3D IC (Integrated Circuit) companies specialize in creating advanced semiconductor packaging solutions that stack multiple integrated circuits on top of each other to improve performance and reduce space. These technologies are crucial for high-performance computing and mobile devices.
*Disclaimer: List of key companies in no particular order
The Competitive Landscape of the 3D IC Market
The 3D IC market, a futuristic fusion of silicon layers. This intricate tapestry of opportunity demands a clear understanding of the players, strategies, and factors shaping the competitive landscape. Navigating this intricate landscape requires a clear understanding of the strategies, factors, and players shaping this competitive terrain.  Understanding the competitive landscape is crucial for navigating this intricate ecosystem.
Some of the 3D IC companies listed below:
Strategies Adopted by Leaders
Factors for Market Share Analysis:
3D Integration Technology:Â Analyzing market share by technology type (TSV, 3D NAND, chip-on-chip) reveals dominant players in each segment and future growth potential. For instance, Samsung leads in 3D NAND, while Intel dominates in logic stacking.
Application Segment:Â Understanding the needs of different end-user segments (mobile, consumer electronics, automotive, etc.) is key. Mobile devices prioritize miniaturization and power efficiency, while high-performance computing demands high-density stacking and bandwidth.
Geographical Variations:Â North America and Asia Pacific remain the largest markets, with China driving rapid growth. Understanding regional manufacturing capabilities, government policies, and technology adoption rates is crucial for targeted expansion.
Foundry Landscape:Â The dominance of foundries like TSMC and Samsung significantly impacts market dynamics. Analyzing their technology roadmaps, client partnerships, and pricing strategies helps players navigate the supply chain landscape.
New and Emerging Companies:
Industry Developments:
On Sep. 25, 2023-Â TSMC announced a breakthrough set (3Dblox 2.0 and 3DFabric Alliance) to redefine the future of 3D IC. The 3Dblox 2.0 features a 3D IC design capability that significantly boosts design efficiency. The 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration.
TSMC detailed the new 3Dblox 2.0 and 3DFabric Alliance achievements at the 2023 OIP Ecosystem Forum. The company also mentioned that it will continue to push the envelope of 3D IC innovation, making its 3D silicon stacking and advanced packaging technologies accessible to its customers.
On Sep. 25, 2023-Â ProteanTecs, a leading global provider of deep data analytics for advanced electronics, announced that it has joined the TSMC Open Innovation Platform (OIP) 3D Fabric Alliance. The 3D Fabric Alliance was formed to encourage 3D IC innovation, readiness, and customer adoption.
On Sept. 27, 2023-Â Synopsys, Inc. (SNPS) announced extending its collaboration with TSMC to streamline multi-die system complexity with the unified exploration-to-signoff platform and proven UCIe IP on the TSMC N3E process. The comprehensive multi-die system design solution supports 3dblox 2.0 standard and TSMC 3dfabric technologies to boost productivity for fast heterogeneous integration.
On Oct. 02, 2023-Â Cadence Design Systems (CDNS) announced the availability of enhanced system prototyping methods based on its Integrity 3D-IC Platform, aligned with the 3Dblox 2.0 standards. The platform has been tailored to suit TSMC's latest 3DFabric technologies, such as chip-on-wafer-on-substrate, integrated fan-out, and system-on-integrated chips. This collaboration will allow customers to model system prototypes, expediting the design process for AI, mobile, 5G, hyper scale computing, and IoT 3D-IC designs.
3D IC Market Size was valued at USD 8 Billion in 2022. The 3D IC market industry is projected to grow from USD 9.6 Billion in 2023 to USD 41.5 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 20.10% during the forecast period (2023 - 2032). Increased demand for advanced electronic products and high demand for 3D packaging using TSVs are the key market drivers enhancing the market growth.
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
Market CAGR for 3D IC is driven by the rising demand for advanced electronic products. Developing smart cars, industrial gear, and infrastructure brings the significant potential to the 3D IC market. The widespread use of smartphones and other wearable technology worldwide is another feature defining the dynamic integrated circuit market environment. The market value for 3D integrated circuits will also increase due to the increasing demand from the ICT sector.
