ID: MRFR/SEM/2363-CR | 139 Pages | Published By Shubham Munde on April 2019
The optical sensing market is expected to reach USD 6.7 Billion by the year 2030 while registering a CAGR of 14.7%
$6.7 Billion
14.7%
North America
2022-2030
Report Attribute/Metric | Details |
---|---|
Market Size | USD 6.7 Billion |
CAGR | 14.7% |
Base Year | 2021 |
Forecast Period | 2022-2030 |
Historical Data | 2020 |
Forecast Units | Value (USD Billion) |
Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, and Trends |
Segments Covered | Type, Method, Technology, Application, Vertical |
Geographies Covered | North America, Europe, Asia-Pacific, and Rest of the World (RoW) |
Key Vendors | Analog Devices Inc., Teledyne Technologies Incorporated, Oxsensis Ltd, TE Connectivity Ltd., ABB Ltd., ROHM Company Ltd., Hamamatsu Photonics K.K., Sony Corporation, STMicroelectronics N.V., Infineon Technologies AG., ams AG, Texas Instrument |
Key Market Opportunities | Increasing adoption of optical sensors in machine vision applications. |
Key Market Drivers | The increasing penetration of smartphones. The rising adoption of optical sensors. |
The market is assessed to mark 22.41% CAGR.
The market is supposed to earn USD 6.7 Billion by 2030.
North America market is expected to mark 14.67% CAGR.
By type, the segments profiled are fiber optic sensors, image sensors, position sensors, ambient light sensors, and others.
Different applications identified in the report are metrology, medical instruments, pressure and strain sensing, temperature sensing, biometric and ambience sensing, remote sensing satellite, and geographical survey.
The verticals are - aerospace & defense, automotive, healthcare, consumer electronics, government & utilities, oil & gas, transportation, and construction among others.
The market share analysis offered covers the following key players - Hamamatsu Photonics K.K., ABB Ltd., Analog Devices Inc., STMicroelectronics N.V., Texas Instrument Incorporated, Teledyne Technologies Incorporated, ams AG., Oxsensis Ltd, Infineon Technologies AG., ROHM Company Ltd, Sony Corporation, TE Connectivity Ltd.