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The Asia-Pacific 3D IC’s market, by Application statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by Application (IT/Telecommunication, Consumer Electronics, Industrial, Aerospace & Defence, Automotive, Medical) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic Application driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
Consumer electronics is the growing sector in Asia-Pacific region as with growing technology advancement, the major key players in consumer electronics are investing in the regional market. Also, the fastest growing electronic system design manufacturing in India is expected to drive the 3D IC’s market in the region.
Asia-Pacific 3D IC’s market, by Application has dominated by IT/Telecommunication sector and is expected to grow with 9% CAGR during forecast period 2016-2022
FIGURE 1 ASIA-PACIFIC 3D IC’S MARKET, BY APPLICATION 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Asia-Pacific 3D IC’s Market, by End-User, 2016-2022 (USD Million)
2. Asia-Pacific 3D IC’s Market, by End-User Market Data
List of Tables
Table 1 Asia-Pacific 3D IC’s Market, by End-User 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Asia-Pacific 3D IC’s Market, by End-User 2016-2022 (USD Million) …………..4