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3D IC Market Size

ID: MRFR//1231-CR | 90 Pages | Author: Shubham Munde| February 2020

The Global 3D IC market has seen significant growth in recent years and is anticipated to reach a whopping USD 35.75 billion by 2030. This growth is expected to occur at a Compound Annual Growth Rate (CAGR) of 20.3% between 2022 and 2030, indicating a robust upward trajectory.

Breaking it down regionally, the Asia-Pacific region took the lead in the 3D IC market in 2021, holding a substantial 41.76% share. Following closely were North America and Europe, with shares of 31.09% and 23.26%, respectively. The demand for 3D IC in various sectors such as IT & Telecommunications, consumer electronics, industrial, aerospace & defense, automotive, medical, and others has been a driving force behind the market's growth, particularly in the Asia-Pacific region.

The global 3D IC market has been categorized into different segments based on technology type, packaging & integration type, component, product, application, and region. Among these segments, 3D Stacking IC claimed the largest market share in the technology type category, reaching a market value of USD 5.58 billion in 2021. This segment is expected to maintain a strong growth momentum with a projected CAGR of 19.7% during the forecast period.

When considering packaging & integration type, 3D System Package emerged as the leader, holding a market value of USD 3.0 billion in 2021. This segment is forecasted to grow at a CAGR of 19.5%. In terms of components, Through Glass Via (TGV) secured the top position, boasting a market value of USD 3.43 billion in 2021 and an anticipated CAGR of 19.0% in the forecasted period.

Examining the product category, Logic took the spotlight by accounting for the largest market share with a value of USD 2.67 billion in 2021. The Logic segment is expected to continue its growth at a CAGR of 20.5% during the forecast period. Moving to applications, Consumer Electronics dominated with the largest market share, valued at USD 2.21 billion in 2021. This segment is projected to experience the highest CAGR of 21.7% during the forecasted period. However, the Automotive sector also played a significant role, securing the second-highest market share with a value of USD 1.69 billion in 2021 and an expected CAGR of 20.6% in the forecasted period.

Covered Aspects:

Report Attribute/Metric Details
Market Size Value In 2022 USD 8 Billion
Market Size Value In 2023 USD 9.6 Billion
Growth Rate 20.10% (2023-2032)

Global 3D IC Market Overview:

3D IC Market Size was valued at USD 9.6 Billion in 2023. The 3D IC market industry is projected to grow from USD 11.52 Billion in 2024 to USD 41.5 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 17.36% during the forecast period (2024 - 2032). Increased demand for advanced electronic products and high demand for 3D packaging using TSVs are the key market drivers enhancing the market growth.

3D IC Market Overview

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

3D IC Market Trends

  • Growing demand for advanced electronic products is driving the market growth.

Market CAGR for 3D IC is driven by the rising demand for advanced electronic products. Developing smart cars, industrial gear, and infrastructure brings the significant potential to the 3D IC market. The widespread use of smartphones and other wearable technology worldwide is another feature defining the dynamic integrated circuit market environment. The market value for 3D integrated circuits will also increase due to the increasing demand from the ICT sector.

In addition, the market is developing due to the rising demand for integrated circuits and improved electronics architecture with low power consumption characteristics. This is further helped by the new trend of IC integration and wafer-level packaging in sensors and other miniaturized electronic devices. Further aiding market expansion is the widespread use of 3D IC smart home appliances such as security locks, thermostats, fan controls, smart smoke alarms, window sensors, and energy monitors. They are also included in many medical devices, including tiny heart monitors, sight and hearing aids, and other medical equipment. Consumer knowledge of the many benefits of the products-better speed, memory, durability, efficiency, performance, and fewer timing delays- is growing, boosting the market growth.

As countless of new devices are connected to the internet, IoT technology is expanding at a rate that fuels expansion. In addition, new units, such as computers, sensors, data storage devices, and associated infrastructure, explain the increased demand that these electronic components experience due to their capacity to communicate with one another and integrate into networks and software systems. Thus, driving the 3D IC market revenue.

