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Chip Packaging Market Research Report By Technology (Inorganic Technology, Organic Technology, Hybrid Technology), By Packaging Type (Thin-Film Packaging, Ball Grid Array, Chip-on-Board, Flip Chip Packaging, Wafer-Level Packaging), By Application (Consumer Electronics, Automotive Electronics, Telecommunications, Aerospace and Defense, Industrial Applications), By Material (Silicon, Ceramic, Plastic, Glass, Copper) and By Regional (North America, Europe, South America, Asia Pacific, Middle East and Africa) - Forecast to 2035.

No. of Pages: 128

Report Code : MRFR/SEM/12354-HCR

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