Interconnects and Passive Components Market By Product Type (Interconnects, Passive Components, Electromechanical Components, Relays, Switches), By Technology (Optical Interconnects, Wireless Interconnects, 5G & Telecom Infrastructure, Surface Mount Technology Components, MEMS-based Components, Others), By End User (Automotive, Consumer Electronics, Telecommunications, Industrial Equipment & Manufacturing, Aerospace & Defense, IT & Data Centers, Power Generation & Distribution, Robotics, Energy & Utilities, Others) & Region- Forecast 2035

Global Interconnects and Passive Components Market Overview

The Interconnects and Passive Components Market was valued at USD 157.28 Billion in 2024. The Interconnects and Passive Components Market industry is projected to grow from USD 164.38 Billion in 2025 to USD 267.67 Billion by 2035, exhibiting a compound annual growth rate (CAGR) of 5.0% during the forecast period (2025-2035).

The growing demand for consumer electronics and advancements in 5g and IOT technologies and increase in automotive electronics and shift towards energy-efficient solutions and rising RD investment in semiconductor technologies are driving the growth of the interconnects and passive components market.

As per the Analyst at MRFR, the international semiconductor industry, and specifically interconnects and passive components, is essential to the electronics supply chain, enabling a broad spectrum of technologies from consumer electronics to industrial. Interconnects such as connectors, cables, and network devices are essential for data and power transmission, while passive components such as resistors, capacitors, and inductors control electrical currents in circuits. As the demand for advanced electronic components increases, that for high-speed and reliable transmission of data grows along with it, driven in large part by technologies such as IoT, 5G, and AI.

 FIGURE 1: INTERCONNECTS AND PASSIVE COMPONENTS MARKET VALUE (2019-2035) USD BILLION

Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review

Interconnects and Passive Components Market Opportunity

EXPANSION OF 5G INFRASTRUCTURE

The development of 5G systems provides vast opportunities in the market for interconnects and passive components. 5G networks comprise equipment with advanced features to deliver high data rates and low latency along with reliable connectivity therefore more passive components particularly conformal coatings and other passive will be required. The adoption of 5G is driving up the demand for interconnects, such as high-speed connectors, cables, and network devices that can accommodate higher frequencies and larger data throughput without sacrificing signal integrity. 

These interconnects have to be capable of supporting the dense and complex 5G network architecture, including small cell deployment, implementation of optical networks, and deployment of edge computers. Other passive components critical to ensuring power distribution, voltage stabilization, and system reliability include resistors, capacitors, and inductors, which are central to all high frequency 5G applications.

While 5G technology is expected to open up new opportunities for growth in the infrastructure market, it goes beyond these existing values by creating new components that are even more resilient and power-savvy, allowing for harder active and passive segments to be accommodated into the new demanding power requirements. Low-loss, high-density interconnects and passive components capable of withstanding appreciably higher power levels and temperatures will have a significant role to play in the successes of 5G networks. The requirement for miniaturization of components will propel innovation into the interconnects and passive components market, permitting compact designs in modern electronic devices Portable and IoT handhelds. 

The opportunity extends through various phases of 5G deployment, covering base stations, network hardware, and end-user devices, leading to healthy growth opportunities for both the market need for components and the initiations of continuous technological developments. As global 5G infrastructures mature, the demand for high-performance interconnect and passive components is likely to skyrocket in the coming years, urging a drive for market growth over the years.

Interconnects and Passive Components Market Segment Insights

Interconnects and Passive Components by Product Type Insights

Based on Product Type, the Interconnects and Passive Components Market has been segmented into Interconnects, Passive Components, and Electromechanical Components (Emech). The Interconnects segment is further bifurcated into Connectors (Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, Backplane), Cables & Wires, PCB Connectors, Terminals & Interconnection Systems, Others. The Passive Components segment is further bifurcated into Resistors, Capacitors, Inductors, Transformers, Magnetic Components, Sensors, Piezoelectric Components, Others. The Electromechanical Components (Emech) segment is further bifurcated into Relays, Switches (Pushbutton, Toggle, Rotary), Motors & Actuators, Circuit Breakers & Fuses, Solenoids & Valves, Integrated Mechanical Systems, Others. 

The Interconnects segment dominated the global market in 2024, while the Interconnects segment is projected to be the fastest–growing segment during the forecast period.Interconnects are essential in facilitating the smooth transmission of power, data, and signals between different electronic systems. In the interconnects and passive components industry, connectors like Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, and Backplane connectors are fundamental components that connect different sections of a device or system. 

