Molded Interconnect Device Market Poised to Grow at A CAGR Over 14.20% between 2023 and 2032

Growing use of LDS process for the production of 5G antennas, which increases the speed and efficiency of wireless communication is expected to drive market expansion in the near futureat a CAGR of 14.20% during the forecast period 2023 to 2032.

Market Research Future (MRFR) has published a cooked research report on the “Global Molded Interconnect Device Market “that contains information from 2018 to 2032.Thegreen ammonia market is estimated to register a CAGR of 14.20% during the forecast period of 2023 to 2032.

MRFR recognizes the following companies as the key players in the Global Molded Interconnect Device market— GALTRONICS, HARTING Technology Group, MacDermid, Inc., LPKF Laser & Electronics AG, Cicor Management AG, YOMURA, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, BASF SE, EMS-CHEMIE HOLDING AG, DSM, Ensinger, Evonik Industries AG, LANXESS, MITSUBISHI GAS CHEMICAL COMPANY, INC., PTS (TQM) Ltd., and ZEON CORPORATION, among others.

Market Highlights

The Global Molded Interconnect Device market is accounted to register a CAGR of 14.20% during the forecast period and is estimated to reach USD 5.29 Billion by 2032.

The strong demand for smart consumer electronics will bolster the industry growth.

With the escalating adoption of next-gen electronics, the need for manufacturing technologies that reduce weight and maximize space while offering increased capabilities has elevated. Molded interconnect devices (MID) technology is being leveraged to integrate functions in one 3-D package, resulting in compact, lightweight, and high-capability electronic devices. Additionally, the demand for terminal devices such as smartphones, notebooks, and smartwatches has been surging. These factors will fuel the deployment of MID technology, given its high energy efficiency, interconnectivity, and smaller footprint.

Segment Analysis

The Global Molded Interconnect Device market has been segmented based on product type, process, and vertical.

On the basis of product type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting System, Others. The antennae & connectivity modules segment rely heavily on efficient wireless connectivity. Antennae facilitate wireless communication, enabling devices to transmit and receive data. They play a critical role in various applications, from loT devices to smartphones and automotive systems.

Based on process, the Global Molded Interconnect Device market has been segmented into Laser Direct Structuring (LDS), Two-shot Molding, Film Techniques. Two-shot molding is valued for its efficiency in producing complex, multi-material components. The segment on two- shot molding underscores its pivotal role in advancing MID technology and its potential to revolutionize various product sectors.

Based on vertical, the Global Molded Interconnect Device market has been segmented into Telecommunication, Consumer Electronics, Automotive, Medical, Industrial, and Military & Aerospace. Consumer electronics is a significant vertical that primarily utilises MIDs. Due to its capacity to provide small, light-weight designs with excellent functionality, MIDs are preferred in consumer electronics

Browse In-depth Details [Table of Content, List of Figures, List of Tables] of Molded Interconnect Device Market Research Report

Regional Analysis

The Global Molded Interconnect Device market, based on region, has been divided into the North America, Europe, Asia-Pacific, and Rest of the World. North America consists of US and Canada. The Europe green ammonia market comprises of Germany, France, the UK, Italy, Spain, and the rest of Europe. The green ammonia market in Asia-Pacific has been segmented into China, India, Japan, Australia, South Korea, and the rest of Asia-Pacific. The Rest of the World green ammonia market comprises of Middle East, Africa, and Latin America.

The largest market share for molded interconnected device was maintained by the North American regional sector. The healthcare industry utilizes MIDs in devices such as insulin pumps and medical sensors. The region is also witnessing a surge in IoT (Internet of Things) devices, which further stimulates the demand for MIDs.

Moreover, the Europe market has been persistently growing over the forecast period. The region's strong focus on technological innovation and research and development activities has led to continuous advancements in MID technology.

Additionally, due to the increasing disposable income and urbanization in the Asia-Pacific region have led to a surge in demand for consumer electronics, further driving the market for MIDs. For instance, the Indian government claimed that it will increase the country's electric vehicle sales through the provision of subsidies. The Asia Pacific market will benefit from a growing emphasis on environmentally friendly energy sources.

Furthermore, the Rest of the World (ROW) region, comprising emerging markets in Africa, Latin America, and parts of the Middle East, has become a focal point for MID adoption. Factors driving this expansion include a rising demand for compact, multifunctional electronic components and increasing industrialization.

Key Findings of the Study

• The global molded interconnect device market is expected to reach USD 5.29 billion by 2032, at a CAGR of 14.20% during the forecast period.


• The Asia-Pacific region accounted for the fastest-growing global market due to the growing usage of miniaturized electronic components in vehicles, are projected to add impetus to the regional expansion.


• Based on process, the two-shot molding segment was attributed to holding the largest market in 2022, with an approximate market share of 45–65%.


• GALTRONICS, HARTING Technology Group, MacDermid, Inc., LPKF Laser & Electronics AG, Cicor Management AG, YOMURA, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, BASF SE, EMS-CHEMIE HOLDING AG, DSM, Ensinger, Evonik Industries AG, LANXESS, MITSUBISHI GAS CHEMICAL COMPANY, INC., PTS (TQM) Ltd., and ZEON CORPORATION, among others