3D IC Market Segment Insights:

3D IC Components Insights

The 3D IC Market segmentation, based on components, includes Through Glass Vias (TGVs), Through Silicon Vias (SGVs), and others. The through silicon vias (TGVs) segment dominated the market, accounting for maximum market revenue. TGVs are expanding exponentially due to smart electronics such as smartphones, tablets, laptops, and other devices becoming more widely used. Since these TSVs are mostly employed in constructing 3D integrated circuits (ICs) and IC packaging, which is among the essential elements in producing smart electronics. In addition, the TSVs offer the best connectivity compared to traditional flip-chips and wire bonds.

Figure 1: 3D IC Market, by Components, 2022 & 2032 (USD Billion)

3D IC Market, by Components, 2022 & 2032

Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

3D IC Application Insights

The 3D IC Market segmentation, based on application, includes aerospace & industrial, telecommunication & IT, automotive, consumer electronics, medical, industrial, and others. The consumer electronics segment generated the most income. As a result of the rising demand for various innovative and small consumer electronics goods with improved functionality, such as laptops, smartphones, and tablets, the consumer electronics industry has experienced significant growth.

3D IC Technology Insights

The 3D IC Market segmentation, based on technology, includes technology type, 3D stacked ICs, Monolithic 3D ICs, and integration and packaging type. The 3D stacked ICs segmentation has dominated the market due to its functionality, performance, power consumption, and combination of costs. Additionally, 3D stacked ICs are growing due to increased application across industries.

3D IC Products Insights

The 3D IC Market segmentation, based on products, includes 3D memory, light-emitting diodes (LEDs), CMOS image sensors, and sensors and MEMs. The sensors and MEMs category generated the most income due to the functional components of MEMs microactuators, microsensors, and microelectronics. The advanced elements of MEMs are gyroscopes, digital compasses, accelerometers, inertial modules, humidity sensors, microphones, pressure sensors, and smart sensors, among others. The main need in all these elements and sensors is a miniature structure. Therefore, many sensors have started using 3D IC.

3D IC Regional Insights

By region, the study provides market insights into North America, Europe, Asia-Pacific and Rest of the World. The North American 3D IC market will dominate this market due to the massive demand for security systems and business intelligence. Additionally, the easy availability of raw materials and increasing demand for 3D integrated circuits will boost the market growth in this region.

Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.

Figure 2: 3D IC Market SHARE BY REGION 2022 (USD Billion)


Source: Secondary Research, Primary Research, MRFR Database and Analyst Review

Europe 3D IC market accounts for the second-largest market share due to rising demand for IoT-based electronics. Further, the German 3D IC market held the largest market share, and the UK 3D IC market was the fastest-growing market in the European region.

The Asia-Pacific 3D IC Market is expected to grow at the fastest CAGR from 2023 to 2032 due to rising demand for consumer electronics and the use of smart devices. Moreover, China’s 3D IC market held the largest market share, and the Indian 3D IC market was the fastest-growing market in the Asia-Pacific region.

3D IC Key Market Players & Competitive Insights

Leading market players are investing heavily in research and development to expand their product lines, which will help the 3D IC market, grow even more. Market participants are also undertaking various strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, the 3D IC industry must offer cost-effective items.

Manufacturing locally to minimize operational costs is one of the key business tactics manufacturer’s use in the global 3D IC industry to benefit clients and increase the market sector. In recent years, the 3D IC industry has offered some of the most significant advantages to 3D ICs. Major players in the 3D IC market, including United Microelectronics Corporation, Tezzaron Semiconductor Conductor Corporation, 3M Company Besang Inc., IBM Corporation, Xilinx Inc., Monolithic 3D Inc., Intel Corporation, Toshiba Corp. Amkor Technology, Samsung Electronics Co. Ltd., and others, are attempting to increase market demand by investing in research and development operations.

