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Electronic Thermal Management Material Market Research Report: By Material Type (Thermal Interface Materials, Phase Change Materials, Thermal Conductive Adhesives, Thermal Greases, Liquid Cooling Materials), By Application (Consumer Electronics, Automotive, Aerospace, Telecommunications, Industrial Equipment), By Form Factor (Sheet Form, Paste Form, Liquid Form, Composite Form), By Functionality (Heat Dissipation, Temperature Regulation, Thermal Insulation, Heat Sink Integration), By End User (Original Equipment Manufacturers, Aftermarket, Research Institutions, Government Agencies) and By Region (North America, Europe, South America, Asia Pacific, Middle East and Africa)- Forecast to 2034
No. of Pages: 111
Report Code : MRFR/CnM/30394-HCR
