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Molded Interconnect Device Market Share

ID: MRFR//10805-HCR | 128 Pages | Author: Ankit Gupta| May 2024

In the competitive landscape of the Molded Interconnect Device (MID) market, companies employ various market share positioning strategies to establish their presence, differentiate their offerings, and capture a significant share of the market. One common strategy is product differentiation, where companies focus on developing MIDs with unique features, improved performance, or innovative designs that set them apart from competitors. This approach not only attracts customers seeking advanced solutions but also helps companies build a distinct brand identity in the market.

Another key strategy is pricing competitiveness. Companies in the MID market often leverage cost efficiencies in manufacturing processes to offer competitive pricing for their products. This strategy aims to attract price-sensitive customers and gain market share by providing cost-effective alternatives without compromising on quality. Price positioning becomes crucial, especially in markets where customers prioritize affordability while expecting reliable and high-performance Molded Interconnect Devices.

Strategic partnerships and collaborations are integral components of market share positioning in the MID industry. Companies often form alliances with other players, technology providers, or suppliers to strengthen their capabilities, access new markets, and enhance their overall competitive position. Collaborative efforts can lead to the development of innovative solutions and provide companies with a broader reach, ultimately contributing to increased market share.

Market segmentation is a targeted strategy employed by companies to address specific customer needs and preferences. By identifying niche markets or focusing on particular industry verticals, companies can tailor their MID solutions to meet the unique requirements of those segments. This targeted approach allows companies to concentrate their resources and efforts efficiently, gaining a competitive edge and expanding their market share in specialized areas.

Customer-centric strategies, such as excellent customer service, after-sales support, and warranty offerings, play a crucial role in market share positioning. Building strong relationships with customers not only fosters brand loyalty but also contributes to positive word-of-mouth referrals. Satisfied customers are more likely to remain loyal to a brand and recommend its products, creating a ripple effect that can lead to an increase in market share over time.

Geographical expansion is a strategic move to tap into new markets and increase market share. Companies often explore opportunities in untapped regions or expand their presence in existing markets to reach a wider customer base. This strategy involves understanding regional preferences, adapting products to local requirements, and establishing effective distribution channels to ensure market penetration and sustained growth.

Continuous innovation is a fundamental strategy in the MID market to stay ahead of the competition. Companies invest in research and development to introduce new technologies, materials, or design concepts that offer superior performance or address emerging industry trends. Being at the forefront of innovation not only attracts early adopters but also positions companies as industry leaders, contributing to an enhanced market share.

Lastly, effective marketing and brand positioning strategies are essential for companies in the MID market to create awareness, build trust, and influence customer perceptions. Utilizing digital marketing, social media, and other promotional channels helps companies reach a wider audience and establish themselves as reliable providers of Molded Interconnect Devices. A strong and positive brand image can lead to increased customer preference and, consequently, a larger market share.

Global Molded Interconnect Device Market Overview:


Molded Interconnect Device Market Size was valued at USD 1.6 Billion in 2022. The Molded Interconnect Device market industry is projected to grow from USD 1.83 Billion in 2023 to USD 5.29 Billion by 2032, exhibiting a compound yearly growth rate (CAGR) of 14.20% during the forecast period (2024 - 2032). The increasing use of laser direct structuring (LDS) process to produce 5G antennas that lead to enhanced speed and efficiency of wireless communication)and the growing demand for lot devices are the key market drivers that intensify the market growth.


Molded Interconnect Device Market Overview


Source: Secondary Research, Primary Research, MRFR Database and Analyst Review


Molded Interconnect Device Market Trends




  • Increasing demand for the electrical and mechanical applications is driving the market growth




Market CAGR for molded interconnect devices is being driven by the Increasing demand in electrical and mechanical applications. MIDs offer a unique integration of electronic circuits directly onto three-dimensional molded plastic components, revolutionizing product design and functionality. This technology finds extensive utility in automotive, medical devices, consumer electronics, and industrial equipment. The automotive sector, in particular, is witnessing a notable uptick in MID adoption due to the growing trend of smart and interconnected vehicles. Additionally, the medical industry is leveraging MIDs for compact and multifunctional devices. This heightened demand is poised to propel the MID market forward, presenting substantial growth opportunities for industry players.


