ID: MRFR/SEM/7233-HCR | February 2021 | Region: Global | 100 pages
Global Electronic Packaging Market is estimated to reach USD 2254.49 Million by 2025, registering a CAGR of 16.10% during the forecast period of 2019–2025.
Electronic packaging is defined as interconnecting chips and electronic components into a microsystem. The microsystems consist of various components such as diodes, ICs, amplifiers, rectifiers, chips, to protect the internal components from shocks, water, and fire, among others. This packaging is being applied to electronic devices and gadgets. The increasing demand for consumer electronics across the globe is one of the major factors driving the growth of the market across the globe. Additionally, the increasing adoption of smartphones across the globe is also propelling the growth of the market. However, concerns associated with heat dissipation and initial high cost for electronic packaging are some of the factors which are hindering the growth of the market. The increasing utilization of and advancements in IoT and wireless devices across the globe are also contributing to the growth of the global electronic packaging market.
The Global Electronic Packaging Market has been segmented based on Material, Packaging Technology, End-User, and Region.
By Material, the market has been segmented into plastic, metal, glass, and others.
By Packaging Technology, the market has been segmented into the through-hole mounting, surface surface-mount technology (SMD), and chip-scale packages (CSP).
By End User, the market has been segmented into consumer electronics, aerospace & defense, automotive, telecommunication, and others.
By Region, the market has been segmented into North America, Europe, Asia-Pacific, and the rest of the world.
Global Electronic Packaging Market, 2017–2025 (USD Million)
Source: MRFR Website
The Global Electronic Packaging Market is estimated to grow at a significant rate during the forecast period from 2019 to 2024. The geographic analysis of the global electronic packaging market has been conducted for North America (the US, Canada, and Mexico), Europe (the UK, Germany, France, Spain, Italy, and the rest of Europe), Asia-Pacific (China, Japan, India, and the rest of Asia-Pacific), and the rest of the world (the Middle East and Africa and South America).
According to MRFR analysis, Asia-Pacific dominated the market in 2018 and is expected to dominate during the forecast period due to the rising demand for consumer electronics across the region. Moreover, the presence of various electronic packaging companies—such as Samsung Electronics Corporation Ltd and Taiwan Semiconductor Manufacturing Co. Ltd—offering electronic packaging material and technology further propels the growth of the market in the region. Moreover, rising population and increasing disposable income in the region are some of the major factors which are increasing the demand for consumer electronics; this is further propelling the growth of the electronic packaging market in the region. Additionally, a key market driver for the region is its dominance in the production of semiconductor devices globally. Major players in the semiconductor packaging market have manufacturing facilities in Asia-Pacific, which led to the faster development of electronic packaging technologies and enabled the easy accessibility of products to the market. Based on countries, the region has been segmented into China, Japan, India, and the rest of Asia-Pacific. China dominated the market in 2018, followed by India. Furthermore, government-backed initiatives and investments for promoting the cutting-edge technology and developing semiconductor packaging solution further help to drive the market
MRFR recognizes the key players in the Global Electronic Packaging Market as AMETEK Inc. (US), Dordan Manufacturing Company (US), DuPont de Nemours, Inc. (the US), GY Packaging, (US), Plastiform Inc. (US), Kiva Container Corporation (US), Primex Design & Fabrication (US), Quality Foam Packaging Inc. (US), Sealed Air Corporation (US), The Box Co-Op (US), UFP Technologies, Inc. (US), Intel Corporation (US), STMicroelectronics NV (Switzerland), Xilinx Inc. (US), Samsung Electronics Corporation Ltd (South Korean), AMS AG (Austria), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), among others.
The Prominent Players keep innovating and investing in research and development to present a cost-effective product portfolio. There have been recent mergers and acquisitions among the key players, a strategy the business entities leverage to strengthen their reach to the customers.
Frequently Asked Questions (FAQ) :
A. The valuation of the electronic packaging market is assessed to touch USD 2254.49 Mn by 2025.
A. The electronic packaging market is poised to strike 16.10% CAGR over 2025.
A. The segments of the electronic packaging market, by packaging technology, are surface surface-mount technology (SMD), through-hole mounting, and chip-scale packages (CSP).
A. APAC is likely to thrive on account of the rising demand for consumer electronics.
A. By material, the segments of the electronic packaging market are plastic, glass, metal, and others.