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The Global 3D IC’s market, by technology type statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by technology type (3D stacked IC’s, Monolithic 3D IC’s) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and low power consumption to fulfill electronic device requirements. These vertically stacked ICs are known by term 3D ICs. 3D ICs can further classified into 3D stacked ICs and monolithic 3D ICs.
Global 3D IC’s market, by technology type has dominated by 3D stacked IC’s and is expected to grow with 16% CAGR during forecast period 2016-2022
FIGURE 1 GLOBAL 3D IC’S MARKET, BY TECHNOLOGY TYPE 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Global 3D IC’s Market, by Technology Type, 2016-2022 (USD Million)
2. Global 3D IC’s Market, by Technology Type Market Data
List of Tables
Table 1 Global 3D IC’s Market, by Technology Type 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Global 3D IC’s Market, by Technology Type 2016-2022 (USD Million) …………..4