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The Asia-Pacific 3D IC’s market, by component statistical report, published by Market Research Future contains succinct information on the 3D IC’s market, segmented by component (Through silicon vias (TSVs), Through glass vias (TGVs)) and forecast from 2016-2022. The factors driving the 3D IC’s market are Increasing demand for advanced electronic product driving semiconductor industry to innovate packaging technology, and high demand for 3D packaging using TSVs.
Asia-Pacific has huge market of electronics and chip manufacturing. China is the leading the market in chip manufacturing, and also in producing 3D IC’s. Thereby it is expected that the market of TSVs and TGVs would grow in Asia-Pacific market in coming future.
Asia-Pacific 3D IC’s market, by component has dominated by Through Silicon vias (TSVs) and is expected to grow with 19% CAGR during forecast period 2016-2022
FIGURE 1 ASIA-PACIFIC 3D IC’S MARKET, BY COMPONENT 2016- 2022 (USD MILLION)
Table of Contents
1. Info graphics Information
1.1 Asia-Pacific 3D IC’s Market, by Component, 2016-2022 (USD Million)
2. Asia-Pacific 3D IC’s Market, by Component Market Data
List of Tables
Table 1 Asia-Pacific 3D IC’s Market, by Component 2016-2022 (USD Million) ………..4
List of Figures
Figure 1 Asia-Pacific 3D IC’s Market, by Component 2016-2022 (USD Million) …………..4