Advanced Semiconductor Packaging Market is projected to reach USD 64.96 Billion by 2032 | MRFR

Climbing sales of consumer electronics and faster penetration of emerging technologies are expected to drive market expansion shortly at a CAGR of 8.00% during the forecast period 2023 to 2032.

Market Research Future (MRFR) has published a cooked research report on the “Advanced Semiconductor Packaging Market” that contains information from 2018 to 2032. The Advanced Semiconductor Packaging Market is estimated to register a CAGR of 8.00% during the forecast period of 2023 to 2032.

MRFR recognizes the following companies as the key players in the global Advanced Semiconductor Packaging Market— Advanced Semiconductor Engineering, Inc., Intel Corporation, Advanced Micro Devices, Inc. (AMD), Amkor Technology, Hitachi Chemical, Jiangsu Changjiang Electronics Technology (JCET), Infineon, Kyocera, Sumitomo Chemical, China Wafer Level CSP, Ultratech.

Market Highlights

The global Advanced Semiconductor Packaging Market is accounted to register a CAGR of 8.00% during the forecast period and is estimated to reach USD 64.96 billion by 2032.

The increasing intricacy of integrated circuits (ICs) has resulted in elevated production costs for wafers. This, in turn, is driving a heightened demand for cutting-edge semiconductor packaging solutions. These advanced packaging methods are being embraced to enhance the efficiency of integrating processors, memory components, and accelerators, particularly for applications in artificial intelligence (AI) and machine learning.

Segment Analysis

The global Advanced Semiconductor Packaging Market has been segmented based on Packaging Type, and Application.

Based on Packaging Type, the market is segmented into Fan-out Wafer Level Package (FO WLP), 5D/3D, Fan-in Wafer Level Package (FI WLP), and Flip Chip. The Fan-out Wafer Level Package (FO WLP) segment was attributed to holding the largest market share in 2022. The Fan-Out Wafer-Level Packaging (FOWLP) technique is widely utilized in mobile devices, including smartphones, tablets, and smartwatches. It offers an effective solution for creating compact, high-performance devices. By consolidating multiple chips like application processors, memory, and power management units into a single package, FOWLP enhances the overall functionality and performance of electronic devices.

Based on the Application, the Advanced Semiconductor Packaging Market has been segmented into Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others. The Consumer Electronics segment was expected to hold the largest market share in 2022. In the realm of consumer electronics, advanced packaging plays a pivotal role in the creation of smaller, more potent, and feature-packed devices. Notably, high-resolution display technologies like OLED and micro-LED screens experience substantial advantages as a result of advanced semiconductor packaging solutions.

Browse In-depth Details [Table of Content, List of Figures, List of Tables] of Advanced Semiconductor Packaging Market Research Report

Regional Analysis

The global Advanced Semiconductor Packaging Market, based on region, has been divided into North America, Europe, Asia-Pacific, and the Rest of the World. North America consists of the US and Canada. The Europe Advanced Semiconductor Packaging Market comprises of Germany, France, the UK, Italy, Spain, and the rest of Europe. The Advanced Semiconductor Packaging Market in Asia-Pacific has been segmented into China, India, Japan, Australia, South Korea, and the rest of Asia-Pacific. The Rest of the World's Advanced Semiconductor Packaging Market comprises of Middle East, Africa, and Latin America.

The largest market share for the Advanced Semiconductor Packaging Market was maintained by the North American regional sector. The Advanced Semiconductor Packaging Market in North America is experiencing robust growth, primarily fueled by a dedicated emphasis on technological progress and innovative solutions. This region boasts a substantial presence of prominent semiconductor enterprises and renowned research institutions, fostering the continuous advancement of state-of-the-art chip packaging methodologies and materials. Key industry players in North America, including Intel Corporation, Qualcomm Technologies, Inc., Amkor Technology, Inc., and Texas Instruments Incorporated, are actively contributing to and benefiting from this environment of innovation and progress.

Moreover, the Europe market has been persistently growing over the forecast period. The European Advanced Semiconductor Packaging market is notably marked by an increasing focus on sustainable and environmentally friendly packaging solutions. The region is proactively investigating eco-conscious packaging materials and methods to curtail environmental footprints and cater to the preferences of environmentally aware consumers. Dominant Market Players – Prominent entities in the European market encompass ASML Holding N.V., Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V. These industry leaders are at the forefront of delivering advanced chip packaging solutions that align with the sustainability objectives of European sectors.

Manufacturers in the Asia-Pacific region are strategically expanding their customer base in North America, driven by the escalating demand from data centers and artificial intelligence applications. For instance, Ibiden is actively working on augmenting its sales to semiconductor players like Intel, while also rationalizing its Flip Chip business, which primarily serves the domestic smartphone market. Additionally, the company plans to enhance the production capacity at its Japanese facility by 50% by the end of 2020, with a particular focus on silicon bridges, critical components that connect memory semiconductors with central processing units (CPUs), and graphics processing units (GPUs). Furthermore, China, as one of the world's fastest-growing economies with a vast population, is playing a significant role in the global semiconductor landscape. Data from China's semiconductor association reveals a consistent increase in the import of integrated circuits (ICs) since 2014, signifying a rising demand. The Chinese government has implemented a comprehensive strategy to support the development of the domestic IC industry, aiming to establish global leadership across all key segments of the IC supply chain by 2030. This surge in the semiconductor IC industry within the region is poised to stimulate the demand for advanced semiconductor packaging solutions.

Furthermore, the rest of the world's Advanced Semiconductor Packaging Market is divided into the Middle East, Africa, and Latin America. In this region, the Advanced Semiconductor Packaging market is influenced by increasing investments in infrastructure development and smart city initiatives. The demand for chip packaging solutions for IoT applications, telecommunication infrastructure, and industrial automation drives the market’s growth.

Key Findings of the Study

• The global Advanced Semiconductor Packaging Market is expected to reach USD 64.96 billion by 2032, at a CAGR of 8.00% during the forecast period.


• The Asia-Pacific region accounted for the fastest-growing global market because of rapid industrialization and the adoption of advanced technologies. The region’s focus on 5G deployment, IoT applications, and smart manufacturing fuels the demand for innovative chip packaging techniques.


• Based on Packaging Type, the Fan-Out Wafer-Level Packaging (FOWLP) segment was attributed to holding the largest market in 2022, with an approximate market share of 55–60%.


• Advanced Semiconductor Engineering, Inc., Intel Corporation, Advanced Micro Devices, Inc. (AMD), Amkor Technology, Hitachi Chemical, Jiangsu Changjiang Electronics Technology (JCET), Infineon, Kyocera, Sumitomo Chemical, China Wafer Level CSP, Ultratech