Increasing complexity and miniaturization of electronic devices, such as smartphones, tablets, and wearables, is expected to drive market expansion in the near future at a CAGR of 9.20% during the forecast period 2023 to 2032

Market Research Future (MRFR) has published on the “Global Underfill Dispensers Market”.

The Underfill Dispensers market is estimated to register a CAGR of 9.20% during the forecast period of 2023 to 2032.

MRFR recognizes the following companies as the key players in the global Underfill Dispensers market— Henkel, MKS Instruments, Shenzhen STIHOM Machine Electronics, Zmation, Nordson Corporation, Illinois Tool Works, Master Bond, Zymet, Essemtec.

Market Highlights

The global Underfill Dispensers market is accounted to register a CAGR of 9.20% during the forecast period and is estimated to reach USD 107.9 billion by 2032.

The demand for underfill dispensers is driven by the growth of emerging technologies like 5G, AI, and IoT, which require high-performance and durable electronics. Moreover, the expansion of automotive electronics and the aerospace industry further contribute to the demand for underfill dispensers to ensure robust and long-lasting connections in harsh environments. As the devices like smartphones, tablets, and wearables, become more compact and densely packed with semiconductor components, underfill dispensers are essential for filling gaps between chips and substrates, enhancing the structural integrity and reliability of the final products.

Segment Analysis

The global Underfill Dispensers market has been segmented based on product type and end use.

On the basis of product type, the market is segmented into Capillary Flow Underfill, No Flow Underfill and Molded Underfill. The capillary flow underfill segment was attributed to holding the largest market share in 2022, due to its simplicity and cost-effectiveness.

Based on end use, the global Underfill Dispensers market has been segmented into Ball Grid Array and Chip Scale Packaging. The ball grid array segment was expected to hold the largest market share in 2022, as BGAs are commonly used in high-density and high-performance electronic devices, such as microprocessors and GPUs.

Regional Analysis

The global Underfill Dispensers market, based on region, has been divided into the North America, Europe, Asia-Pacific, and Rest of the World. North America consists of US and Canada. The Europe Underfill Dispensers market comprises of Germany, France, the UK, Italy, Spain, and the rest of Europe. The Underfill Dispensers market in Asia-Pacific has been segmented into China, India, Japan, Australia, South Korea, and the rest of Asia-Pacific. The Rest of the World Underfill Dispensers market comprises of Middle East, Africa, and Latin America.

The largest market share for Underfill Dispensers was maintained by the North American regional sector. This increase is attributed to the robust presence of the semiconductor and electronics manufacturing industries in the region. The demand for underfill dispensers is further fueled by the growing focus on innovation and research and development in emerging technologies, including 5G networks, artificial intelligence, and the Internet of Things (IoT). Additionally, the automotive sector's increasing integration of electronics, as well as aerospace and defense applications, contributes to the need for reliable underfill dispensing solutions to ensure long-term performance and durability in various harsh environments.

Moreover, the Europe market has been persistently growing over the forecast period. The demand for Underfill Dispensers is driven by the region's strong presence in the automotive and industrial sectors, where underfill dispensers are crucial for enhancing the reliability and durability of electronic components in vehicles and industrial equipment, ensuring performance in challenging conditions.

Additionally, Asia Pacific is anticipated to experience the quickest growth over the forecast period due to the region's robust electronics manufacturing sector, which includes the production of consumer electronics, semiconductor devices, and automotive electronics. As Asia Pacific continues to be a global hub for high-tech manufacturing and innovation, the demand for underfill dispensers is fueled by the need for reliable, high-performance electronics in a variety of applications across the region.

Furthermore, the rest of the world's Underfill Dispensers market is divided into the Middle East, Africa, and Latin America. This growth is attributed to the region's growing electronics manufacturing sector, as well as the increasing adoption of advanced electronics and automation in various industries. Government support, a rise in investor interest, and the viability of the technology in the sector are all contributing factors to the market expansion.

Key Findings of the Study

• The global Underfill Dispensers market is expected to reach USD 104.9 billion by 2032, at a CAGR of 9.20% during the forecast period.


• The Asia-Pacific region accounted for the fastest-growing global market due to the region's robust electronics manufacturing sector, which includes the production of consumer electronics, semiconductor devices, and automotive electronics.


• Based on product type, the capillary flow underfill segment was attributed to holding the largest market in 2022, with an approximate market share of 45–65%.


• Henkel, MKS Instruments, Shenzhen STIHOM Machine Electronics, Zmation, Nordson Corporation, Illinois Tool Works, Master Bond, Zymet, Essemtec.