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    Embedded Die Packaging Technology Market

    ID: MRFR/SEM/32243-HCR
    128 Pages
    Aarti Dhapte
    October 2025

    Rapport d’étude de marché sur la technologie d’emballage sous matrice intégrée par application (électronique grand public, télécommunications, automobile, industriel), par type d’emballage (emballage au niveau de la plaquette en éventail, emballage au niveau de la plaquette intégré, emballage 2.5D, emballage 3D), par type de matériau (silicium, substrats organiques, céramique, polymère), par industrie d’utilisation finale (fabrication électronique, industrie automobile, dispositifs de santé, aérospatiale) et par région (Amérique du Nord, Eur...

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    Case Study
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