Globally, the size of the Chip Scale Package LED Market Size is projected to grow by 19.4% to hit USD 1,807.5 Million by 2027 driven by the higher adoption rate. The traditional LEDs mostly go through the chip manufacturing process. The die is attached to a package LED that is in the ceramic substrate or another component. This entire process is known as the packaged LED. In chip-scale LED, the production process and cost of manufacturing are the ultimate. The CSP LED skips the production process and has an efficient production time. The chip-scale LED is considered as the popular trend in the chip-scale package LED market.
There are certain standards for any chip to qualify for a package. In this case, the chips scale packaged LED is qualified for the die and they have an effortless production process. The penetration of these chip scales is comparatively less than traditional packaged LED. However, this chip scale will have a higher potential in the upcoming year. It has attractive features and cost benefits that will create tremendous demand for the chip scale package LED market. The demand for this chip scale is high in backlight applications. It is an energy-efficient chip scale for many electronics. All these factors will incredibly raise the chip scale package LED market value by USD 1,807.5 million by 2023.
The emergence of the Covid 19 pandemic is expected to cause global health and economic crisis in various markets. The effects of this pandemic are on a long-term basis for many industries. Consumer behavior, market trends, and dynamics have changed in the period. The chip-scale package LED market is witnessing a few challenges in this period. The manufacturing process of his market is slowing down.
The lockdowns and restrictions have led to the shutdown of the production facilities of this market. Also, the disruption in the supply chain has damaging effects. Less availability of resources is another difficulty. The entire market operations came to a halt last year. However, from 2021 the market operations are recovering. Profitable developments are expected in the forecast period.
The low-cost potential of omitting various packaging steps is a restraint of the chip scale package LED market. The packaging or bill material of this product is low cost. The less cost involved in manufacturing these chip scales is profitable to the overall market. Due to the low-cost potential, the finished product is affordable for industries. These factors drive immense demand for this market. Many packaging processes are omitted that even lessen the time of production. These factors will lead to high investment in the chip-scale package market in the forecast period.
The features of the chip scale package (CSP) led are better than traditional ones. It attracts more end users to this market. The exceptional features of this product will widen the supply chain in the upcoming years. Especially, the high package density, wide-angle beam, and form factor are some of the factors that incline the end-users to invest in these chips scale. The improvements in these features will attract a wider audience from different verticals. Further, the low thermal resistance is a prominent advantage in the chips scale package LED. Uniform spreading is another factor that contributes to the higher adoption rate of this technology. All these factors will enhance Chip Scale Package LED Market Research.
The high adoption rate of chip-scale package LED in the automotive sector will bring massive growth opportunities. The replaceable headlights are some of the equipment requiring the chip-scale package LED. These lighting systems in the automotive sector have the highest demand for the chip-scale LED package. These LEDs are higher efficiency and cost-efficient. Most vehicle manufacturers prefer the chip-scale package LED due to this wide range of applications and cost benefits.
Further, the general lighting applications are another area requiring the chips scale LED. The general applications are for smartphones, monitors, and many more important technologies. More awareness about black-lit technology will enhance the opportunities for the market. Further, the innovation in the GAN-on-Si will further rise the development opportunities for the market. The Chip Scale Package LED Market Growth will expand the overall market.
The Chip Scale Package (CSP) Technology is designed for general lighting in retail stores and other applications. It supports the small luminaries. The compact and morrow beam angle can provide a spotlight in some areas. However, the overburden of LED Foundries is a restraining factor of the chip scale package LED market.
These LEDs are 40 percent efficient and 60 percentage of this energy is emitted as heat. Overheating can cause damage and thermal management is essential to reduce the heat. These factors can impact the overall demand for the product in the forecast period. The overburden is a major drawback that hinders the use of this packaged LED.
The premium usage of the chip-scale package LED is restricted which is a major market challenge. Due to its limited features, this product is restricted to premium products. Also, overheating issues are one of the major causes of restriction. Due to this, the chip scale package LED market expansion rate is affected in the forecast period. Also, the chip scale package LED is fragile.
Serious damage can happen due to overburdening. They are not suitable for high-pressure areas. The limitations in its performance make it fragile. They are mostly used for general lighting. The wider use of this technology in major industries is limited as it is fragile. The poor module designs can hinder the adoption rate of this product in the forecast period. All these market challenges can affect the preference of end-users.
