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The Asia-Pacific 3D IC’s market, by product statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by product (CMOS image sensors (CIS), 3D memory, MEMS & Sensors, Light Emitting Diodes (LEDs)) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
With growing advancement in semiconductor industry, the demand for advanced image sensors is also increasing. The growing trend of scaled down pixel sizes in order to increase spatial resolution is the major factor behind deployment of 3D integration services in CMOS image sensors.
Asia-Pacific 3D IC’s market, by product has dominated by CMOS image sensors and is expected to grow with 14% CAGR during forecast period 2016-2022
FIGURE 1 ASIA-PACIFIC 3D IC’S MARKET, BY PRODUCT 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Asia-Pacific 3D IC’s Market, by Product, 2016-2022 (USD Million)
2. Asia-Pacific 3D IC’s Market, by Product Market Data
List of Tables
Table 1 Asia-Pacific 3D IC’s Market, by Product 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Asia-Pacific 3D IC’s Market, by Product 2016-2022 (USD Million) …………..4