In addition, the market is developing due to the rising demand for integrated circuits and improved electronics architecture with low power consumption characteristics. This is further helped by the new trend of IC integration and wafer-level packaging in sensors and other miniaturized electronic devices. Further aiding market expansion is the widespread use of 3D IC smart home appliances such as security locks, thermostats, fan controls, smart smoke alarms, window sensors, and energy monitors. They are also included in many medical devices, including tiny heart monitors, sight and hearing aids, and other medical equipment. Consumer knowledge of the many benefits of the products-better speed, memory, durability, efficiency, performance, and fewer timing delays- is growing, boosting the market growth.
As countless of new devices are connected to the internet, IoT technology is expanding at a rate that fuels expansion. In addition, new units, such as computers, sensors, data storage devices, and associated infrastructure, explain the increased demand that these electronic components experience due to their capacity to communicate with one another and integrate into networks and software systems. Thus, driving the 3D IC market revenue.
The 3D IC Market segmentation, based on components, includes Through Glass Vias (TGVs), Through Silicon Vias (SGVs), and others. The through silicon vias (TGVs) segment dominated the market, accounting for maximum market revenue. TGVs are expanding exponentially due to smart electronics such as smartphones, tablets, laptops, and other devices becoming more widely used. Since these TSVs are mostly employed in constructing 3D integrated circuits (ICs) and IC packaging, which is among the essential elements in producing smart electronics. In addition, the TSVs offer the best connectivity compared to traditional flip-chips and wire bonds.
Figure 1: 3D IC Market, by Components, 2022 & 2032 (USD Billion)
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
The 3D IC Market segmentation, based on application, includes aerospace & industrial, telecommunication & IT, automotive, consumer electronics, medical, industrial, and others. The consumer electronics segment generated the most income. As a result of the rising demand for various innovative and small consumer electronics goods with improved functionality, such as laptops, smartphones, and tablets, the consumer electronics industry has experienced significant growth.
The 3D IC Market segmentation, based on technology, includes technology type, 3D stacked ICs, Monolithic 3D ICs, and integration and packaging type. The 3D stacked ICs segmentation has dominated the market due to its functionality, performance, power consumption, and combination of costs. Additionally, 3D stacked ICs are growing due to increased application across industries.
The 3D IC Market segmentation, based on products, includes 3D memory, light-emitting diodes (LEDs), CMOS image sensors, and sensors and MEMs. The sensors and MEMs category generated the most income due to the functional components of MEMs microactuators, microsensors, and microelectronics. The advanced elements of MEMs are gyroscopes, digital compasses, accelerometers, inertial modules, humidity sensors, microphones, pressure sensors, and smart sensors, among others. The main need in all these elements and sensors is a miniature structure. Therefore, many sensors have started using 3D IC.
By region, the study provides market insights into North America, Europe, Asia-Pacific and Rest of the World. The North American 3D IC market will dominate this market due to the massive demand for security systems and business intelligence. Additionally, the easy availability of raw materials and increasing demand for 3D integrated circuits will boost the market growth in this region.
Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.
Figure 2: 3D IC Market SHARE BY REGION 2022 (USD Billion)
Source: Secondary Research, Primary Research, MRFR Database and Analyst Review
Europe 3D IC market accounts for the second-largest market share due to rising demand for IoT-based electronics. Further, the German 3D IC market held the largest market share, and the UK 3D IC market was the fastest-growing market in the European region.
The Asia-Pacific 3D IC Market is expected to grow at the fastest CAGR from 2023 to 2032 due to rising demand for consumer electronics and the use of smart devices. Moreover, China’s 3D IC market held the largest market share, and the Indian 3D IC market was the fastest-growing market in the Asia-Pacific region.
Leading market players are investing heavily in research and development to expand their product lines, which will help the 3D IC market, grow even more. Market participants are also undertaking various strategic activities to expand their global footprint, with important market developments including new product launches, contractual agreements, mergers and acquisitions, higher investments, and collaboration with other organizations. To expand and survive in a more competitive and rising market climate, the 3D IC industry must offer cost-effective items.
