rising RD investment in semiconductor technologies is driving the global interconnects and passive components market, are expected to drive market expansion in the near future at a CAGR of 5.0% during the forecast period 2025 to 2035

Market Research Future (MRFR) has published a cooked research report on the “Global Interconnects and Passive Components Market” that contains information from 2019 to 2035.

The Global Interconnects and Passive Components Market is estimated to register a CAGR of 5.0% during the forecast period of 2025 to 2035.

MRFR recognizes the following companies as the key players in the Global Interconnects and Passive Components Market— include Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co and among others.

Market Highlights

The Global Interconnects and Passive Components Market is estimated to register a CAGR of 5.0% during the forecast period and is estimated to reach USD 267.67 Billion by 2035.

The market's Growing acceptance of consumer electronics like smartphones, laptops, tablets, wearables, and home automation products are a key spur for the passive and interconnecting components market around the world. For example, the growth of consumer electronics demand is visible from the volume explosion in the sale of smartphones alone, which was over 1.5 billion units in the recent past and indicates an increasing hunger for advanced mobile technology. Such a trend calls for the use of reliable interconnecting and passive components like capacitors and resistors, which are needed to provide device stability and performance.

As technology advances at a high pace and innovative features are added, the demand for efficient and reliable passive and interconnecting components has increased. The extensive adoption of these components across various electronic applications guarantees steady performance, connectivity, and efficient power management, boosting device functionality and user experience overall. The demand from consumers for high-performance devices with enhanced processing and data transfer capacities also contributes to the market, prompting ongoing upgrades and innovations in passive and interconnecting components to cater to evolving needs.

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Segment Analysis

The Global Interconnects and Passive Components Market has been segmented based on By Product Type, By Technology, By End User.

Based on Product Type, the global interconnects and passive components market has been segmented into Interconnects, Passive Components, and Electromechanical Components (Emech). The Interconnects segment is further bifurcated into Connectors (Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, Backplane), Cables & Wires, PCB Connectors, Terminals & Interconnection Systems, Others. The Passive Components segment is further bifurcated into Resistors, Capacitors, Inductors, Transformers, Magnetic Components, Sensors, Piezoelectric Components, Others. The Electromechanical Components (Emech) segment is further bifurcated into Relays, Switches (Pushbutton, Toggle, Rotary), Motors & Actuators, Circuit Breakers & Fuses, Solenoids & Valves, Integrated Mechanical Systems, Others. The Interconnects segment dominated the global market in 2024, while the Interconnects segment is projected to be the fastest–growing segment during the forecast period.

Interconnects are essential in facilitating the smooth transmission of power, data, and signals between different electronic systems. In the interconnects and passive components industry, connectors like Board-to-Board, Wire-to-Board, I/O, Fiber Optic, RF, and Backplane connectors are fundamental components that connect different sections of a device or system. Board-to-Board connectors enable two circuit boards to directly talk to each other, and Wire-to-Board connectors connect the wires to the boards to ensure that there is an uninterrupted flow of electrical signals. I/O connectors transfer input as well as output data, and Fiber Optic connectors facilitate high-speed data transmission with interference-free flow essential for contemporary communication systems.

Based on technology, the Global Interconnects and Passive Components market has been segmented into Optical Interconnects, Wireless Interconnects, High-Speed Connectors (USB, HDMI, etc.), 5G and Telecom Infrastructure, Surface Mount Technology (SMT) Components, MEMS-based Components (Micro Electromechanical Systems), Smart Electromechanical Systems (IoT-enabled), and Microactuators & Robotics Integration & others. The Surface Mount Technology (SMT) Components segment dominated the global market in 2024, while the 5G and Telecom Infrastructure segment is projected to be the fastest–growing segment during the forecast period. Surface Mount Technology (SMT) has become a force driving the interconnects and passive components market; it has changed the way electronic devices are assembled. The through-hole component mounts the component through holes in the PCB, whereas SMT components are mounted directly to the surface of the PCB and allow for smaller, reliable designs that are cost-effective. This technology allows for the manufacturing of electronic devices that are smaller and lighter, making it the backbone of everything from smartphones to wearables and automotive electronics.

Based on End User, the global Interconnects and Passive Components market has been segmented into Automotive, Consumer Electronics, Telecommunications, Industrial Equipment & Manufacturing, Medical Devices & Healthcare, Aerospace & Defense, IT & Data Centers, Power Generation & Distribution, Robotics, Energy & Utilities, and Others. The Automotive segment dominated the global market in 2024, while the Robotics segment is projected to be the fastest–growing segment during the forecast period.

The automotive industry is one of the key end-users of the interconnects and passive components market, being that contemporary vehicles increasingly rely on sophisticated electronic systems for better performance, safety, and comfort. Putting this into perspective, demand for interconnects and passive components has with incredible vigor surged from ADAS, infotainment, powertrain control, and EV systems, to being used in many aspects of automotive operations. Connectors, sensors, resistors, and capacitors play a key role in the facilitation of interchange within electronic systems in an auto high-speed connectors used for infotainment systems, while safety features depend on sensors, such as airbags and collision avoidance systems.

Regional Analysis

Based on the Region, the global Interconnects and Passive Components is segmented into North America, Europe, Asia-Pacific, South America and Middle East & Africa. The Asia Pacific dominated the global market in 2024, while the Asia Pacific is projected to be the fastest–growing segment during the forecast period.

Major demand factors driving the Asia Pacific market are The Asia-Pacific interconnects and passive components market is witnessing rapid growth due to fast-paced technological developments and rising demand across different industries. The key growth driver is the growth of consumer electronics, especially in China, Japan, South Korea, and Taiwan, which together account for close to 45% of the world's market share in immersive media technologies. This expansion is fueled by the presence of giant consumer electronics companies and the expansion of the growing middle class with rising disposable incomes. Contributing to the expansion as well is the expansion of the Internet of Things (IoT), where governments and private players are significantly investing in IoT infrastructure to raise connectivity and automation. For instance, Singapore's Infocomm Media Development Authority (IMDA) established plans to build up IoT strengths, as its potential to grow the economy and improve city life is huge.

Key Findings of the Study

• The Global Interconnects and Passive Components Market is expected to reach USD 267.67 Billion by 2035, at a CAGR of 5.0% during the forecast period.


• The Asia Pacific region accounted for the fastest growing in the global market.


• Based on Technology, the Surface Mount Technology (SMT) Components segment was attributed to holding the largest market in 2024.


• Kyocera Corporation, Murata Manufacturing Co., Ltd, Samsung Electro-Mechanics, TDK Corporation, Taiyo Yuden Co., Ltd, Molex Incorporated, Amphenol Corporation, Vishay INTERTECHNOLOGY, TE Connectivity Corporation, Hirose Electric Co and among others are the key market players.