Board-to-Board connectors enable two circuit boards to directly talk to each other, and Wire-to-Board connectors connect the wires to the boards to ensure that there is an uninterrupted flow of electrical signals. I/O connectors transfer input as well as output data, and Fiber Optic connectors facilitate high-speed data transmission with interference-free flow essential for contemporary communication systems.

FIGURE 2: INTERCONNECTS AND PASSIVE COMPONENTS MARKET SHARE BY PRODUCT TYPE 2024 AND 2035 (USD BILLION)

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

Interconnects and Passive Components System by Technology Insights

Based on technology, the Interconnects and Passive Components Market has been segmented into Optical Interconnects, Wireless Interconnects, High-Speed Connectors (USB, HDMI, etc.), 5G and Telecom Infrastructure, Surface Mount Technology (SMT) Components, MEMS-based Components (Micro Electromechanical Systems), Smart Electromechanical Systems (IoT-enabled), and Microactuators & Robotics Integration & others. The Surface Mount Technology (SMT) Components segment dominated the global market in 2024, while the 5G and Telecom Infrastructure segment is projected to be the fastest–growing segment during the forecast period. 

Surface Mount Technology (SMT) has become a force driving the interconnects and passive components market; it has changed the way electronic devices are assembled. The through-hole component mounts the component through holes in the PCB, whereas SMT components are mounted directly to the surface of the PCB and allow for smaller, reliable designs that are cost-effective. This technology allows for the manufacturing of electronic devices that are smaller and lighter, making it the backbone of everything from smartphones to wearables and automotive electronics.

Interconnects and Passive Components by End User Insights

Based on End User, the Interconnects and Passive Components Market has been segmented into Automotive, Consumer Electronics, Telecommunications, Industrial Equipment & Manufacturing, Medical Devices & Healthcare, Aerospace & Defense, IT & Data Centers, Power Generation & Distribution, Robotics, Energy & Utilities, and Others. The Automotive segment dominated the global market in 2024, while the Robotics segment is projected to be the fastest–growing segment during the forecast period. The automotive industry is one of the key end-users of the interconnects and passive components market, being that contemporary vehicles increasingly rely on sophisticated electronic systems for better performance, safety, and comfort. 

Putting this into perspective, demand for interconnects and passive components has with incredible vigor surged from ADAS, infotainment, powertrain control, and EV systems, to being used in many aspects of automotive operations. Connectors, sensors, resistors, and capacitors play a key role in the facilitation of interchange within electronic systems in an auto high-speed connectors used for infotainment systems, while safety features depend on sensors, such as airbags and collision avoidance systems.

Interconnects and Passive Components Regional Insights

Based on the Region, the global Interconnects and Passive Components is segmented into North America, Europe, Asia-Pacific, South America and Middle East & Africa. The Asia Pacific dominated the global market in 2024, while the Asia Pacific is projected to be the fastest–growing segment during the forecast period. Major demand factors driving the Asia Pacific market are The Asia-Pacific interconnects and passive components market is witnessing rapid growth due to fast-paced technological developments and rising demand across different industries. 

The key growth driver is the growth of consumer electronics, especially in China, Japan, South Korea, and Taiwan, which together account for close to 45% of the world's market share in immersive media technologies. This expansion is fueled by the presence of giant consumer electronics companies and the expansion of the growing middle class with rising disposable incomes. 

Contributing to the expansion as well is the expansion of the Internet of Things (IoT), where governments and private players are significantly investing in IoT infrastructure to raise connectivity and automation. For instance, Singapore's Infocomm Media Development Authority (IMDA) established plans to build up IoT strengths, as its potential to grow the economy and improve city life is huge.

FIGURE 3: INTERCONNECTS AND PASSIVE COMPONENTS MARKET VALUE BY REGION 2024 AND 2035 (USD BILLION)

Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review

Further, the countries considered in the scope of the Application Tracking System Market are the US, Canada, Mexico, Germany, France, the UK, Russia, Spain, Italy, Rest of Europe, China, India, Japan, South Korea, Malaysia, Thailand, Indonesia, Rest of Asia Pacific, Brazil, Argentina, Rest of South America, GCC Countries, South Africa, Rest of MEA and others.

Global Interconnects and Passive Components Key Market Players & Competitive Insights

Many global, regional, and local vendors characterize the Interconnects and Passive Components Market. The market is highly competitive, with all the players competing to gain market share. Intense competition, rapid advances in technology, frequent changes in government policies, and environmental regulations are key factors that confront market growth. The vendors compete based on cost, product quality, reliability, and government regulations. Vendors must provide cost-efficient, high-quality products to survive and succeed in an intensely competitive market.

