Pune, India, September 2020, MRFR Press Release/- Market Research Future has published a Cooked Research Report on the Global Silicon Wafers Market.
Global Silicon Wafers Market is expected to reach USD 11,889.0 Million by 2025 at a CAGR of 3.19% during the forecast period. Market Research Future (MRFR), in its report, envelops segmentation and drivers to provide a better glimpse of the market in the coming years. Silicon wafers act as the perfect substrate material for modern semiconductors and microelectronic devices. It is used for producing microchips & chips and building ICs that are used in a wide range of electronic devices. Silicon wafers are polished, cleaned, and processed so that they can be used for different applications. The increasing demand for silicon wafers in consumer electronics, and the demand for the miniaturization of semiconductor devices are the growth factors for the global silicon wafer market. However, high manufacturing costs and design complexity are some of the few key factors that limit market growth.
The Key Players of the Global Silicon Wafers Market are Shin-Etsu Chemical Co., Ltd. (Japan), SK Siltron Co., Ltd. (South Korea), Siltronic AG (Germany), GlobalWafers Co., Ltd. (Taiwan), Wafer World, Inc. (US), Advanced Semiconductor, Inc. (US), Sumco Corporation (Japan), Soitec SA (France), Silicon Materials, Inc. (US), Addison Engineering, Inc. (US), and Virginia Semiconductor, Inc. (US), among others.
Browse Full Report Details @ https://www.marketresearchfuture.com/reports/silicon-wafers-market-2052
Global Silicon Wafers Market has been segmented based on Material, Type, Application, and Region.
Based on material, the market has been bifurcated into P-type and N-type. The P-type segment accounted for the larger market share valued at USD 5,519.7 million in 2019; it is expected to record a CAGR of 2.6% during the forecast period. The N-type segment was valued at USD 4,101.8 million; it is projected to register a higher CAGR of 3.9%.
Based on type, the silicon wafers market has been segmented into polished wafers, annealed wafers, epitaxial wafers, diffused wafers, and SOI wafers. These types are used as per the required functionality and the number of devices to be manufactured. The epitaxial wafers segment has dominated the market during the forecast period, followed by the polished wafer and SOI wafer segments. Epitaxial wafers are developed through the epitaxy process. In this process, an additional monocrystalline silicon layer is deposited on to the polished crystal surface of a silicon wafer. Moreover, these types of wafers are used in highly integrated semiconductor elements such as ICs, power devices, and various power applications. Polished wafers are silicon wafers that are either polished on a single side or on both sides to provide them with a reflective surface based on the requirement. These wafers have properties such as flatness and cleanliness. These types of wafers are prime wafers that are used in various components and devices such as MOS ICs, LSI analog, and others.
Based on application, the silicon wafers market has been segmented into solar cells, integrated circuits, photoelectric cells, smartphones, tablets, smart wafers, microchips, transistors, diodes and rectifiers, MEMS fabrication, and others. The rising development in the electronics industry is another factor that is increasing the scope of application for silicon wafers. Silicon wafers play a vital role in the overall functionality of solar cells, as silicon is the basic component for these cells. Silicon wafers are used in solar cells due to their optical, electronic, mechanical, and thermal properties. Additionally, to increase the capability of silicon in the solar cells, various impurities are imposed on the silicon wafers, which enhance the overall performance of the cells and covert the sun’s energy into electrical energy.
By wafer size, the market is segmented into 300mm, 150mm, 200mm, and 450mm and above. The 300 mm wafers are widely used for several applications. The diameter of this type of wafer is generally larger to improve throughput and reduce costs. The increasing demand for connected devices, data transport and storage, big data, and AI technology drives the market for 300mm wafers. They are widely used in semiconductor components such as commodity chips, including DRAMs, flash memory, and microprocessors owing to their high-volume. Recently, most of the image sensors, power management devices, and complex logic and micro component ICs with large die sizes have been produced on 300 mm wafers. Chipmakers such as Samsung, Toshiba, and Micron, use 300mm wafers for most of their chip production.
The global silicon wafers market, by region, has been segmented into North America, Europe, Asia-Pacific, and the rest of the world. Asia-Pacific accounted for the largest market share with a market value of USD 4,371.2 million in 2019. North America was the second-largest market in 2019, valued at USD 2,383.0 million.