Access to all Exclusive Statistical Reports in PDF!
The Global 3D IC’s market, by component statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by component (Through silicon vias (TSVs), Through glass vias (TGVs)) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
In this research report, MRFR has segmented 3D IC component into two sub-segments namely through silicon vias (TSVs), and through glass vias (TGVs). The purpose of through-via through material like Silicon or glass, is to establish an electrical connection between two different electrical layers. A basic through via has a simple design composed of a substrate, a conductive material and insulator which is used to separate the core form the substrate.
Global 3D IC’s market by component has dominated by Through Silicon Vias (TSVs) and is expected to grow with 19% CAGR during forecast period 2016-2022
FIGURE 1 GLOBAL 3D IC’S MARKET, BY COMPONENT, 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Global 3D IC’s Market, by Component, 2016-2022 (USD Million)
2. Global 3D IC’s Market, by Component Market Data
List of Tables
Table 1 Global 3D IC’s Market, by Component 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Global 3D IC’s Market, by Component 2016-2022 (USD Million) …………..4