Manufacturing locally to minimize operational costs is one of the key business tactics manufacturer’s use in the global 3D IC industry to benefit clients and increase the market sector. In recent years, the 3D IC industry has offered some of the most significant advantages to 3D ICs. Major players in the 3D IC market, including United Microelectronics Corporation, Tezzaron Semiconductor Conductor Corporation, 3M Company Besang Inc., IBM Corporation, Xilinx Inc., Monolithic 3D Inc., Intel Corporation, Toshiba Corp. Amkor Technology, Samsung Electronics Co. Ltd., and others, are attempting to increase market demand by investing in research and development operations.
Siemens Digital Industries Software is an American computer software organization specializing in 3D & 2D Product Lifecycle Management tools. The corporation, which has its corporate headquarters in Plano, Texas, goes by the legal name Siemens Industry Software Inc. For Instance: September 2022, Siemens Digital Industries Software and United Microelectronics (UMC), a top semiconductor foundry, announced the creation of a workflow for 3D integrated circuits (ICs) hybrid bonding. For UMC’s wafer-on-wafer and chip-on-wafer technologies, businesses have created a new multi-chip 3D IC planning, assembly validation, and parasitic extraction (PEX) workflow.
STMicroelectronics N.V., sometimes known as ST or STMicro, is a Dutch global firm specializing in technology with French and Italian roots. Its headquarters are Plan-les-Ouates, which is close to Geneva, Switzerland and listed on the French stock exchange. The largest semiconductor, contract manufacturing and design business in Europe is ST. In 1987, Thomson Semiconductors of France and SGS Microeletronica of Italy, two government-owned semiconductor businesses, merged to form the corporation. For instance: in September 2022, a sophisticated VDA-complaint LIN alternator regulator was revealed by STMicroelectronics, a British company, to improve the performance and adaptability of 12V automotive systems. With the help of a 3D IC and improved functionality, STMicroelectronics unveiled the L9918 automotive alternator regulator to guarantee the reliability of 12V automotive systems. L9918 allows users to specify settings such as alternator characteristics and voltage set points.
United Microelectronics Corporation
Tezzaron Semiconductor Conductor Corporation
3M Company Besang Inc.
IBM Corporation
Xilinx Inc.
Monolithic 3D Inc.
Intel Corporation
Toshiba Corp. Amkor Technology
Samsung Electronics Co. Ltd.
March 2022: Amkor Technology, a trade with South Korea headquarters, joins hands with the TSMC OIP 3D Fabric. With initial access to TSMC’s 3D Fabric technology, the new 3D Fabric Alliance’s partners can advance their products parallel with TSMC. They can also propose a steady supply of 2.5 ICs and 3D ICs of premium quality.
October 2021: Cadence Design Systems, Inc announced the delivery of the Integrity 3D-IC platform. It is the first 3D IC platform on the market to combine system analysis, design planning, and high capacity 3D implementation into a unified cockpit.
May 2021: Intel expects to spend USD 3.5 billion upgrading its Rio Rancho facility, one of its three main US manufacturing hubs, and aiding more than 35% of its workforce there. It is enlarging its facilities in New Mexico to produce new generations of chips based on its Foveros 3D packaging technology, which might support the business’s efforts to restore its position as the market leader in the semiconductor sector.
Through Glass Vias (TGVs)
Through Silicon Vias (TSVs)
Others
Aerospace & Industrial
Telecommunication & IT
Automotive
Consumer Electronics
Medical
Industrial
Others
Technology Type
3D Stacked ICs
Monolithic 3D ICs
Integration and Packaging Type
3D memory
Light Emitting Diodes (LEDs)
CMOS Image Sensors
Sensors and MEMs
North America
US
Canada
Europe
Germany
France
UK
Italy
Spain
Rest of Europe
Asia-Pacific
China
Japan
India
Australia
South Korea
Australia
Rest of Asia-Pacific
Rest of the World
Middle East
Africa
Latin America
3D IC Market Highlights:
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