Siemens Digital Industries Software is an American computer software organization specializing in 3D & 2D Product Lifecycle Management tools. The corporation, which has its corporate headquarters in Plano, Texas, goes by the legal name Siemens Industry Software Inc. For Instance: September 2022, Siemens Digital Industries Software and United Microelectronics (UMC), a top semiconductor foundry, announced the creation of a workflow for 3D integrated circuits (ICs) hybrid bonding. For UMC’s wafer-on-wafer and chip-on-wafer technologies, businesses have created a new multi-chip 3D IC planning, assembly validation, and parasitic extraction (PEX) workflow.

STMicroelectronics N.V., sometimes known as ST or STMicro, is a Dutch global firm specializing in technology with French and Italian roots. Its headquarters are Plan-les-Ouates, which is close to Geneva, Switzerland and listed on the French stock exchange. The largest semiconductor, contract manufacturing and design business in Europe is ST. In 1987, Thomson Semiconductors of France and SGS Microeletronica of Italy, two government-owned semiconductor businesses, merged to form the corporation. For instance: in September 2022, a sophisticated VDA-complaint LIN alternator regulator was revealed by STMicroelectronics, a British company, to improve the performance and adaptability of 12V automotive systems. With the help of a 3D IC and improved functionality, STMicroelectronics unveiled the L9918 automotive alternator regulator to guarantee the reliability of 12V automotive systems. L9918 allows users to specify settings such as alternator characteristics and voltage set points.

Key Companies in the 3D IC market include

  • United Microelectronics Corporation

  • Tezzaron Semiconductor Conductor Corporation

  • 3M Company Besang Inc.

  • IBM Corporation

  • Xilinx Inc.

  • Monolithic 3D Inc.

  • Intel Corporation

  • Toshiba Corp. Amkor Technology

  • Samsung Electronics Co. Ltd.

3D IC Industry Developments

March 2022: Amkor Technology, a trade with South Korea headquarters, joins hands with the TSMC OIP 3D Fabric. With initial access to TSMC’s 3D Fabric technology, the new 3D Fabric Alliance’s partners can advance their products parallel with TSMC. They can also propose a steady supply of 2.5 ICs and 3D ICs of premium quality.

October 2021: Cadence Design Systems, Inc announced the delivery of the Integrity 3D-IC platform. It is the first 3D IC platform on the market to combine system analysis, design planning, and high capacity 3D implementation into a unified cockpit.

May 2021: Intel expects to spend USD 3.5 billion upgrading its Rio Rancho facility, one of its three main US manufacturing hubs, and aiding more than 35% of its workforce there. It is enlarging its facilities in New Mexico to produce new generations of chips based on its Foveros 3D packaging technology, which might support the business’s efforts to restore its position as the market leader in the semiconductor sector.

3D IC Market Segmentation:

3D IC Components Outlook

  • Through Glass Vias (TGVs)

  • Through Silicon Vias (TSVs)

  • Others

3D IC Application Outlook

  • Aerospace & Industrial

  • Telecommunication & IT

  • Automotive

  • Consumer Electronics

  • Medical

  • Industrial

  • Others

3D IC Technology Outlook

  • Technology Type

  • 3D Stacked ICs

  • Monolithic 3D ICs

  • Integration and Packaging Type

3D IC Products Outlook

  • 3D memory

  • Light Emitting Diodes (LEDs)

  • CMOS Image Sensors

  • Sensors and MEMs

3D IC Regional Outlook

  • North America

    • US

    • Canada

  • Europe

    • Germany

    • France

    • UK

    • Italy

    • Spain

    • Rest of Europe

  • Asia-Pacific

    • China

    • Japan

    • India

    • Australia

    • South Korea

    • Australia

    • Rest of Asia-Pacific

  • Rest of the World

    • Middle East

    • Africa

    • Latin America

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