Additionally, it is experiencing a surge in demand predominantly driven by the escalating adoption in the medical sector. MIDs offer compact, customizable solutions for intricate medical devices, facilitating miniaturization and enhancing functionality. Additionally, the growing emphasis on sustainability and cost-efficiency is fueling the need for component reuse. MIDs, with their ability to integrate multiple functions into a single piece, align perfectly with this trend. This convergence of factors positions the MID market for robust growth, as it caters to the evolving needs of the medical industry while addressing sustainability concerns.


Rising prices of essential materials strain profit margins, impacting the overall competitiveness of MIDs. Additionally, the high costs associated with specialized tooling deter potential entrants and hinder scalability for existing manufacturers. These factors collectively impede the market's growth trajectory. To mitigate these challenges, industry players may explore alternative materials and manufacturing techniques, invest in research and development for cost-effective solutions, or seek strategic partnerships to share the financial burden of production. These measures could help alleviate the constraints on MID market expansion.


For instance, in November 2021, LPKF Laser & Electronics, a German-based electronics manufacturing company, developed a new technology by combining LDS and laser plastic welding. It is driving the Molded Interconnect Device market revenue.


Molded Interconnect Device Market Segment Insights:


Molded Interconnect Device Product Type Insights


The Molded Interconnect Device Market segmentation, based on product type, includes antennas and connectivity modules, sensors, connectors and switches, lighting systems, and others. The antennas and connectivity modules segment dominated the market. Antennae are crucial for transmitting and receiving signals in various applications, such as loT devices, smartphones, and automotive electronics. Connectivity modules encompass a range of technologies like Bluetooth, Wi-Fi, and cellular connectivity, enabling seamless communication between devices.


Molded Interconnect Device Process Insights


The Molded Interconnect Device Market segmentation, based on process, includes laser direct structuring (LDS), two-shot molding, and film techniques. The two-shot molding category generated the most income (70.4%). The MID market uses two-shot moulding, commonly referred to as two-component injection moulding or 2K moulding, as a manufacturing technique to produce complicated parts with several materials or colours. Using two distinct materials or resins in a single injection moulding cycle to produce objects with integrated circuitry is known as two-shot moulding in the context of MID.


Molded Interconnect Device Vertical Insights


The Molded Interconnect Device Market segmentation, based on vertical, includes Telecommunication, Consumer Electronics, Automotive, Medical, Industrial, Military and aerospace. The consumer electronics category is major vertical that heavily relies on MIDs. MIDs are favored in consumer electronics due to their ability to enable compact, lightweight designs with high functionality.


Figure1: Molded Interconnect Device Market, by vertical, 2022 & 2032 (USD Billion)


Molded Interconnect Device Market, by vertical, 2022 & 2032


Source: Secondary Research, Primary Research, MRFR Database and Analyst Review


Molded Interconnect Device Regional Insights


By region, the study supplies market insights into North America, Europe, Asia-Pacific and the Rest of the World. The North American Molded Interconnect Device market area will dominate this market, owing to a well-established electronics industry coupled with a high adoption rate of advanced technologies. In the automotive sector, MIDs are used for various functions, including sensors, lighting systems, and control modules.


Further, the major countries studied in the market report are The US, Canada, Germany, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.


Figure: Molded Interconnect Device Market SHARE BY REGION 2022 (USD Billion)


Molded Interconnect Device Market SHARE BY REGION 2022


Source: Secondary Research, Primary Research, MRFR Database and Analyst Review


Europe's Molded Interconnect Device market accounts for the second-largest market share due to the request for MIDs, as they are extensively used in applications like electronic control units (ECUs), sensors, and lighting systems. The presence of many automotive manufacturers in countries like Germany, France, and the United Kingdom bolsters the market.


The Asia-Pacific Molded Interconnect Device Market is expected to grow at the fastest CAGR from 2023 to 2032. It is due to the flourishing electronics and automotive industries. Countries like China, Japan, and South Korea are at the forefront of MID adoption. China, in particular, boasts a thriving electronics manufacturing sector, making it a significant contributor to the MID market.


