Q3 2026: Qualcomm (US): Qualcomm announced its Snapdragon Sound Elite Gen 2 platform at the Snapdragon Summit 2026, combining advanced Bluetooth audio streaming, on-device AI capabilities, and micropower Wi-Fi 6E connectivity for next-generation wearables and audio glasses.
Cella Electronics Announces Industry-Leading Bluetooth 5.3 LE Audio SoC on April 12, 2024. It’s a new System-on-Chip (SoC) developed specifically for LE Audio applications on the market by Cella Electronics. With litt, and multi-stream audio, low latency, next-generation wireless earbuds and hearables are the perfect market for the SoC.
Qualcomm Unveils New Bluetooth Audio Development Kit for Faster Product Design on February 07, 2024. In addition to other things available at their disposal throughout the lifecycle of the ADK, Qualcomm provides developers who want to integrate Bluetooth audio solutions into their own products with the full set of necessary tools, hence speeding up the time-to-market for next-gen wireless headphones and speakers.
Dialog Semiconductor Teams Up with Nexperia To Boost Bluetooth Low Energy Solutions on March 21st 2024. This collaboration will combine Dialog’s experience in BLE technology with Nexperia’s power management offerings.
Renesas Electronics Corporation launched its SmartBond DA1470x Bluetooth low energy (LE) solution, which is a power management system for wireless devices, in June 2022. The application is suitable for use in smartwatches, home appliances, audio equipment, fitness trackers, medical equipment etc.
Semiconductor Components Industries, LLC unveiled NCV-RSL15; this is a microcontroller with Bluetooth Low Energy connectivity that ensures security and low power consumption when used in tire monitoring and vehicle access systems.
Nordic releases nRF5340 audio-making kit DK – a quick-start tool designed to enable the development of Bluetooth LE Audio products in May 2022. All things required within an LE development project are provided by this audio DK nRF5340.Nordic calls it a grand need and works very well with any other complex IoT projects, especially those compatible with LE Audio.
In March 2022, ROHM introduced D/A converter IC named BD34352EKV and the associated evaluation board known as BD34352EKV-EVK-001. Both of them play an important role as they provide high-quality sound for hi-fi audio devices.
June 2022: released its new Bluetooth Location Services solution, which employs special, low-power Bluetooth devices to simplify Angle of Arrival (AoA) and Angle of Departure (AoD) location services. This unique platform integrates hardware and software to deliver energy efficiency by combining Silicon Labs' BG22 SiP modules and SoCs, which can work for around 10 years on a coin cell battery, with progressive software that can track assets, enhance indoor navigation, and locate tags with sub-meter accuracy.