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The Global 3D IC’s market, by component statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by component (Through silicon vias (TSVs), Through glass vias (TGVs)) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
Through glass vias is an emerging trend in 3D integrated circuit market as it carries good optical and mechanical characteristics as a substrate thereby is a prominent solution to replace TSV for high frequency 3D integration applications.
Through Glass Vias (TGVs) and is expected to grow with 14% CAGR during forecast period 2016-2022
FIGURE 1 THROUGH GLASS VIAS (TGVS) 3D IC’S MARKET, BY REGION, 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Through Glass Vias (TGVs) 3D IC’s Market, by Region, 2016-2022 (USD Million)
2. Through Glass Vias (TGVs) 3D IC’s Market, by Region Market Data
List of Tables
Table 1 Through Glass Vias (TGVs) 3D IC’s Market, by Region 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Through Glass Vias (TGVs) 3D IC’s Market, by Region 2016-2022 (USD Million) …………..4