Molded Interconnect Device Key Market Players& Competitive Insights


Leading market players are investing in research and development in order to expand their product lines, which will help the Molded Interconnect Device market rise even more. Market participants are also undertaking a variation of strategic activities to develop their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To develop and survive in a more competitive and rising market climate, the Molded Interconnect Device industry must offer cost-effective items.


Manufacturing locally to minimize operational costs is one of the key business tactics used by manufacturers in the global Molded Interconnect Device industry to benefit clients and increase the market sector. In recent years, the Molded Interconnect Device industry has offered some of the most advantages to medicine. Many players in the Molded Interconnect Device market, including GALTRONICS, HARTING Technology Group, MacDermid, Inc., LPKF Laser & Electronics AG, Cicor Management AG, YOMURA, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, BASF SE, EMS-CHEMIE HOLDING AG, DSM, Ensinger, Evonik Industries AG, LANXESS, MITSUBISHI GAS CHEMICAL COMPANY, INC., PTS (TQM) Ltd., and ZEON CORPORATION, among others.


Founded in 1989, ZEON has been in the PDF business for more than 20 years. In the very beginning, we developed electronic publishing and printing solutions and switched to PDF (Portable Document Format) technology in 1993. There, it began the evolution of our robust PDF software, spanning over 13 generations that businesses and document professionals around the world have widely adopted. At Zeon, we are committed to delivering powerful PDF solutions that cater to businesses of different sizes. From regular workstation licenses, a free PDF reader, and a hosted solution for virtual environments to a server-grade conversion tool, Gaaiho provides comprehensive PDF functionality as well as versatile licensing programs, making it possible to choose a plan that fits your exact needs without posing costly compromises.


Galtronics is one of the very few antenna companies in the world with plan ability in three key markets: DAS and Small Cell, Networking and Mobile. As content drives broadband necessary, complicated antenna systems are required to carry this rising load. The fundamental plan elements of antennas can only be satisfied by a number of companies in the world. Galtronics' exceptional design capabilities, including its unique lead of leveraging mobile antenna plans to work within its issue antenna systems, set Galtronics apart from its competitors. These are exciting days in the antenna world, and Galtronics will be launching many new DAS and small-cell products within the year.


Key Companies in the Molded Interconnect Device market include




  • GALTRONICS




  • HARTING Technology Group




  • MacDermid, Inc.




  • LPKF Laser & Electronics AG




  • Cicor Management AG




  • YOMURA




  • RTP Company




  • S2P smart plastic product




  • SelectConnect Technologies




  • Suzhou Cicor Technology Co. Ltd




  • TE Connectivity




  • Teprosa GmbH




  • Tongda Group




  • BASF SE




  • EMS-CHEMIE HOLDING AG




  • DSM




  • Ensinger




  • Evonik Industries AG




  • LANXESS




  • MITSUBISHI GAS CHEMICAL COMPANY INC




  • PTS (TQM) Ltd.




  • ZEON CORPORATION




Molded Interconnect DeviceIndustry Developments


January 2023: Kries, a German innovator in smart grid systems, has been acquired by TE Connectivity (TE), a global leader in connectivity and sensors; the purchase broadens TE's portfolio of power grid monitoring, protection, and automation systems.


September 2022: Galtronics Corporation, which blends collaboration and technological innovation to address the most complex wireless communication challenges in the world, announced the addition of three new devices to its Multibeam antenna line.


Molded Interconnect Device Market Segmentation:


Molded Interconnect Device Product Type Outlook




  • Antennae & Connectivity Modules




  • Sensors




  • Connectors & Switches




  • Lighting System




  • Others




Molded Interconnect Device Process Outlook




  • Laser Direct Structuring (LDS)




  • Two-shot Molding




  • Film Techniques




Molded Interconnect Device Vertical Outlook




  • Telecommunication




  • Consumer Electronics




  • Automotive




  • Medical




  • Industrial




  • Military & Aerospace




Molded Interconnect Device Regional Outlook




  • North America




    • US




    • Canada






  • Europe




    • Germany




    • France




    • UK




    • Italy




    • Spain




    • Rest of Europe






  • Asia-Pacific




    • China




    • Japan




    • India




    • Australia




    • South Korea




    • Australia




    • Rest of Asia-Pacific






  • Rest of the World




    • Middle East




    • Africa




    • Latin America





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