rate. Demand for powered semiconductors market is expected to stay high throughout the forecast period, owing to growing applications in computers and telecommunications. Wide bandgap (WBG) materials like gallium nitride (GaN) and silicon carbide (SiC) market are becoming more common in packaging materials as the demand for increased power density grows.
People are currently utilizing sustainable and renewable energy to help lessen the worldwide fossil energy issue. As a result, there is a growing demand for sustainable energy. As a result of the worldwide interest in automotive powered electronic devices and efforts to popularise hybrid electric vehicles (HEVs) and electric vehicles (EVs), the automotive module has experienced rapid growth. As a result, the market for power module packaging is growing. Furthermore, to improve performance and reduce losses, more powerful electronic applications are using power modules rather than discrete components. As a result, mastering power module assembly is a must for manufacturers, and it is expected to promote packaging design innovation.
STMicroelectronics, SEMIKRON, Efficient Power Conversion Corporation, NXP Semiconductor, ROHM SEMICONDUCTOR, Amkor Technology, Littelfuse, Remtec, Inc., ON Semiconductor, MITSUBISHI ELECTRIC CORPORATION, Orient Semiconductor Electronics Ltd., ROHM SEMICONDUCTOR, Infineon Technologies AG and Exagan.
Infineon Technologies Ag expanded its CoolSiCTM power module line for UPS and energy storage applications in February 2019. The CoolSiC 2B power modules, according to Infineon, allow engineers to cut total system costs by enhancing power density. When compared to silicon alternatives, the device has an 80 percent lower switching loss, allowing inverter efficiency levels to reach above 99 percent.
Fuji Electric Co. Ltd, Infineon Technologies AG, and Mitsubishi Electric Corporation are among the prominent participants in the market. It is a fast-paced market that necessitates constant innovation and material improvements, as well as significant R&D expenditure. Furthermore, to compete in an open market, power module manufacturers must provide excellent reliability while remaining cost-effective.
Historical market trends, market dynamics, forecast, market value by region as well as by segmentation, country-level analysis for each market segment, key player’s market share analysis and market factor analysis which covers supply chain and Porter’s five forces analysis of the market.
For the scope of the research, MRFR’s report offers a comprehensive segmental analysis of the global market for new packages and materials for power devices
MRFR employs highly advanced research structure. Primary and secondary research techniques form the foundation of the research structure. Primary research inputs are mainly derived from interviews and interactions with key personnel. A bulk of secondary resources such as white papers, paid database, investor presentations, authenticated directories, etc. are utilized for affirmation of the gathered information. In addition, a multilayered evaluation process is used for confirming the accuracy of the data. Furthermore, top-down and bottom-up approaches are undertaking for ensuring zero discrepancy.
New Packages Materials Power Devices Market Highlights:
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