Advanced Packaging Market is Projected to Reach USD 60,779.67 Million by 2030

Market Research Future (MRFR) has published on the “Global Advanced Packaging Market”.  

The Advanced Packaging market is estimated to register a CAGR of 7.92% during the forecast period of 2023 to 2030.

MRFR recognizes the following companies as the key players in the Advanced Packaging market— Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc, Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp, Nepes Corporation, Powertech Technology Inc. and many more.

Market Highlights

The Global Advanced Packaging market is accounted for to register a CAGR of 7.92% during the forecast period and is estimated to reach USD 60,779.67 Million by 2030.

The progress in packaging technology is closely linked to the growth in the functional density of large system-on-chip solutions. Consequently, the emphasis on heterogeneous integrations and wafer-level packages has compelled the chip industry to develop a new range of solutions collectively referred to as advanced packaging. Another notable trend impacting the advanced packaging market is the transition from 100 mm to 300 mm silicon wafers. Shifting to larger diameter wafers has resulted in a 20-25% reduction in manufacturing costs, thereby driving investments toward advanced packaging solutions. The increasing miniaturization of devices and the growing adoption of micro-electromechanical systems (MEMS) have also contributed to the renewed demand for embedded die packaging. While the technology has been in the market for some time, its applications have been limited to niche areas due to high costs and low yields. Nevertheless, it holds significant potential for future development. Advancements in Bluetooth, RF modules, and the emergence of WiFi-6 are expected to further stimulate investments in this technology.

Access full report @ https://www.marketresearchfuture.com/reports/advanced-packaging-market-12461

Segment Analysis

The Global Advanced Packaging market has been segmented into type and end-user.

Based on the type, the Global Advanced Packaging market is segmented into Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging and Others. The Flip Chip Ball Grid Array type segment is expected to dominate the global Advanced Packaging market during the forecast period. The Flip Chip Ball Grid Array (FCBGA), or Flip-chip BGA, is a semiconductor packaging solution that utilizes flip chip technology for interconnecting the die and substrate. FCBGA offers high performance at a mid-cost range, enabling higher signal density and functionality in a smaller footprint. It is particularly suitable for applications where performance takes precedence over cost considerations. Standard printed circuit boards can be used to mount Flip-chip BGA packages, and existing repair practices can be employed for replacement. Most Flip-chip BGA packages are assembled on high-density ceramic substrates or organic laminates with two-metal layers or multiple layers. These packages are available in different configurations, including bare die, flat lid, and full lid. They are extensively used in high-performance applications, including ASICs, DSPs, and other semiconductor devices.

Based on the end-user, the Global Advanced Packaging market has been bifurcated into Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive and Other. The Consumer Electronics segment is expected to show maximum growth during the forecast period. The advanced packaging market is anticipated to experience substantial growth in response to the increasing demand for consumer electronics. Consumer electronics encompasses a wide range of electronic devices and gadgets designed for regular use by individuals for personal or non-commercial purposes. The demand for advanced packaging is driven by its crucial role in enhancing the sophistication and functionality of these products. Furthermore, the rising popularity of advanced connected homes is expected to contribute to the sales of consumer electronics, further fueling the demand for advanced packaging. Modern appliances with features like Wi-Fi connectivity, Bluetooth, and voice assistance are particularly sought after by millennials. As global income levels continue to rise, consumers increasingly desire to equip their homes with the latest technology-driven products. These factors will positively impact the sales of advanced packaging for consumer electronics.

Regional Analysis

The Global Advanced Packaging market, based on country, has been divided into North America, Europe, Asia Pacific, South America, and Middle East & Africa. North America consists of US, Canada, Mexico. Europe consists of UK, Germany, France, Italy, and Rest of Europe. Asia-Pacific consists of China, India, Japan, and Rest of Asia-Pacific. South America consists of Brazil, Argentina, and Rest of South America. Middle East & Africa consists of South Africa, Saudi Arabia, UAE, and Rest of Middle East & Africa. The Asia-Pacific region has dominated the market share in 2022. The market share in the Asia-Pacific region is significant due to the high number of semiconductor manufacturing operations there. Manufacturers in this region are increasing their production capacity to meet the growing demand from fabless vendors, and China is trying to consolidate its substrate manufacturing market. China, one of the largest growing economies with a large population, has recently witnessed increasing demand for semiconductor ICs. The Chinese government has implemented a multi-pronged strategy to support the development of the domestic IC industry and aims to become a global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry is expected to drive the demand for advanced packaging.

The North America advanced packaging market is experiencing significant growth due to several factors. Firstly, there is a rising demand for consumer electronics, which directly impacts the market. As people increasingly rely on electronic devices for various purposes, such as communication, entertainment, and productivity, the need for advanced packaging solutions to accommodate these devices' complex and compact designs is growing.

The Europe Advanced Packaging Market growth can be attributed to the rapid expansion of the advanced packaging market, particularly in wafer level packaging, fueled by the increasing demand for smartphones, electronic devices, and the Internet of Things (IoT). To meet this growing demand, suppliers of advanced packaging are actively developing processes and strategies to reduce the overall cost of advanced packaging and ensure optimal operational efficiency.

The advanced packaging material market in South America is growing steadily, driven by several factors. The increasing demand for advanced electronic devices such as smartphones, tablets, and wearable devices is driving the need for advanced packaging solutions. These devices require smaller, more powerful, and energy-efficient semiconductor chips, which can be achieved through advanced packaging technologies. Furthermore, South America's growing adoption of emerging technologies such as artificial intelligence (AI), Internet of Things (IoT), and 5G connectivity is fueling the demand for advanced packaging materials. These technologies require high-performance and reliable semiconductor chips, which can be achieved through advanced packaging techniques.

The Middle East and Africa (MEA) region is experiencing significant growth in the advanced packaging semiconductor material market. Advanced packaging refers to integrating and encapsulating semiconductor chips compactly and efficiently, enabling higher performance and functionality in electronic devices. The MEA region is witnessing a surge in demand for advanced packaging solutions due to the rapid expansion of industries such as telecommunications, automotive, consumer electronics, and healthcare. These industries require advanced packaging technologies to meet the increasing demand for smaller, faster, and more energy-efficient electronic devices.

Key Findings of the Study

• The Global Advanced Packaging market is expected to reach USD 60,779.67 Million by 2030, at a CAGR of 7.92% during the forecast period.


• The Asia-Pacific held the largest market share during the forecast period. Manufacturers in this region are increasing their production capacity to meet the growing demand from fabless vendors, and China is trying to consolidate its substrate manufacturing market.


• Based on type, the Flip Chip Ball Grid Array (FCBGA) segment was attributed to holding the largest market in 2022.


• Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc, Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp, Nepes Corporation, Powertech Technology Inc., and many more, are the key players in the market.


• Based on end-user, the consumer electronics segment held the largest market share in 2022.