The chip-scale package market trend is surging in the forecast period. There are plenty of factors responsible for the positive market scenario. The chips scale package omits various manufacturing processes that are key driver.
It is a market driver that positively impacts the growth of the chip scale package LED market. Further, high investments will lead to plenty of improvements. However, the overheating problem is a crucial challenge that can hamper the demand. Also, the product is inefficient to use premium products. Overall, promising growth opportunities will sustain the development of the chip scale package LED market.
The Asia Pacific region dominates the overall chip scale package LED market. It is a region with the fastest growth and adoption of technology. The need for these chips scales is higher in retail stores and general purposes. Further, it is a region holding the largest Chip Scale Package LED Market Share.
The automotive industry has the largest demand for CSP LED. Headlights and equipment are some parts requiring these LEDs. Also, a general lightning application has a wider application for the CSP lights. The key players in the chip scale package LED market will bring more developments in the forecast period. In the upcoming years, technological advancement is higher for the market.
The competition in the Chip Scale Package LED Market is high with more than 25 players. The top leader is establishing many product strategies. The product portfolio is developing in the overall market. Mergers, expansion, partnership, and acquisition are the key strategies in the competitive landscape.
Asia Pacific, Europe, and North America are the key players of the chip scale package LED market. The Asia Pacific will be the leading market with higher profitability. The demand in this region is constantly rising from the automotive sector. Further, product variation is expected to attract new end users to the chip scale package LED market.
The integration of GAN-is will bring more favorable changes in the Asia Pacific market. North America is the next largest region with high demand. The presence of top key players brings a positive impact on the chip scale package LED market. The key players are taking plenty of initiatives to create more awareness. It is a region that will have a higher profitability rate in the forecast period.
| Report Attribute/Metric | Details |
| Market Size | USD 1,807.5 Million |
| CAGR | 19.4% |
| Base Year | 2019 |
| Forecast Period | 2020-2027 |
| Historical Data | 2018 |
| Forecast Units | Value (USD Million) |
| Report Coverage | Revenue Forecast, Competitive Landscape, Growth Factors, and Trends |
| Segments Covered | Application, Power Range, Geography |
| Geographies Covered | North America, Europe, Asia-Pacific, and Rest of the World (RoW) |
| Key Vendors | Lumileds Holding B.V. (US), Samsung Electronics Co., Ltd. (South Korea), Semiconductor Co., Ltd. (South Korea), OSRAM Opto Semiconductors GmbH (Germany), LG Innotek (South Korea), Epistar Corp. (Taiwan), Cree, Inc. (US), Genesis Photonics Inc. (Taiwan), Semileds Corporation (Taiwan), and Lextar Electronics Corporation (Taiwan) |
| Key Market Opportunities | The applications in general lighting is another big opportunity for the chip scale package LED market to grow with significant rate in the upcoming years. |
| Key Market Drivers | Low manufacturing cost High package density |
Chip Scale Package LED Market Highlights:
Frequently Asked Questions (FAQ) :
Chip Scale Package LED Market Size is projected to grow by 19.4% to hit USD 1,807.5 Million by 2027
Lumileds Holding B.V. (US), Samsung Electronics Co., Ltd. (South Korea), Semiconductor Co., Ltd. (South Korea), OSRAM Opto Semiconductors GmbH (Germany), LG Innotek (South Korea), Epistar Corp. (Taiwan), Cree, Inc. (US), Genesis Photonics Inc. (Taiwan), Semileds Corporation (Taiwan), and Lextar Electronics Corporation (Taiwan)
By application, the segments of the chip scale package LED market are
The market is assessed to expand at the highest CAGR owing to the presence of innovative semiconductor companies.
On the basis of power range, the chip scale package LED market has been segmented into high power, and low- & mid-power.
Senior Research Analyst Ankit gupta is an analyst in market research industry in ict and semi industry. with post-graduation in "telecom and marketing management" and graduation in "electronics and telecommunication" vertical he is well versed with recent development in ict industry as a whole. having worked on more than 150+ reports including consultation for fortune 500 companies such as microsoft and rio tinto in identifying solutions with respect to business problems his opinions are inclined towards mixture of technical and managerial aspects.
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