The major competitors in the market are Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co, among others. The Interconnects and Passive Components Market is a consolidated market due to increasing competition, acquisitions, mergers and other strategic market developments and decisions to improve operational effectiveness.

Key Companies in the Interconnects and Passive Components Market include

• Kyocera Corporation
• Murata Manufacturing Co., Ltd
• Samsung Electro-Mechanics
• TDK Corporation
• Taiyo Yuden Co., Ltd
• Molex Incorporated
• Amphenol Corporation
• Vishay INTERTECHNOLOGY
• TE Connectivity Corporation
• Hirose Electric Co

Interconnects and Passive Components Industry Developments

February 2025: Amphenol Corporation (NYSE: APH) announced it had completed the acquisition of CommScope’s (NASDAQ: COMM) Outdoor Wireless Networks (OWN) and Distributed Antenna Systems (DAS) businesses.

March 2023: HIROSE Electric Co., Ltd. (Headquarters: Japan), a manufacturer specializing in connectors, and SnapEDA (Headquarters: San Francisco, USA), the internet's first search engine for electronic design, have partnered to release more than 1,000 ready-to use symbols and footprints for a variety of Hirose’s PCB mountable connectors.

September 2022: Molex, a global electronics leader and connectivity innovator, today announced it is expanding its existing manufacturing operations in Hanoi to include a new 16,000 square meter facility. The company expects the expansion will support over 200 new jobs in advanced high-tech manufacturing.

December 2021: Vishay Intertechnology, Inc., (NYSE: VSH), one of the world's largest manufacturers of discrete semiconductors and passive electronic components, announced that it has signed a definitive purchase agreement to acquire substantially all of the assets and certain liabilities of Barry Industries for $21 million, subject to working capital and net cash adjustments at closing.

Interconnects and Passive Components Market Segmentation

Interconnects and Passive Components by Product Type Outlook

• Interconnects
  • Connectors (Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, Backplane)
  • Cables & Wires
  • PCB Connectors
  • Terminals & Interconnection Systems
  • Others
• Passive Components
  • Resistors
  • Capacitors
  • Inductors
  • Transformers
  • Magnetic Components
  • Sensors
  • Piezoelectric Components
  • Others
• Electromechanical Components (Emech)
  • Relays
  • Switches (Pushbutton, Toggle, Rotary)
  • Motors & Actuators
  • Circuit Breakers & Fuses
  • Solenoids & Valves
  • Integrated Mechanical Systems
  • Others

Interconnects and Passive Components by Technology Outlook

• Optical Interconnects
• Wireless Interconnects
• High-Speed Connectors (USB, HDMI, etc.)
• 5G and Telecom Infrastructure
• Surface Mount Technology (SMT) Components
• MEMS-based Components (Micro-Electromechanical Systems)
• Smart Electromechanical Systems (IoT-enabled)
• Microactuators & Robotics Integration
• Others

Interconnects and Passive Components by End User Outlook

• Automotive
• Consumer Electronics
• Telecommunications
• Industrial Equipment & Manufacturing
• Medical Devices & Healthcare
• Aerospace & Defense
• IT & Data Centers
• Power Generation & Distribution
• Robotics
• Energy & Utilities
• Others

Interconnects and Passive Components Regional Outlook

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Italy
  • Spain
  • Rest of Europe
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Malaysia
  • Thailand
  • Indonesia
  • Rest of Asia Pacific
• South America
  • Brazil
  • Argentina
  • Rest of South America
• Middle East & Africa
  • GCC Countries
  • South Africa
  • Rest of MEA

Report Attribute/Metric	Details
Market Size 2024	USD 157.28 Billion
Market Size 2025	USD 164.38 Billion
Market Size 2035	USD 267.67 Billion
Compound Annual Growth Rate (CAGR)	5.0% (2025-2035)
Base Year	2024
Forecast Period	2025-2035
Historical Data	2019-2023
Forecast Units	Value (USD Billion)
Report Coverage	Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
Segments Covered	By Product Type, By Technology, By End User
Geographies Covered	North America, Europe, Asia Pacific, South America, Middle East & Africa
Countries Covered	The US, Canada, Mexico, Germany, France, the UK, Russia, Spain, Italy, Rest of Europe, China, India, Japan, South Korea, Malaysia, Thailand, Indonesia, Rest of Asia Pacific, Brazil, Argentina, Rest of South America, GCC Countries, South Africa, Rest of MEA
Key Companies Profiled	Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co
Key Market Opportunities	·         Expansion of 5g infrastructure ·         Growth in emerging markets
Key Market Dynamics	·         Growing demand for consumer electronics ·         Advancements in 5g and IOT technologies