Wi-Fi Chipset Market is predicted to reach USD 35.91 billion at a CAGR of 6.02% during the forecast period

Market Research Future (MRFR) has published a cooked research report on the “Global Wi-Fi chipset market”.

MRFR recognizes the following companies as the key players in the global Wi-Fi Chipset market— Mediatek Inc (Taiwan), Qualcomm Technologies Inc (US), STMicroelectronics NV (Switzerland), Intel Corporation (US), Cypress Semiconductor Corporation (US), Global Foundries (US), Broadcom Inc (US), Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan), Quantenna Communications Inc (US), Marvell Technology Group Ltd (Bermuda), Peraso Technologies Inc (Canada), Samsung Electronics Co Ltd (South Korea), Texas Instruments Inc (US), and United Microelectronics Corporation (Taiwan).

Market Highlights

The global Wi-Fi Chipset market is accounted to register a CAGR of 6.02% during the forecast period and is estimated to reach USD 35.91 billion by 2030.

The Wi-Fi chipset market is the sector focused on the production and distribution of integrated circuits (ICs) that enable wireless communication through Wi-Fi technology. These chipsets are used in various devices like smartphones, laptops, routers, and IoT devices to facilitate wireless internet connectivity and data transfer. The market is driven by the growing demand for high-speed, reliable wireless connectivity across a wide range of consumer and industrial applications.

Segment Analysis

The global Wi-Fi Chipset market has been segmented based on Type, Fabrication Technology, Die Size and  Application.

On the basis of Type, the market is segmented into Wi-Fi and industrial Wi-Fi. In 2021, the industrial Wi-Fi market held the lion's share, contributing roughly 46-49% of the Wi-Fi Chipset Market's revenue. The significant expansion is linked to the rise in popularity of high-performance network connectivity, which enables several users to connect at once with steady bandwidth capacity.

Based on Fabrication Technology, the global Wi-Fi Chipset market has been segmented into FinFET, Fdsoi Cmos, silicon-on-insulator (SOI), and Sige. During the projection period of 2022–2030, Silicon on Insulator (SOI), which dominated the global market in 2021, is anticipated to grow at the quickest rate. Plug-and-play capabilities are highly incorporated in silicon on insulation (SOI).

Based on Die Size, the global Wi-Fi Chipset market has been segmented into 28nm, 20nm, 14nm, and 10nm. Because it was the standard size used by all producers of chipsets worldwide in 2021, the 20nm die size segment had the highest market revenue share.

Based on Application, the global Wi-Fi Chipset market has been segmented into smartphones, tablets, and PCs. The smartphone application market has the biggest revenue share in 2021. The market for smartphone Wi-Fi chipsets is being driven in part by increasing 5G implementation initiatives in numerous nations around the world.

Regional Analysis

The global Wi-Fi Chipset market, based on region, has been divided into the North America, Europe, Asia-Pacific, and Rest of the World. North America consists of US and Canada. The Europe Wi-Fi Chipset market comprises of Germany, France, the UK, Italy, Spain, and the rest of Europe. The Wi-Fi Chipset market in Asia-Pacific has been segmented into China, India, Japan, Australia, South Korea, and the rest of Asia-Pacific. The Rest of the World Wi-Fi Chipset market comprises of Middle East, Africa, and Latin America.

The North American Wi-Fi Chipset Market dominated this market in 2022 representing USD 9.87 billion in 2021 as a result of significant regional IoT adoption. Further investment in the wireless chipset market is encouraged by the rising popularity of high-tech smart gadgets and consumer electronics as well as wireless chipsets.  Furthermore, North America is a key geographical market for Wi-Fi chipset technology due to the main wireless businesses' strong presence there.

Due to the rising popularity of open-source software and data security in the region, the European Wi-Fi chipset market is the second largest in the world. During the assessment period, it is anticipated that the use of smartphones in Germany and the United Kingdom would increase the market share of regional Wi-Fi semiconductor chipsets. Lower costs and improvements in smartphone technology are responsible for this expansion. The smartphone Wi-Fi chipset market in Europe is also being driven by the growing consumption of Wi-Fi chipsets by businesses & organisations, automotive industries, and smart gadgets, as well as the expanding demand for Wi-Fi chipsets by IEEE standards.

Due to the existence of numerous Wi-Fi chipset manufacturing companies and the use of Wi-Fi chipsets in completed goods, the Asia Pacific Wi-Fi chipset market is anticipated to develop at the quickest CAGR during the projected period. Additionally, it's expected that growing government adoption of public hotspots in developing nations like Japan, South Korea, China, Singapore, and India would fuel the demand for Wi-Fi devices over the course of the coming years.

Browse In-depth Details [Table of Content, List of Figures, List of Tables] of Wi-Fi Chipset market Research Report

Key Findings of the Study

• The global Wi-Fi Chipset market is expected to reach USD 35.91 billion by 2030, at a CAGR of 6.02% during the forecast period.


• The North American Wi-Fi Chipset Market dominated this market in 2022 representing USD 9.87 billion in 2021 as a result of significant regional IoT adoption.


• Based on Die Size, the 20nm die size segment had the highest market revenue share.


• Mediatek Inc (Taiwan), Qualcomm Technologies Inc (US), STMicroelectronics NV (Switzerland), Intel Corporation (US), Cypress Semiconductor Corporation (US), Global Foundries (US), Broadcom Inc (US), and Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan).