Access to all Exclusive Statistical Reports in PDF!
The Global 3D IC’s market, by component statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by component (Through silicon vias (TSVs), Through glass vias (TGVs)) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
TSVs or through silicon vias are kind of holes created in silicon wafers. It is an essential component of 3D integration packaging. It vertically interconnect die to improve electrical performance which includes high conductivity, low RC delay, lesser power consumption, and compact size of 3D integrated circuits. TSVs also performs integration of heterogeneous die which thereby significantly increases the bandwidth of the logical device and memory.
Through Silicon vias (TSVs) 3D IC’s market is expected to grow with 19% CAGR during forecast period 2016-2022
FIGURE 1 THROUGH SILICON VIAS (TSVS) MARKET, 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Through Silicon Vias (TSVs) 3D IC’s Market, by Region, 2016-2022 (USD Million)
2. Through Silicon Vias (TSVs) 3D IC’s Market, by Region Market Data
List of Tables
Table 1 Through Silicon Vias (TSVs) 3D IC’s Market, by Region 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Through Silicon Vias (TSVs) 3D IC’s Market, by Region 2016-2022 (USD Million) …………..4