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The Global 3D IC’s market, by technology type statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by technology type (3D stacked IC’s, Monolithic 3D IC’s) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
Dissipation of heat due to shrinking of circuit through silicon vias (TSVs) is one of the major disadvantage of stacked ICs which has been marked the demand for integrated circuits which can give results without relying on TSVs. Monolithic 3D ICs are built on a single semiconductor wafer which is further diced into 3D ICs. It is mount on only one substrate thereby not required aligning, thinning, bonding, or through silicon vias (TSVs).
Monolithic 3D IC’s market is expected to grow with 20% CAGR during forecast period 2016-2022
FIGURE 1 MONOLITHIC 3D IC’S MARKET, 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Monolithic 3D IC’s Market, by Region, 2016-2022 (USD Million)
2. Monolithic 3D IC’s Market, by Region Market Data
List of Tables
Table 1 Monolithic 3D IC’s Market, by Region 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Monolithic 3D IC’s Market, by Region 2016-2022 (USD Million) …………..4